JPH0314414A - Packaging device - Google Patents

Abstract

PURPOSE:To perform packaging work with a high speed and in a large quantity and also increase the success ratio by a method wherein a carrier tape main body, which is covered with its opening facing down, and a shifting guide are turned over, and objects to be packaged in the shifting guide are shifted in respective cavities on the carrier tape main body. CONSTITUTION:For a tape guide 30, the openings of cavities 7 of a carrier tape main body 5 are set to be facing down, and for a shifting guide 32, a storage groove 33 is set to be facing up. When turned over 180 deg. by a turning over device, a group of SOP.IC1 in the storage groove 33 on the shifting guide 32 are turned over with their outer leads facing down, and the carrier tape main body 5 in a guide groove 31 on the tape guide 30 is turned over with openings on a carrier tape 7 to be facing up. A reciprocating motion is given to the shifting guide 32 along the longitudinal direction, and SOP.IC1 in the storage groove 33 on the shifting guide 32 are moved under a reciprocating motion to respective cavities 7, therefore, respective SOP.IC1 drops in respective cavities 7 which confront with SOP.IC1 in an appropriate posture. Then, a cover tape covers the openings of the cavities 7.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to packaging technology, particularly technology for packaging small-sized articles such as electronic components, etc. For example, in the manufacturing process of semiconductor devices, small outline Semiconductor integrated circuit device equipped with a bankage (hereinafter referred to as SOP-1c)
Or simply called Ic. ) Concerning effective techniques that can be used for packaging.

[Conventional technology]

In the manufacturing process of semiconductor devices, the packaging equipment is used to pack SOPs, tCs, etc., and holds the SO PIc to be packed by vacuum suction and transfers it to a predetermined location on the carrier tape wood body. The 6 SOP-ICs that are shaped into the main body are dropped into the main body, and then the SOP-ICs housed in the two hearts are glued onto the carrier tape main body, making it easy to package. There is something that has been done.

An example of such a packaging technique is JP-A-62-249444.

[Problem to be solved by the invention]

In such packaging equipment, S is attached to the main body of the carrier tube.
When storing OP/IC, SOP. The IC is suctioned and held by a vacuum suction head and sent to the carrier tape body, and then the suction and holding is released.
The inventor of the present invention has discovered that the following problems arise because the structure is such that C is inserted into the cavity. (1) Because time is wasted in transportation, the number of packages per unit time is small. (2) Holding the vacuum suction, and when releasing it, holding the vacuum suction and SOP-IC. The structure is complicated because it is difficult to align the SOP-IC and the cavity.
6 (3) SOP/I when holding vacuum suction and releasing it
Since C is tilted or rotated, the storage success rate is low. An object of the present invention is to provide a packaging device that can process large quantities at high speed and increase the success rate.

The objects and novel features of the invention and its features will be apparent from the description herein and the accompanying drawings.

[Means to solve the problem]

An overview of typical inventions disclosed in this application is as follows.

That is, the carrier tape body includes a carrier tape body in which a plurality of cavities for storing objects to be packaged are arranged next to each other, and a carrier tape that is attached to the main surface of the carrier tape body on the cavity opening side. A packaging device that uses a carrier tape for packaging includes a tape guide that guides the carrier tape body with one opening of the cavity facing downward, and a tape guide that is arranged to face the tape guide from below. , a transfer guide for arranging and accommodating a plurality of items to be packaged next to each other; a reversing device for reversing the tape guide and the transfer guide while facing each other; and, after reversing, the tape guide and a moving device that relatively moves the multi-conversion guide in parallel.

[Operation] On the group of items to be packaged that are aligned next to each other on the transfer guide,
After the carrier tape wooden body is covered with the opening part of the cavity facing f, when the carrier tape body and transfer guide are turned over, the packaged items in the transfer guide are placed in the carrier tape body. transferred into each cavity. Therefore, a large amount of items to be packaged can be accommodated in each cavity of the carrier tape body at once without using vacuum suction holding and release operations, increasing the number of items processed per unit time. can be done. In addition, since transfer and positioning using vacuum suction and holding are not used, the structure is simple and the storage efficiency is high. [Embodiment 1] Fig. 1 is a partially omitted partially cutaway side view showing a packaging device which is an embodiment of the present invention, and Fig. 2 is a partially omitted partially cutaway side view for explaining its operation. Figures 3, 4, 5 and 6 are side sectional views of each enlarged part, Figures 7 and 8 are front sectional views of each enlarged part, and Figure 9 is used therefor. Kiya. FIG. 10 is a perspective view showing the rear tape, and FIG. 10 is a perspective view showing the SOP-IC. In this practical example, the packaging apparatus according to the present invention is configured to pack a semiconductor integrated circuit device (SOP-1c) equipped with a small outline package using a carrier tape. SO as a packaged item
The p-+ct is equipped with a resin-sealed panocage 2 formed in the shape of a rectangular flat plate, and a plurality of outer leads 3 are protruded from two long sides of the package 2, and the lower end is connected to the package. They are arranged so that they slightly protrude from the lower surface of the ``, and are bent downward into a gull-wing shape. This carrier tape 4 includes a carrier tape body and a cover tape. The carrier tape body 5 is made of resin such as polyvinyl chloride, polystyrene, etc.
For example, the thickness may be reduced to 0.05 mm by a suitable means such as calender roll molding or the like. Approximately 2wm, dimensions are SOP-ICI
It is formed into a tape shape with a constant width larger than the width of the . In particular, although not limited to this, when storing an IC, static electricity such as frictional static electricity becomes an obstacle. Therefore, in order to prevent the occurrence of trouble due to static electricity, it is desirable to use a material in which carbon powder is kneaded into the carrier tape main body 5.

Small holes 6 are arranged regularly in the longitudinal direction on both end sides of the carrier tape main body 5 and are opened so as to penetrate in the thickness direction. It is constructed so that it can engage with the feed pawl in the device. A large number of cavities 7 for accommodating SAP-TCT are arranged in the widthwise central part of the carrier tape main body 5 in a single column in the longitudinal direction with narrow width connections i9118 in between. It is buried. Each cavity 7 is an SOP-
A rectangular hole with a constant depth is formed by expanding and retracting a part of the carrier tape body 5 in one thickness direction so that the ICL can be accommodated with a suitable margin. Further, the arrangement interval (pinch) in the longitudinal direction of the cavity 7 group is set to L so that it is constant over the entire wipe. On both sides of the cavity 7 on the main surface of the carrier tape main body 5 on the frontage side of the cavity 7, joining margins 9 for joining the cover tape are virtually formed. On the other hand, the Kahar tape 10 is formed into a tape shape whose width is narrower than the width of the carrier tape main body 5 by the amount of the small holes 6, and can be easily bonded by thermocompression to the carrier tape main body 5 using polypropylene or the like as a base material. The material is integrally formed by a method such as calender roll molding. This cover tape 10 has a thickness of 60~
It is set to about 70 μm. In this embodiment, the packaging device 20 according to the present invention is equipped with a carrier tape body feeding device 2l, and this feeding device includes an empty reel 22 for feeding out an empty carrier tape body, and
It is equipped with a real reel 23 for winding up the real carrier tape containing the sap-tcL. Carrier tape body 5
is stretched between both reels 22 and 23 by several sprockets 24, and the plurality of sprockets 24 are engaged with feed holes 6 formed in the carrier tape body 5. Further, a feeding sprocket 25 is engaged with the feeding hole 6 of the carrier tape main body 5.
5, the carrier tape main body 5 is fed from the empty reel 22 to the real reel 23. Further, this packaging device 20 is equipped with a Cacher tape feeding device 26, and this feeding device 26 is equipped with a cover tape reel 27 for feeding out the cover tape 10. The cover tape 10 fed out from the reel 27 is moved by a plurality of guide rollers 28 to the main surface (hereinafter referred to as the surface) on the frontage side of the cavity 7 of the carrier tape main body 5 at the downstream end position of a transfer guide to be described later. They are strung together so that they overlap. A thermocompression bonding hem 29 for adhering the caht tape 10 to the carrier tape 5 is disposed downstream of the position where the caht tape 10 starts to overlap the carrier tape main body 5, and this hend 29 is used to attach the cachtape 10 to the carrier tape body 5. By heating the tape body 5 and the Caher tape 1O while sandwiching them from above and below, both 5 and 10 are heated.
A tape guide 30 is suspended in the center of the carrier tape main body feeding device 21, and this tape guide 30 surrounds the back side of the carrier tape main body 5. tl is used to guide it in the longitudinal direction. That is, the tape guide 30 has a length that can cover a plurality of cavities 7 of the carrier tape main body 5, and a guide groove 3t is recessed over the entire length in the main surface on the side that guides the carrier tape main body 5. The inner shape of the guide groove 31 is shaped to be approximately equal to the outer shape when the cavity 7 of the carrier tape main body 5 is sectioned. This tape guide 3
A transfer guide 32 is disposed on the side of the guide groove 3l of 0 so as to face the guide it431 with the carrier tape wooden body 5 in between, and is installed parallel to the tape guy}'30. is purchased so that it can accommodate a plurality of SOP-1cIs as items to be packaged. That is, the transfer guy I'32 has the same length as the tape guide 30, and the main surface facing the tape guide 30 has an SO
A P/tCt accommodation groove 33 is recessed over the entire length. This accommodation groove 33 accommodates a plurality of SOP ICt outer leads 3 on the tape guide 30 side in a Ii1 digit pattern.
Moreover, it is formed so that it can be slid and guided along the sliding surface. {The downstream end of the accommodation groove 33 of the multi-conversion guide 32 is closed by a stopper portion 34.

This transfer guide 32 is moved by a transfer/assistance device 35 which is removed from a suitable actuator such as a cylinder device, etc.
It is arranged to be moved back and forth in the longitudinal force direction with respect to the tape guide 30, and the amount of movement is set to be smaller than the SOP-ICI.

A supply guide 36 is aligned and butted with the accommodation groove 33 at the upstream end of the transfer guide 32, and this supply guide 36 aligns the direction of the SOP-1cI and inserts it into the guide accommodation groove 33.
It is configured to supply The supply guide 36 is supported so as to be movable and reversible relative to the transfer guide 32, and is configured to be driven forward and backward by a suitable drive device (not shown) such as a cylinder device.

Further, the tape guide 30 and the transfer guide 1'' 32 are configured to be turned over 80 degrees by means of a reversing device (not shown) while remaining centered with each other. , each component is installed in a frame, and this frame includes a tape guide 30 and a transfer guide 32.
Ti 11 is rotatably supported by support shafts disposed on both extension lines in the longitudinal direction of the mating surfaces, and is rotated 180 degrees reciprocatingly by an appropriate drive device.
2 has been done. Next, the effect will be explained.

First, the tape guide 30 is rotated by the reversing device so that the opening of the cavity 7 in the carrier tape body 5 faces downward, and the transfer guide 32 is rotated so that the accommodation groove 33 faces upward. In this state, as shown in FIG.
6 is butted from the tag supply guide 36 as an object to be packaged.
A plurality of P-ICs 1 are arranged in a line next to each other and are supplied to the accommodation groove 33 of the multi-conversion guide 32 with the outer leads 3 facing upward. At this time, as shown in FIG. 3, the SOP/IcI groups supplied to the storage area 33 of the transfer guide 32 are aligned in a line with adjacent ends without the outer leads 3 abutted against each other. state.

On the other hand, as shown in Figure 3l2I and Figure 7,
The carrier tape main body 5 guided by the guide groove 31 of the tape guide 30 opens the opening of each cavity 7 in the SOP.
- Confronted by ICI group. At this time, since a small connecting portion 8 is formed between the adjacent cavities 7, 7, there is a pinch between the adjacent cavities 7, 7, and a pinch between the adjacent butted SOP/ICI, 1. , it is in a state where it is shifted by the amount of connection part 8. Therefore, depending on each dimensional condition, the guide groove 3 of the tape guide 30 may
A case may occur in which the number of SOP/IcI groups in the accommodation groove 33 of the transfer guide 32 is greater than the number of Cavity E7 groups in the transfer guide 32. In this way, when the cavity 7 group of the carrier tape main body 5 and the so p/tCt group are opposed, the tape guide 30 and the transfer guide 32 are in the middle as shown in FIG. While still aligned, they are flipped 180 degrees using a flipping device. At this time, the Uj supply guide 36 is moved backward to interfere with the carrier tape main body 5 which is being reversed. When reversed, the 8th
As shown in the imaginary line in the figure and in FIG. The opening of the carrier tape 7 of the tape body 5 faces upward. As a result, migration guide 3
Each SOP/tCt in the accommodation groove 33 of No. 2 tries to fall into each of the opposing cavities 7 due to its own weight. However, at this time, the pitch of the SOP-1cL group and the pitch of the cavity-7 group are deviated, so as shown in Figure 5, the SOP-ICI is 1.
Do not fall into each cavity 7 in an appropriate posture. Therefore, the transfer guide 32 is reciprocated in the longitudinal direction.
As a result, as shown in FIG.
7, each SOP/ICI falls into each opposing cavity 7 in a normal posture. Here, once one SOP/ICI is accommodated in each cavity 7, no more SOP/ICI will fall into the cavity 7. Next, the carrier tape main body 5 is wound in the direction of the actual reel 23 by the feeding sprocket 25. At this time, as shown in FIGS. 6 and 8, since the openings of the cavities 7 of the carrier tape main body 5 face upward, each sop accommodated in each cavity 7 -tc1 will not fall out from inside cavity 7. At the point where the cavity 7 passes the downstream end of the tape guide 30, a cover tape 10 is placed on the carrier tape body 5 so as to cover the opening of the cavity 7. Then, it is thermocompressed by the adhesive 29. As a result, joint portions 1l are formed in the joint margin portions 9 on both sides of the cavity 7 of the carrier tape body 5, respectively.

The carrier tape main body 5 whose cavity 7 is closed by the Cacher tape 10 is fed by the feeding sprocket 25 and wound onto the actual reel 23. On the other hand, when all the cavities 7 containing sop-tct are closed with the cover tape 10, the tape guide 3
0 and the transfer guide 32 are turned 180 degrees while being centered and returned to their original states. At this time,
The sop-tc1 accommodated in each cavity 7 of the carrier tape main body 5 cannot fall out from inside the cavity 7 because the opening of the cavity 7 is closed by the Cacher tape LO joined to the carrier tape main body 5. No. Subsequently, the supply guide 36 is brought into contact with the upstream end of the transfer guide 33, and the SOP/ICI group is supplied from the supply guide 36 to the storage space 33 of the transfer guide 32. At this time, S.O.
The P/ICI groups are arranged so that the outer leads 3 face the tape guide 30, and are guided by the multi-conversion guide 32, so that adjacent ones have both end sides without the outer leads 3 butted against each other. and are arranged in a line.

Thereafter, by repeating the above operation, SOP・
tCt is packed by carrier table 14. According to the above embodiment, the following effects can be obtained. (1) The vacuum suction hem
Since each broken package can be transferred to each cavity without using a , can increase the packing precept rate.

(2) By making the cavity of the carrier tape body and the object to be packaged face each other vertically using the tape guide and transfer guide arranged to face each other, the tape guide and the J3 16 guide can be aligned in the middle. By inverting the packaged items in the same state, each item to be packed can be transferred to each cavity, making it possible to transfer multiple items at once. It can be further improved. (3) In (2) above, by relatively reciprocating the transfer guide and the carrier tape body, the positions of each torn package and each cavity that are shifted from each other can be relatively corrected. Therefore, each object to be packed can be reliably accommodated in each cavity, regardless of the difference in pinpoint between the object to be packed and the cavity.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor. For example, the reversing device is not limited to horizontally reversing the tape guide and transfer guide 180 degrees to prevent the carrier tape main body from tearing, but is also configured to reverse the carrier tape main body so that it is gently twisted. You may.

Place the transfer guide against the carrier tape body.
The device for reciprocating the carrier tape is not limited to being configured to move the transfer guide side, but may also be configured to reciprocate the carrier tape main body side, or may be configured to reciprocate only in the longitudinal direction. The configuration is not limited to this, but it may also be configured to reciprocate vertically and/or horizontally. The point is that this reciprocating motion helps ensure that each packaged item is accommodated in each cavity.
All you have to do is give up.

[Example 2] Figure 11 shows the length of Example 2 of the present invention. FIG. 12 is a partially cut-away side view showing the packaging device, FIG. 12 is a mostly side sectional view for explaining its operation, and FIG. 13 is an enlarged front sectional view.

Embodiment 2 differs from Embodiment L in that a transfer device is provided instead of the reversing device, and each carrier 7L attached to the −1 carrier tape main body 5 of the carrier table 14 is A retaining means is provided for retaining at least one medical and IVA package.

That is, each cavity 7 of the carrier tape main body 5 is coated with an adhesive layer 12 as a holding means so that the package 2 of SOP/Ic1 can be adhered to the surface facing the opening of the cavity 7. and 1 {negative guide 32
A phono sawyer 40 is installed as a negative device. This buno sawyer 40 is fixedly supported by the cylinder vt position 4i installed upwardly in the direction F of the transfer guide 32 and the upper end of the piston rond of this cylinder device 4l, and is mounted on the bottom wall of the f dust guide 32. A bunon yuronod 42 is inserted from below into the opened insertion hole 43 so as to be freely movable forward and backward.

Next, the effect will be explained. First, Tape Guy I! 30, the opening of the cavity 7 in the carrier tape body 5 is set so as to face downward, and the holly step guide 32 is set so that the accommodation groove 33 faces upward. In this state, as shown in FIG. 11, the supply guide 36 is butted against the upstream end of the transfer guy 1-32, and the S O [
)・The ICIs are arranged in a line next to each other and are supplied to the storage space 33 of the +++A guide 32 with the outer lead 3 facing upward. At this time, the 11th
As shown in the figure, the receiving groove 33 of the transfer guide 32
The SOP/ICI groups supplied to the SOP/ICI group are aligned in a line with adjacent ends without the outer leads 3 being butted against each other.

On the other hand, as shown in Figures 12 and 13,
The carrier tape main body 5 guided by the guide groove 31 of the tape guide 30 opens the opening of each cavity 7 in the SOP.
- Faced with ICI group. In this way, when the cavity 7 group of the carrier tape main body 5 and the SOP/ICI group are opposed, the 1211i! As shown in FIGS. 1 and 13, the tape force id 30 and the multi-converting force id 32 are left in the middle, and the Punnoyah 40
is activated, and the punyuro knot 42 is raised. Due to this raised Puncherondo 42, sop-tc1
is lifted into the cavity 7 from the accommodation groove 33 of the l conversion guide 32. The lifted SOP/ICI is held by being adhered to the adhesive IJl2 applied to the inner bottom surface of the cavity 7.

Next, the carrier tape main body 5 is wound in the direction of the actual reel 23 by the feeding subroken 25. At this time, as shown in FIGS. 12 and 13, S
Since the OP/[C1 is adhesively held in the cavity 7 by the adhesive layer 12, each SOP/ICI accommodated in each cavity 7 will not fall out from within the cavity 7. Cavity 7 connects the downstream end of tape guide 3o to iI1
At the point a, a cover tape 10 is placed on the top of the carrier tape main body 5 so as to cover the opening of the cavity 7, and the cover tape 10 is bonded by thermocompression using the adhesive 29. As a result, joint portions 11 are formed in the joint margin portions 9 on both sides of the cavity 7 of the carrier tape body 5, respectively.

The carrier tape main body 5, the cavity 7 of which is closed by the cover tape 1o, is fed by the feeding subroket 25 and wound onto the reel 23. Thereafter, by changing the operation, SO. P
-ICI is packed with carrier tape 4. Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. do not have. For example, holding means for holding wave-packed items in a cavity facing downward may include not only a structure in which an adhesive layer is formed on the inner bottom surface of the cavity, but also a structure in which an adhesive layer is formed on the bottom surface of the cavity.
The configuration shown in FIG. 4, the collection shown in No. 15121, etc. may be used.

In FIG. 14, at least a pair of protrusions 13 and L3 are respectively provided on the side wall of the cavity 7 and protrude inward in the radial direction.
The OP-ICI is held between both sides by the protrusions l3 and 13.

In the 1511i1, the housing groove 3 of the tape guide 30
A magnet 14 is placed in the cavity 7 so as to face the bottom wall of the cavity 7. The outer lead 3 is attracted and held by the magnetic force of the magnet 14 across the bottom wall of the cavity 7.

In addition, the means for transferring the packaged items from within the transfer guide into the downward C. SOP-[
A device configured to suction and lift the CL may also be used. In the above explanation, we have mainly explained the case where the invention made by the present inventor is applied to the field of application which is the background of the invention, SOP/[C's packaging technique f + i, but it is not limited to this.・Electronic components and equipment such as ICs equipped with iris nodes and mini-molded transistors,
Furthermore, it can be applied to all packaging techniques for other small articles.

〔Effect of the invention〕

A brief explanation of the effects achieved by typical inventions disclosed in this application is as follows.

By placing the cavity of the carrier tape body and the object to be packaged vertically facing each other using the tape guide and the multi-conversion guide arranged opposite to each other, each can be vacuum-adsorbed without using a vacuum cleaner. Since the objects to be packed can be transferred to each cavity, it is possible to shorten the packing time for each object to be packed, simplify the structure of the device, and increase the packing success rate. ．．

[Brief explanation of the drawing]

Fig. 1 is a partially cut-away side view with some parts omitted showing a packaging device which is an embodiment of the present invention; Figures 4, 5 and 6 are side sectional views of each enlarged part, Figures 7 and 8 are front sectional views of each enlarged part, and Figure 9 shows the carrier tape used therein. Perspective view, Figure tO is a perspective view showing an SOP/IC which is an object to be packaged. 11 (21 is a partially omitted partially cutaway side view showing the packaging device according to the second embodiment of the present invention, FIG. 12 is an enlarged partial side sectional view for explaining its operation, and FIG. 13 is also enlarged FIG. 14 is an enlarged partial side sectional view showing a modified example of the holding means; FIG. 15 is an enlarged partial side sectional view showing another modified example; FIG. It is a sectional view of most part of lJL plane If showing a modified example. 1 = - semiconductor integrated circuit gL position (SOP Ic), 2.
...Pano cage, 3...Aucreed, 4...Carrier tape, 5...Carrier tape body, 6...Small hole, 7...Cavity, 8...Connection part, 9...Joining allowance Part, 0...Cover tape, ■Le...Joint part, I2...
... Adhesive layer (holding means), 13... Protrusion (holding means), ]4... Magnet (holding means), l5... Suction port,
2o...Packing device, 2J...Carrier tape body feeding device, 22...Empty reel, 23...Actual reel, 24
...Sprocket, 25...Subroganoto for feeding,
26... Cacher table feeding device, 27... Cacher table reel, 2nd... jf 4 }-0-ra, 29
...Heat pressure bonding, 3o...tape guide, 3l...
... Guide groove, 32 ... Transfer guide, 33 ... Accommodation groove, 34 ... Sumper part, 35 ... Reciprocating device,
36... Supply guide, 4o... Punonoyar 41...
・Cylinder device, 42...-Bunoshronodo, 43...
・Through hole. Figure 7

Claims (3)

[Claims] 1. A carrier comprising a carrier tape main body formed by a plurality of cavities arranged next to each other for storing objects to be packed, and a cover tape applied to the main surface of the carrier tape main body on the cavity opening side. A packaging device for packaging using tape, comprising: a tape guide for guiding the carrier tape body with the opening of the cavity facing downward; and a tape guide disposed to face the tape guide from below; a transfer guide for arranging and accommodating a plurality of items to be packaged next to each other; a reversing device for reversing the tape guide and the transfer guide while facing each other; and after reversing, the tape guide and the transfer guide A packaging device comprising: a moving device that relatively moves in parallel. 2. A carrier comprising a carrier tape main body formed by a plurality of cavities arranged next to each other for storing objects to be packed, and a cover tape applied to the main surface of the carrier tape main body on the cavity opening side. A packaging device for packaging using tape, comprising: a tape guide for guiding the carrier tape body with the opening of the cavity facing downward; and a tape guide disposed to face the tape guide from below; A transfer guide for arranging and accommodating a plurality of the objects to be packed next to each other, and a transfer for transferring the objects to be packed in the transfer guide into each cavity of the carrier tape main body guided by the tape guide. 1. A packaging device comprising: a device; and a holding means attached to a carrier tape body to hold each object to be packed transferred to each cavity. 3. The holding means may include an adhesive layer attached to the bottom of the cavity so as to adhere the object to be packed, a protrusion protruding from the inside of the cavity to hold the object to be packed, or a carrier. 3. The packaging device according to claim 2, further comprising a magnet provided inside or outside the tape body so as to magnetically attach the object to be packed in the cavity.