JPS639008B2 - - Google Patents

Info

Publication number

JPS639008B2

JPS639008B2 JP11608980A JP11608980A JPS639008B2 JP S639008 B2 JPS639008 B2 JP S639008B2 JP 11608980 A JP11608980 A JP 11608980A JP 11608980 A JP11608980 A JP 11608980A JP S639008 B2 JPS639008 B2 JP S639008B2

Authority

JP

Japan

Prior art keywords

alloy

lead frame

nib

solderability

copper

Prior art date

1980-08-23

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000463 material Substances 0.000 claims description 19
• 229910045601 alloy Inorganic materials 0.000 claims description 15
• 239000000956 alloy Substances 0.000 claims description 15
• 239000010949 copper Substances 0.000 claims description 14
• 239000004065 semiconductor Substances 0.000 claims description 13
• 229910052698 phosphorus Inorganic materials 0.000 claims description 6
• 229910052796 boron Inorganic materials 0.000 claims description 5
• 229910052718 tin Inorganic materials 0.000 claims description 5
• 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
• 239000012535 impurity Substances 0.000 claims 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
• 229910052802 copper Inorganic materials 0.000 description 7
• 238000000034 method Methods 0.000 description 7
• 229910000679 solder Inorganic materials 0.000 description 7
• PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
• 230000003647 oxidation Effects 0.000 description 4
• 238000007254 oxidation reaction Methods 0.000 description 4
• OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
• 238000000137 annealing Methods 0.000 description 3
• 238000007598 dipping method Methods 0.000 description 3
• 238000010438 heat treatment Methods 0.000 description 3
• 229910000906 Bronze Inorganic materials 0.000 description 2
• XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
• 229910001297 Zn alloy Inorganic materials 0.000 description 2
• 239000000654 additive Substances 0.000 description 2
• 230000000996 additive effect Effects 0.000 description 2
• 239000010974 bronze Substances 0.000 description 2
• 238000005097 cold rolling Methods 0.000 description 2
• KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
• 229910000833 kovar Inorganic materials 0.000 description 2
• 238000004806 packaging method and process Methods 0.000 description 2
• 238000012858 packaging process Methods 0.000 description 2
• 239000008188 pellet Substances 0.000 description 2
• 239000004033 plastic Substances 0.000 description 2
• RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
• ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
• OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
• 229910017827 Cu—Fe Inorganic materials 0.000 description 1
• 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
• 229910005569 NiB Inorganic materials 0.000 description 1
• KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
• ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
• RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
• 239000010953 base metal Substances 0.000 description 1
• -1 bonding wires Substances 0.000 description 1
• 239000000919 ceramic Substances 0.000 description 1
• 230000000052 comparative effect Effects 0.000 description 1
• 230000002079 cooperative effect Effects 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 230000000875 corresponding effect Effects 0.000 description 1
• 230000006866 deterioration Effects 0.000 description 1
• 238000002845 discoloration Methods 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 230000004907 flux Effects 0.000 description 1
• 229910002804 graphite Inorganic materials 0.000 description 1
• 239000010439 graphite Substances 0.000 description 1
• 230000017525 heat dissipation Effects 0.000 description 1
• 229910052742 iron Inorganic materials 0.000 description 1
• 230000009916 joint effect Effects 0.000 description 1
• 229910052745 lead Inorganic materials 0.000 description 1
• 238000005259 measurement Methods 0.000 description 1
• 238000000691 measurement method Methods 0.000 description 1
• 238000002844 melting Methods 0.000 description 1
• 230000008018 melting Effects 0.000 description 1
• 239000000203 mixture Substances 0.000 description 1
• 229910052759 nickel Inorganic materials 0.000 description 1
• 239000011574 phosphorus Substances 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 239000002994 raw material Substances 0.000 description 1
• 229920002050 silicone resin Polymers 0.000 description 1
• 230000002195 synergetic effect Effects 0.000 description 1
• 238000010998 test method Methods 0.000 description 1
• KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1