JPS6482603A - Method of sticking cover to electronic component - Google Patents
Method of sticking cover to electronic componentInfo
- Publication number
- JPS6482603A JPS6482603A JP62241308A JP24130887A JPS6482603A JP S6482603 A JPS6482603 A JP S6482603A JP 62241308 A JP62241308 A JP 62241308A JP 24130887 A JP24130887 A JP 24130887A JP S6482603 A JPS6482603 A JP S6482603A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- support
- cover
- slits
- covers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Packages (AREA)
Abstract
PURPOSE:To improve positional accuracy in bonding covers to electronic components, by forming slits in carrier and support tapes with a cover tape interposed between them, and then peeling off the support and cover tapes with covers left on the carrier tape. CONSTITUTION:An adhesive layer 5 is applied and dried on the lower face of a carrier tape 2 while an adhesive layer 6 is applied and dried on the lower face of a cover tape 3. Slits 8 are formed from the top face of the carrier tape 2 by means of a cutting tooth form. Extent of descending the cutting tooth form is adjusted such that it passes through the carrier tape 2 and cover tape 3 and penetrates into a support tape 4 a little. A series of covers are then reversed so that the support tape 4 is on the top side. Slits 9 are formed from the top of the support tape 4 by means of the cutting tooth form in a similar manner to the slits 8. The ends 3' of the support tape 4 and cover tape 3 are pulled down to peel them off. Electronic components 12 are raised up to the level of the covers 10 and pressed against the adhesive layers 11 so that they are bonded together.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62241308A JPS6482603A (en) | 1987-09-25 | 1987-09-25 | Method of sticking cover to electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62241308A JPS6482603A (en) | 1987-09-25 | 1987-09-25 | Method of sticking cover to electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6482603A true JPS6482603A (en) | 1989-03-28 |
Family
ID=17072352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62241308A Pending JPS6482603A (en) | 1987-09-25 | 1987-09-25 | Method of sticking cover to electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6482603A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0314414A (en) * | 1989-06-01 | 1991-01-23 | Hitachi Ltd | Packaging device |
JP2018028916A (en) * | 2016-04-11 | 2018-02-22 | 株式会社村田製作所 | Carrier tape, method for manufacturing the same, and method for manufacturing rfid tag |
-
1987
- 1987-09-25 JP JP62241308A patent/JPS6482603A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0314414A (en) * | 1989-06-01 | 1991-01-23 | Hitachi Ltd | Packaging device |
JP2018028916A (en) * | 2016-04-11 | 2018-02-22 | 株式会社村田製作所 | Carrier tape, method for manufacturing the same, and method for manufacturing rfid tag |
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