JPS5762550A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5762550A JPS5762550A JP13747180A JP13747180A JPS5762550A JP S5762550 A JPS5762550 A JP S5762550A JP 13747180 A JP13747180 A JP 13747180A JP 13747180 A JP13747180 A JP 13747180A JP S5762550 A JPS5762550 A JP S5762550A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- connection
- electrode
- substrate
- plastically deformed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- 239000008188 pellet Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13747180A JPS5762550A (en) | 1980-10-01 | 1980-10-01 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13747180A JPS5762550A (en) | 1980-10-01 | 1980-10-01 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5762550A true JPS5762550A (en) | 1982-04-15 |
JPS6122461B2 JPS6122461B2 (enrdf_load_stackoverflow) | 1986-05-31 |
Family
ID=15199376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13747180A Granted JPS5762550A (en) | 1980-10-01 | 1980-10-01 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5762550A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61102040U (enrdf_load_stackoverflow) * | 1984-12-10 | 1986-06-28 | ||
JPH01104031U (enrdf_load_stackoverflow) * | 1987-12-25 | 1989-07-13 | ||
JPH02119153A (ja) * | 1988-06-01 | 1990-05-07 | Hewlett Packard Co <Hp> | 集積回路用ボンディング方法 |
-
1980
- 1980-10-01 JP JP13747180A patent/JPS5762550A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61102040U (enrdf_load_stackoverflow) * | 1984-12-10 | 1986-06-28 | ||
JPH01104031U (enrdf_load_stackoverflow) * | 1987-12-25 | 1989-07-13 | ||
JPH02119153A (ja) * | 1988-06-01 | 1990-05-07 | Hewlett Packard Co <Hp> | 集積回路用ボンディング方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6122461B2 (enrdf_load_stackoverflow) | 1986-05-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB1492015A (en) | Integrated circuit devices | |
GB1109806A (en) | Improvements in the interconnection of electrical circuit devices | |
JPS56137665A (en) | Semiconductor device | |
JPS5779652A (en) | Resin-sealed semiconductor device | |
JPS5762550A (en) | Semiconductor device | |
EP0026788A4 (en) | SEMICONDUCTOR DEVICE. | |
GB1161656A (en) | Simplified Stacked Semiconductor Device | |
JPS5271177A (en) | Semiconductor device | |
JPS5721847A (en) | Semiconductor device | |
JPS5772336A (en) | Semiconductor device | |
JPS5785244A (en) | Semiconductor device | |
JPS56100436A (en) | Manufacture of semiconductor element | |
JPS55140238A (en) | Tape carrier type semiconductor device | |
JPS57112039A (en) | Manufacture of semiconductor device | |
JPS5623768A (en) | Semiconductor device | |
JPS5483768A (en) | Semiconductor device | |
JPS57154863A (en) | Manufacture of resin sealing type electronic parts | |
JPS54114975A (en) | Semiconductor device | |
MY106858A (en) | Resin sealing type semiconductor device in which a very small semiconductor chip is sealed in package with resin. | |
IE32531B1 (en) | Improvements in and relating to contact bonding and lead attachment of an electrical device | |
JPS6461029A (en) | Formation of bump electrode bond | |
JPS57120352A (en) | Semiconductor device | |
JPS57118661A (en) | Integrated circuit for noise prevention | |
JPS5635451A (en) | Semiconductor device | |
GB1017423A (en) | Improvements in semiconductor devices |