JPS6482603A - Method of sticking cover to electronic component - Google Patents

Method of sticking cover to electronic component

Info

Publication number
JPS6482603A
JPS6482603A JP62241308A JP24130887A JPS6482603A JP S6482603 A JPS6482603 A JP S6482603A JP 62241308 A JP62241308 A JP 62241308A JP 24130887 A JP24130887 A JP 24130887A JP S6482603 A JPS6482603 A JP S6482603A
Authority
JP
Japan
Prior art keywords
tape
support
cover
slits
covers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62241308A
Other languages
Japanese (ja)
Inventor
Osamu Tanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP62241308A priority Critical patent/JPS6482603A/en
Publication of JPS6482603A publication Critical patent/JPS6482603A/en
Pending legal-status Critical Current

Links

Landscapes

  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Packages (AREA)

Abstract

PURPOSE:To improve positional accuracy in bonding covers to electronic components, by forming slits in carrier and support tapes with a cover tape interposed between them, and then peeling off the support and cover tapes with covers left on the carrier tape. CONSTITUTION:An adhesive layer 5 is applied and dried on the lower face of a carrier tape 2 while an adhesive layer 6 is applied and dried on the lower face of a cover tape 3. Slits 8 are formed from the top face of the carrier tape 2 by means of a cutting tooth form. Extent of descending the cutting tooth form is adjusted such that it passes through the carrier tape 2 and cover tape 3 and penetrates into a support tape 4 a little. A series of covers are then reversed so that the support tape 4 is on the top side. Slits 9 are formed from the top of the support tape 4 by means of the cutting tooth form in a similar manner to the slits 8. The ends 3' of the support tape 4 and cover tape 3 are pulled down to peel them off. Electronic components 12 are raised up to the level of the covers 10 and pressed against the adhesive layers 11 so that they are bonded together.
JP62241308A 1987-09-25 1987-09-25 Method of sticking cover to electronic component Pending JPS6482603A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62241308A JPS6482603A (en) 1987-09-25 1987-09-25 Method of sticking cover to electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62241308A JPS6482603A (en) 1987-09-25 1987-09-25 Method of sticking cover to electronic component

Publications (1)

Publication Number Publication Date
JPS6482603A true JPS6482603A (en) 1989-03-28

Family

ID=17072352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62241308A Pending JPS6482603A (en) 1987-09-25 1987-09-25 Method of sticking cover to electronic component

Country Status (1)

Country Link
JP (1) JPS6482603A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0314414A (en) * 1989-06-01 1991-01-23 Hitachi Ltd Packaging device
JP2018028916A (en) * 2016-04-11 2018-02-22 株式会社村田製作所 Carrier tape, method for manufacturing the same, and method for manufacturing rfid tag

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0314414A (en) * 1989-06-01 1991-01-23 Hitachi Ltd Packaging device
JP2018028916A (en) * 2016-04-11 2018-02-22 株式会社村田製作所 Carrier tape, method for manufacturing the same, and method for manufacturing rfid tag

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