JPS5741339A - Copper alloy for lead frame material of semiconductor element - Google Patents
Copper alloy for lead frame material of semiconductor elementInfo
- Publication number
- JPS5741339A JPS5741339A JP11608980A JP11608980A JPS5741339A JP S5741339 A JPS5741339 A JP S5741339A JP 11608980 A JP11608980 A JP 11608980A JP 11608980 A JP11608980 A JP 11608980A JP S5741339 A JPS5741339 A JP S5741339A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- semiconductor element
- lead frame
- frame material
- added
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 3
- 239000000463 material Substances 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 229910000521 B alloy Inorganic materials 0.000 abstract 3
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 238000002156 mixing Methods 0.000 abstract 1
- 239000006104 solid solution Substances 0.000 abstract 1
Landscapes
- Conductive Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11608980A JPS5741339A (en) | 1980-08-23 | 1980-08-23 | Copper alloy for lead frame material of semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11608980A JPS5741339A (en) | 1980-08-23 | 1980-08-23 | Copper alloy for lead frame material of semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5741339A true JPS5741339A (en) | 1982-03-08 |
| JPS639008B2 JPS639008B2 (enrdf_load_stackoverflow) | 1988-02-25 |
Family
ID=14678431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11608980A Granted JPS5741339A (en) | 1980-08-23 | 1980-08-23 | Copper alloy for lead frame material of semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5741339A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5004581A (en) * | 1989-07-31 | 1991-04-02 | Toyota Jidosha Kabushiki Kaisha | Dispersion strengthened copper-base alloy for overlay |
-
1980
- 1980-08-23 JP JP11608980A patent/JPS5741339A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5004581A (en) * | 1989-07-31 | 1991-04-02 | Toyota Jidosha Kabushiki Kaisha | Dispersion strengthened copper-base alloy for overlay |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS639008B2 (enrdf_load_stackoverflow) | 1988-02-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS572851A (en) | Copper alloy for lead material of semiconductor device | |
| JPS6425929A (en) | Copper alloy for electronic equipment | |
| JPS57181339A (en) | Electrical contact material of selectively and internally oxidized silver-tin alloy containing bismuth | |
| JPS572849A (en) | Copper alloy for electronic parts | |
| JPS57108235A (en) | Copper alloy for lead frame | |
| KR890016193A (ko) | 반도체 장치용 Cu합금제 리이드프레임재 | |
| JPS57187195A (en) | Silver solder material | |
| JPS5518505A (en) | Soldering alloy for attaching silver electrode leading wire | |
| JPS5741339A (en) | Copper alloy for lead frame material of semiconductor element | |
| JPS57116738A (en) | Copper alloy for lead material of semiconductor apparatus | |
| JPS5521530A (en) | High tensile copper alloy with superior heat resistance and conductivity | |
| JPS5760043A (en) | Electrically conductive copper alloy with corrosion and heat resistance | |
| JPS57169047A (en) | Copper alloy for lead material of semiconductor device | |
| JPS54103764A (en) | Brazing material | |
| JPS56139642A (en) | Phosphor copper solder | |
| JPS5785946A (en) | Copper alloy for lead frame of semiconductor element | |
| JPS52128825A (en) | Copper alloy for lead material | |
| JPS572850A (en) | Copper alloy for lead material of semiconductor device | |
| JPS57121896A (en) | Solder alloy | |
| JPS5541955A (en) | Copper alloy for connecting wire | |
| JPS5669341A (en) | High temperature solder | |
| JPS57152437A (en) | Low grade gold alloy | |
| JPS56123338A (en) | Electrical contact material | |
| JPS5690946A (en) | High strength copper alloy with high electric conductivity | |
| JPS56144893A (en) | Solder alloy for fitting lead on silver electrode |