JPS5745254A - Automatic detector for amount of silicon wafer worked - Google Patents

Automatic detector for amount of silicon wafer worked

Info

Publication number
JPS5745254A
JPS5745254A JP55120965A JP12096580A JPS5745254A JP S5745254 A JPS5745254 A JP S5745254A JP 55120965 A JP55120965 A JP 55120965A JP 12096580 A JP12096580 A JP 12096580A JP S5745254 A JPS5745254 A JP S5745254A
Authority
JP
Japan
Prior art keywords
wafer
amount
silicon wafer
photosensor
slit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55120965A
Other languages
English (en)
Japanese (ja)
Other versions
JPS628017B2 (enrdf_load_stackoverflow
Inventor
Eiichi Tsukada
Fumikazu Ohira
Kiyoshi Sawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP55120965A priority Critical patent/JPS5745254A/ja
Publication of JPS5745254A publication Critical patent/JPS5745254A/ja
Publication of JPS628017B2 publication Critical patent/JPS628017B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP55120965A 1980-09-01 1980-09-01 Automatic detector for amount of silicon wafer worked Granted JPS5745254A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55120965A JPS5745254A (en) 1980-09-01 1980-09-01 Automatic detector for amount of silicon wafer worked

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55120965A JPS5745254A (en) 1980-09-01 1980-09-01 Automatic detector for amount of silicon wafer worked

Publications (2)

Publication Number Publication Date
JPS5745254A true JPS5745254A (en) 1982-03-15
JPS628017B2 JPS628017B2 (enrdf_load_stackoverflow) 1987-02-20

Family

ID=14799383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55120965A Granted JPS5745254A (en) 1980-09-01 1980-09-01 Automatic detector for amount of silicon wafer worked

Country Status (1)

Country Link
JP (1) JPS5745254A (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5975631A (ja) * 1982-10-14 1984-04-28 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション サブトラクト加工物処理によつて除去された層の厚さを測定する方法
JPS6052046A (ja) * 1983-06-27 1985-03-23 テレタイプ　コ−ポレ−シヨン 集積回路デバイスの製作方法
JPS6052047A (ja) * 1983-06-27 1985-03-23 テレタイプ　コ−ポレ−シヨン 集積回路デバイスの製作方法
JPS6052048A (ja) * 1983-06-27 1985-03-23 テレタイプ　コ−ポレ−シヨン 集積回路デバイスの製作方法
JPS60149133U (ja) * 1984-03-13 1985-10-03 日本真空技術株式会社 エツチングモニタ−
JPS6178137A (ja) * 1984-09-26 1986-04-21 Oki Electric Ind Co Ltd 半導体装置
JPS61241923A (ja) * 1985-04-19 1986-10-28 Hitachi Ltd ドライエッチング方法
JPH02257628A (ja) * 1989-03-30 1990-10-18 Kyushu Electron Metal Co Ltd 半導体基板の研磨方法及びその装置
US6225461B1 (en) 1997-12-17 2001-05-01 Rengo Co., Ltd. Cellulose microspheres and method of manufacturing the same
JP2019102550A (ja) * 2017-11-29 2019-06-24 トヨタ自動車株式会社 半導体基板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4941956A (enrdf_load_stackoverflow) * 1972-05-01 1974-04-19
JPS52125451U (enrdf_load_stackoverflow) * 1976-03-19 1977-09-24

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4941956A (enrdf_load_stackoverflow) * 1972-05-01 1974-04-19
JPS52125451U (enrdf_load_stackoverflow) * 1976-03-19 1977-09-24

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5975631A (ja) * 1982-10-14 1984-04-28 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション サブトラクト加工物処理によつて除去された層の厚さを測定する方法
JPS6052046A (ja) * 1983-06-27 1985-03-23 テレタイプ　コ−ポレ−シヨン 集積回路デバイスの製作方法
JPS6052047A (ja) * 1983-06-27 1985-03-23 テレタイプ　コ−ポレ−シヨン 集積回路デバイスの製作方法
JPS6052048A (ja) * 1983-06-27 1985-03-23 テレタイプ　コ−ポレ−シヨン 集積回路デバイスの製作方法
JPS60149133U (ja) * 1984-03-13 1985-10-03 日本真空技術株式会社 エツチングモニタ−
JPS6178137A (ja) * 1984-09-26 1986-04-21 Oki Electric Ind Co Ltd 半導体装置
JPS61241923A (ja) * 1985-04-19 1986-10-28 Hitachi Ltd ドライエッチング方法
JPH02257628A (ja) * 1989-03-30 1990-10-18 Kyushu Electron Metal Co Ltd 半導体基板の研磨方法及びその装置
US6225461B1 (en) 1997-12-17 2001-05-01 Rengo Co., Ltd. Cellulose microspheres and method of manufacturing the same
JP2019102550A (ja) * 2017-11-29 2019-06-24 トヨタ自動車株式会社 半導体基板の製造方法

Also Published As

Publication number Publication date
JPS628017B2 (enrdf_load_stackoverflow) 1987-02-20

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