JPS5748287A - Multi-factor semiconductor element - Google Patents
Multi-factor semiconductor elementInfo
- Publication number
- JPS5748287A JPS5748287A JP12364980A JP12364980A JPS5748287A JP S5748287 A JPS5748287 A JP S5748287A JP 12364980 A JP12364980 A JP 12364980A JP 12364980 A JP12364980 A JP 12364980A JP S5748287 A JPS5748287 A JP S5748287A
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- film
- built
- attached
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
PURPOSE:To obtain a device of high reliability by a method wherein an insulating film built on a region except an electrode connecting region is constructed using a laminated structure which consists of an oxide film of a semiconductor and an insulating film which is attached from outside. CONSTITUTION:An insulating film 5 built on a regin except an electrode 6, 7 is built using a laminated structure which consists of an oxide film 11 of a semiconductor and an insulating film 12 which is attached from outside. For example after a buffer layer 2, an active layer 3 and a top layer 4 is built on a PbTe substrae 1 mesa etching is applied. Next after an anodized oxide film 11 is formed an insulating film 12 consisting of MgF2 is attached. Using a photo resist film as a mask the anodized oxide film 11 on a region on which an electrode film is to be attached and the insulating film 12 are etched. Electrode films 6, 7 are formed at the end of the process. By this arrangement a device of high reliability is obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12364980A JPS5748287A (en) | 1980-09-05 | 1980-09-05 | Multi-factor semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12364980A JPS5748287A (en) | 1980-09-05 | 1980-09-05 | Multi-factor semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5748287A true JPS5748287A (en) | 1982-03-19 |
Family
ID=14865819
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12364980A Pending JPS5748287A (en) | 1980-09-05 | 1980-09-05 | Multi-factor semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5748287A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60160622A (en) * | 1984-01-31 | 1985-08-22 | Fujitsu Ltd | Manufacture of semiconductor device |
-
1980
- 1980-09-05 JP JP12364980A patent/JPS5748287A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60160622A (en) * | 1984-01-31 | 1985-08-22 | Fujitsu Ltd | Manufacture of semiconductor device |
JPH0213467B2 (en) * | 1984-01-31 | 1990-04-04 | Fujitsu Ltd |
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