JPS5762536A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5762536A
JPS5762536A JP55137469A JP13746980A JPS5762536A JP S5762536 A JPS5762536 A JP S5762536A JP 55137469 A JP55137469 A JP 55137469A JP 13746980 A JP13746980 A JP 13746980A JP S5762536 A JPS5762536 A JP S5762536A
Authority
JP
Japan
Prior art keywords
insulating film
protecting
reliability
cut
separated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55137469A
Other languages
Japanese (ja)
Inventor
Masahide Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55137469A priority Critical patent/JPS5762536A/en
Publication of JPS5762536A publication Critical patent/JPS5762536A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the damp resisting property, and to ameliorate reliability by a method wherein a semiconductor element is cut and separated into several element, an edge section of an insulating film for protecting the elements is partially heated by laser beams, and a crack formed at the time of division is recrystallized and removed. CONSTITUTION:The insulating film 1 for protecting the semiconductor element severally cut and separated is dissolved partially by locally heating ghe edge sections 2 of the insulating film 1 by using laser beams, and the cracks 3 can be removed. Accordingly, the damp resisting property is improved, and reliability can be ameliorated.
JP55137469A 1980-10-01 1980-10-01 Manufacture of semiconductor device Pending JPS5762536A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55137469A JPS5762536A (en) 1980-10-01 1980-10-01 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55137469A JPS5762536A (en) 1980-10-01 1980-10-01 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5762536A true JPS5762536A (en) 1982-04-15

Family

ID=15199326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55137469A Pending JPS5762536A (en) 1980-10-01 1980-10-01 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5762536A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4825480A (en) * 1971-08-04 1973-04-03
JPS50118672A (en) * 1974-03-01 1975-09-17
JPS5354477A (en) * 1976-10-28 1978-05-17 Seiko Epson Corp Production of semiconductor device
JPS53123657A (en) * 1977-04-04 1978-10-28 Nec Corp Production of semiconductor unit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4825480A (en) * 1971-08-04 1973-04-03
JPS50118672A (en) * 1974-03-01 1975-09-17
JPS5354477A (en) * 1976-10-28 1978-05-17 Seiko Epson Corp Production of semiconductor device
JPS53123657A (en) * 1977-04-04 1978-10-28 Nec Corp Production of semiconductor unit

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