JPS6465801A - Resistance element - Google Patents
Resistance elementInfo
- Publication number
- JPS6465801A JPS6465801A JP62222719A JP22271987A JPS6465801A JP S6465801 A JPS6465801 A JP S6465801A JP 62222719 A JP62222719 A JP 62222719A JP 22271987 A JP22271987 A JP 22271987A JP S6465801 A JPS6465801 A JP S6465801A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- layer
- resistance film
- resistance
- bondability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Adjustable Resistors (AREA)
- Details Of Resistors (AREA)
Abstract
PURPOSE:To improve both bondability and solderability, to strengthen the close adhesiveness using Ti and Pd and to facilitate an etching treatment by a method wherein a resistance film is formed on an insulated substrate, and a three-layer laminated electrode consisting of the first layer of Ti, the second layer of Pd and the third layer of Au is formed on said resistance film. CONSTITUTION:A resistance film 2 is formed on an insulated substrate 1, and a laminated electrode of three-layer structure consisting of the first, the second and the third layers formed on said resistance film 2. A Ti electrode is formed as the first layer 3, a Pd electrode is formed as the second layer 4, and an Au electrode is formed as the third layer 5. Selective etching is conducted on the Ti electrode 3 and the Pd electrode 4 using a resistance pattern by conducting a resistance process and an etching process on the surface of the Au electrode 5 of the third layer 5 using a photoresist. At this time, the close contacting property between the resistance film 2 and the Pd electrode 4 can be improved by the Ti electrode 3, and the bondability and the solderability of the Au electrode 5 can also be improved using the Pd electrode 4 as a barrier.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62222719A JPS6465801A (en) | 1987-09-04 | 1987-09-04 | Resistance element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62222719A JPS6465801A (en) | 1987-09-04 | 1987-09-04 | Resistance element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6465801A true JPS6465801A (en) | 1989-03-13 |
Family
ID=16786835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62222719A Pending JPS6465801A (en) | 1987-09-04 | 1987-09-04 | Resistance element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6465801A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01289201A (en) * | 1988-05-17 | 1989-11-21 | Matsushita Electric Ind Co Ltd | Chip resistor and manufacture thereof |
-
1987
- 1987-09-04 JP JP62222719A patent/JPS6465801A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01289201A (en) * | 1988-05-17 | 1989-11-21 | Matsushita Electric Ind Co Ltd | Chip resistor and manufacture thereof |
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