JPS57152138A - Bonding method of ic - Google Patents

Bonding method of ic

Info

Publication number
JPS57152138A
JPS57152138A JP56036059A JP3605981A JPS57152138A JP S57152138 A JPS57152138 A JP S57152138A JP 56036059 A JP56036059 A JP 56036059A JP 3605981 A JP3605981 A JP 3605981A JP S57152138 A JPS57152138 A JP S57152138A
Authority
JP
Japan
Prior art keywords
tin plating
adhered
finger
bonding tool
face side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56036059A
Other languages
Japanese (ja)
Inventor
Yoshihiro Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Holdings Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Holdings Co Ltd
Priority to JP56036059A priority Critical patent/JPS57152138A/en
Publication of JPS57152138A publication Critical patent/JPS57152138A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

PURPOSE:To obtain a method to enable to perform stable bonding of an IC by a method wherein adhesion of tin plating to the contacting face sides with a bonding tool of fingers for connection of IC is prevented. CONSTITUTION:At the section A-A of the circuit substrate figure, a solder resist 8 prevents adhesion of the tin plating layer 5 to the upper face of the finger 4a by masked plating. Namely, the circuit substrate 1 (consisting of a polyimide film 2 and the finger 4a) excluding the part to be plated is closed up tightly by an upper mask 15 to be adhered to an upper case body 13 and a lower mask 14 to be adhered to a lower case 12, tin plating liquid comes in contact only with the lower face side of the finger 4a, the upper face side, namely the contacting face side with the bonding tool 10, is not adhered with tin plating, and accordingly to rap the bonding tool 10 frequently stopping a bonder is also unnecessitated.
JP56036059A 1981-03-13 1981-03-13 Bonding method of ic Pending JPS57152138A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56036059A JPS57152138A (en) 1981-03-13 1981-03-13 Bonding method of ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56036059A JPS57152138A (en) 1981-03-13 1981-03-13 Bonding method of ic

Publications (1)

Publication Number Publication Date
JPS57152138A true JPS57152138A (en) 1982-09-20

Family

ID=12459142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56036059A Pending JPS57152138A (en) 1981-03-13 1981-03-13 Bonding method of ic

Country Status (1)

Country Link
JP (1) JPS57152138A (en)

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