JPS5771159A - Heterogeneous electroplating method for circuit substrate - Google Patents
Heterogeneous electroplating method for circuit substrateInfo
- Publication number
- JPS5771159A JPS5771159A JP14630180A JP14630180A JPS5771159A JP S5771159 A JPS5771159 A JP S5771159A JP 14630180 A JP14630180 A JP 14630180A JP 14630180 A JP14630180 A JP 14630180A JP S5771159 A JPS5771159 A JP S5771159A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- device hole
- region
- circuit substrate
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14630180A JPS5771159A (en) | 1980-10-21 | 1980-10-21 | Heterogeneous electroplating method for circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14630180A JPS5771159A (en) | 1980-10-21 | 1980-10-21 | Heterogeneous electroplating method for circuit substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5771159A true JPS5771159A (en) | 1982-05-01 |
| JPS6252947B2 JPS6252947B2 (enrdf_load_stackoverflow) | 1987-11-07 |
Family
ID=15404578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14630180A Granted JPS5771159A (en) | 1980-10-21 | 1980-10-21 | Heterogeneous electroplating method for circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5771159A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63500837A (ja) * | 1985-08-08 | 1988-03-24 | マツクダ−ミツド インコ−ポレ−テツド | プリント回路基板の製造方法 |
-
1980
- 1980-10-21 JP JP14630180A patent/JPS5771159A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63500837A (ja) * | 1985-08-08 | 1988-03-24 | マツクダ−ミツド インコ−ポレ−テツド | プリント回路基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6252947B2 (enrdf_load_stackoverflow) | 1987-11-07 |
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