JPS53139976A - Packaging method of semiconductor chips - Google Patents

Packaging method of semiconductor chips

Info

Publication number
JPS53139976A
JPS53139976A JP5519977A JP5519977A JPS53139976A JP S53139976 A JPS53139976 A JP S53139976A JP 5519977 A JP5519977 A JP 5519977A JP 5519977 A JP5519977 A JP 5519977A JP S53139976 A JPS53139976 A JP S53139976A
Authority
JP
Japan
Prior art keywords
semiconductor chips
packaging method
handling
bending
surrounding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5519977A
Other languages
Japanese (ja)
Other versions
JPS6016102B2 (en
Inventor
Satoshi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP5519977A priority Critical patent/JPS6016102B2/en
Publication of JPS53139976A publication Critical patent/JPS53139976A/en
Publication of JPS6016102B2 publication Critical patent/JPS6016102B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To prevent failure and bending by handling by forming metal foils in a both-end supported beam type from the surrounding of the hole of an insulation tape toward the inner side.
COPYRIGHT: (C)1978,JPO&Japio
JP5519977A 1977-05-13 1977-05-13 Semiconductor chip mounting structure Expired JPS6016102B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5519977A JPS6016102B2 (en) 1977-05-13 1977-05-13 Semiconductor chip mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5519977A JPS6016102B2 (en) 1977-05-13 1977-05-13 Semiconductor chip mounting structure

Publications (2)

Publication Number Publication Date
JPS53139976A true JPS53139976A (en) 1978-12-06
JPS6016102B2 JPS6016102B2 (en) 1985-04-23

Family

ID=12992003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5519977A Expired JPS6016102B2 (en) 1977-05-13 1977-05-13 Semiconductor chip mounting structure

Country Status (1)

Country Link
JP (1) JPS6016102B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56133861A (en) * 1980-03-24 1981-10-20 Hitachi Ltd Film carrier
JPS57184226A (en) * 1981-05-08 1982-11-12 Nec Corp Semiconductor device
JPS5927538A (en) * 1982-08-05 1984-02-14 Ricoh Co Ltd Arranging method for ic pad
JPS61195056U (en) * 1985-05-25 1986-12-04
JPH09326414A (en) * 1996-06-06 1997-12-16 Nec Corp Tape-carrier-package type semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07120478B2 (en) * 1989-12-01 1995-12-20 ニッタン株式会社 Scattered light smoke detector

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56133861A (en) * 1980-03-24 1981-10-20 Hitachi Ltd Film carrier
JPS57184226A (en) * 1981-05-08 1982-11-12 Nec Corp Semiconductor device
JPS5927538A (en) * 1982-08-05 1984-02-14 Ricoh Co Ltd Arranging method for ic pad
JPS61195056U (en) * 1985-05-25 1986-12-04
JPH09326414A (en) * 1996-06-06 1997-12-16 Nec Corp Tape-carrier-package type semiconductor device

Also Published As

Publication number Publication date
JPS6016102B2 (en) 1985-04-23

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