JPS52156563A - Resin sealing method of semiconductor device - Google Patents

Resin sealing method of semiconductor device

Info

Publication number
JPS52156563A
JPS52156563A JP7344176A JP7344176A JPS52156563A JP S52156563 A JPS52156563 A JP S52156563A JP 7344176 A JP7344176 A JP 7344176A JP 7344176 A JP7344176 A JP 7344176A JP S52156563 A JPS52156563 A JP S52156563A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
resin sealing
sealing method
melted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7344176A
Other languages
Japanese (ja)
Inventor
Koichi Hirata
Toshio Kasuga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7344176A priority Critical patent/JPS52156563A/en
Publication of JPS52156563A publication Critical patent/JPS52156563A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To reduce costs without using any liquid resin and sealing apparatus by holding level the face of a strip-form base such as lead strips connected with semiconductor element, placing lump-form resin thereon, then heating the resin so as to be melted and cover the sealing portions and allowing the resin to set naturally.
COPYRIGHT: (C)1977,JPO&Japio
JP7344176A 1976-06-22 1976-06-22 Resin sealing method of semiconductor device Pending JPS52156563A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7344176A JPS52156563A (en) 1976-06-22 1976-06-22 Resin sealing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7344176A JPS52156563A (en) 1976-06-22 1976-06-22 Resin sealing method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS52156563A true JPS52156563A (en) 1977-12-27

Family

ID=13518320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7344176A Pending JPS52156563A (en) 1976-06-22 1976-06-22 Resin sealing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS52156563A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5493369U (en) * 1977-12-15 1979-07-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5493369U (en) * 1977-12-15 1979-07-02

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