JPS5776185A - Sputtering device - Google Patents

Sputtering device

Info

Publication number
JPS5776185A
JPS5776185A JP15138880A JP15138880A JPS5776185A JP S5776185 A JPS5776185 A JP S5776185A JP 15138880 A JP15138880 A JP 15138880A JP 15138880 A JP15138880 A JP 15138880A JP S5776185 A JPS5776185 A JP S5776185A
Authority
JP
Japan
Prior art keywords
target
frontal side
magnetic poles
magnetic
magnetic field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15138880A
Other languages
Japanese (ja)
Other versions
JPS5917193B2 (en
Inventor
Hisaharu Obinata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Nihon Shinku Gijutsu KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc, Nihon Shinku Gijutsu KK filed Critical Ulvac Inc
Priority to JP15138880A priority Critical patent/JPS5917193B2/en
Publication of JPS5776185A publication Critical patent/JPS5776185A/en
Publication of JPS5917193B2 publication Critical patent/JPS5917193B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields

Abstract

PURPOSE:To permit the application of even magnetic target in sputtering operation by a method in which a pair of magnetic poles having mutually opposite polarities are provided in facing manner on both outsides, and a target whose V-shaped frontal side has an erosion region with the action of magnetic field is interposed between the magnetic poles. CONSTITUTION:A pair of magnetic poles 8 having different polarities are provided in facing manner on both outsides of the inside of a vacuum treatment chamber 1, and a target 5 with a V-shaped frontal side is interposed between the magnetic poles 8. When causing glow discharge on the frontal side of the target 5, electrons are confined in a magnetic field 9 inside a space between both half portions of negative potential on the frontal side of the target and make a reciprocating movement between both half portions, whereby promoting the ionization of gas. Also, each portion of the frontal side of the target 5 is entirely surrounded by the magnetic field 9 to become an erosion region 10 over nearly all area.
JP15138880A 1980-10-30 1980-10-30 sputtering equipment Expired JPS5917193B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15138880A JPS5917193B2 (en) 1980-10-30 1980-10-30 sputtering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15138880A JPS5917193B2 (en) 1980-10-30 1980-10-30 sputtering equipment

Publications (2)

Publication Number Publication Date
JPS5776185A true JPS5776185A (en) 1982-05-13
JPS5917193B2 JPS5917193B2 (en) 1984-04-19

Family

ID=15517486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15138880A Expired JPS5917193B2 (en) 1980-10-30 1980-10-30 sputtering equipment

Country Status (1)

Country Link
JP (1) JPS5917193B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5861461U (en) * 1981-10-19 1983-04-25 富士通株式会社 sputtering equipment
JPS58130277A (en) * 1982-01-27 1983-08-03 Clarion Co Ltd Magnetron spattering device
JPS59229480A (en) * 1983-06-10 1984-12-22 Nippon Telegr & Teleph Corp <Ntt> Sputtering device
JPH05102036A (en) * 1991-10-11 1993-04-23 Applied Materials Japan Kk Sputtering system

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59115014U (en) * 1983-01-25 1984-08-03 理研軽金属工業株式会社 expansion joint

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5861461U (en) * 1981-10-19 1983-04-25 富士通株式会社 sputtering equipment
JPS58130277A (en) * 1982-01-27 1983-08-03 Clarion Co Ltd Magnetron spattering device
JPS59229480A (en) * 1983-06-10 1984-12-22 Nippon Telegr & Teleph Corp <Ntt> Sputtering device
JPS6361387B2 (en) * 1983-06-10 1988-11-29
JPH05102036A (en) * 1991-10-11 1993-04-23 Applied Materials Japan Kk Sputtering system

Also Published As

Publication number Publication date
JPS5917193B2 (en) 1984-04-19

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