JPS5766658A - Resin sealed semiconductor device - Google Patents

Resin sealed semiconductor device

Info

Publication number
JPS5766658A
JPS5766658A JP14270980A JP14270980A JPS5766658A JP S5766658 A JPS5766658 A JP S5766658A JP 14270980 A JP14270980 A JP 14270980A JP 14270980 A JP14270980 A JP 14270980A JP S5766658 A JPS5766658 A JP S5766658A
Authority
JP
Japan
Prior art keywords
resin
resistance
semiconductor device
sealed semiconductor
resin sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14270980A
Other languages
Japanese (ja)
Inventor
Koji Suzuki
Toshio Aoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14270980A priority Critical patent/JPS5766658A/en
Publication of JPS5766658A publication Critical patent/JPS5766658A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/0802—Resistors only

Abstract

PURPOSE:To lessen the deformation due to resin seal, by a method wherein the direction of the resistance element formed in a rectangular semiconductor element is set so as to have an inclination of approximately 45 degrees with respect to one side of a square package made of resin to be used for molding. CONSTITUTION:A rectangular semiconductor element 11 is formed into a given semiconductor circuit by integrating resistance elements 12, 13 and the like, the element 11 being sealed with a square package 15 made of an insulative resin by means of molding. Setting the mountig angle theta of the element 11 with respect to one side of the package 15 so as to be approximately 45 degrees permits the change in resistance of the elements 12, 13 due to deformation to be made smaller.
JP14270980A 1980-10-13 1980-10-13 Resin sealed semiconductor device Pending JPS5766658A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14270980A JPS5766658A (en) 1980-10-13 1980-10-13 Resin sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14270980A JPS5766658A (en) 1980-10-13 1980-10-13 Resin sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS5766658A true JPS5766658A (en) 1982-04-22

Family

ID=15321737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14270980A Pending JPS5766658A (en) 1980-10-13 1980-10-13 Resin sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5766658A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01123489A (en) * 1987-11-06 1989-05-16 Matsushita Electron Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01123489A (en) * 1987-11-06 1989-05-16 Matsushita Electron Corp Semiconductor device

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