JPS578175A - Multilayer interconnection structure for crossover and manufacture thereof - Google Patents

Multilayer interconnection structure for crossover and manufacture thereof

Info

Publication number
JPS578175A
JPS578175A JP8319580A JP8319580A JPS578175A JP S578175 A JPS578175 A JP S578175A JP 8319580 A JP8319580 A JP 8319580A JP 8319580 A JP8319580 A JP 8319580A JP S578175 A JPS578175 A JP S578175A
Authority
JP
Japan
Prior art keywords
layer
thin film
conductive
several
multilayer interconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8319580A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0147036B2 (enrdf_load_stackoverflow
Inventor
Mikio Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8319580A priority Critical patent/JPS578175A/ja
Publication of JPS578175A publication Critical patent/JPS578175A/ja
Publication of JPH0147036B2 publication Critical patent/JPH0147036B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electronic Switches (AREA)
JP8319580A 1980-06-19 1980-06-19 Multilayer interconnection structure for crossover and manufacture thereof Granted JPS578175A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8319580A JPS578175A (en) 1980-06-19 1980-06-19 Multilayer interconnection structure for crossover and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8319580A JPS578175A (en) 1980-06-19 1980-06-19 Multilayer interconnection structure for crossover and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS578175A true JPS578175A (en) 1982-01-16
JPH0147036B2 JPH0147036B2 (enrdf_load_stackoverflow) 1989-10-12

Family

ID=13795542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8319580A Granted JPS578175A (en) 1980-06-19 1980-06-19 Multilayer interconnection structure for crossover and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS578175A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4854936A (en) * 1986-07-29 1989-08-08 Tdk Corporation Semiconductive ceramic composition and semiconductive ceramic capacitor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5053863A (enrdf_load_stackoverflow) * 1973-09-12 1975-05-13
JPS5422576A (en) * 1977-07-21 1979-02-20 Nippon Electric Co Method of manufacturing substrate for integrated circuit
JPS5456163A (en) * 1977-10-11 1979-05-04 Fujitsu Ltd Preparation of ceramic multilayer circuit substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5053863A (enrdf_load_stackoverflow) * 1973-09-12 1975-05-13
JPS5422576A (en) * 1977-07-21 1979-02-20 Nippon Electric Co Method of manufacturing substrate for integrated circuit
JPS5456163A (en) * 1977-10-11 1979-05-04 Fujitsu Ltd Preparation of ceramic multilayer circuit substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4854936A (en) * 1986-07-29 1989-08-08 Tdk Corporation Semiconductive ceramic composition and semiconductive ceramic capacitor

Also Published As

Publication number Publication date
JPH0147036B2 (enrdf_load_stackoverflow) 1989-10-12

Similar Documents

Publication Publication Date Title
JPS58209133A (ja) 電気接続方法及びそれを利用する個人カ−ド
KR850002682A (ko) 세라믹 다층기판 및 그 제조방법
US4788524A (en) Thick film material system
KR870007645A (ko) 기판상의 전기회로 형성방법
US4796356A (en) Process for making close tolerance thick film resistors
US3324362A (en) Electrical components formed by thin metallic form on solid substrates
JPS578175A (en) Multilayer interconnection structure for crossover and manufacture thereof
JPS5771160A (en) Manufacture of thick film printed circuit substrate
JPS55154451A (en) Production of substrate for gas sensor
US4894258A (en) Chip resistor
JPS57129764A (en) Preparation of multilayer wiring for crossover
JPS6484690A (en) Printed wiring board and the production thereof
JPS57118660A (en) Manufacture of thick film hybrid integrated circuit
JPS598373Y2 (ja) プリント配線板
JP2798566B2 (ja) 回路基板の製造方法
JP2001102151A (ja) 積層型ヒータの端子接続構造、その接続方法およびそれに用いるロウ付け材
JPH0316220Y2 (enrdf_load_stackoverflow)
JPS5773959A (en) Manufacture of thick film hybrid integrated circuit board
JPS55111152A (en) Method of manufacturing multilayer thin film circuit board
JPS5570056A (en) Preparation of thick film hybrid integrated circuit
JPS6459953A (en) Manufacture of compound integrated circuit
JPS56157053A (en) Manufacture of thick film hybrid ic plate
JPS6448492A (en) Manufacture of flexible printed wiring board
JPS6045095A (ja) 厚膜多層基板の製造方法
JPS60109258A (ja) 炭化珪素配線板