JPS5733304A - Method and device for shape inspection - Google Patents
Method and device for shape inspectionInfo
- Publication number
- JPS5733304A JPS5733304A JP10719380A JP10719380A JPS5733304A JP S5733304 A JPS5733304 A JP S5733304A JP 10719380 A JP10719380 A JP 10719380A JP 10719380 A JP10719380 A JP 10719380A JP S5733304 A JPS5733304 A JP S5733304A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- light
- slit light
- accomplished
- stable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007689 inspection Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title 1
- 230000002950 deficient Effects 0.000 abstract 1
- 238000001514 detection method Methods 0.000 abstract 1
- 238000000605 extraction Methods 0.000 abstract 1
- 230000007246 mechanism Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/024—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of diode-array scanning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10719380A JPS5733304A (en) | 1980-08-06 | 1980-08-06 | Method and device for shape inspection |
US06/181,768 US4343553A (en) | 1979-09-03 | 1980-08-27 | Shape testing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10719380A JPS5733304A (en) | 1980-08-06 | 1980-08-06 | Method and device for shape inspection |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63325766A Division JPH01199102A (ja) | 1988-12-26 | 1988-12-26 | 立体形状検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5733304A true JPS5733304A (en) | 1982-02-23 |
JPS639602B2 JPS639602B2 (enrdf_load_stackoverflow) | 1988-03-01 |
Family
ID=14452825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10719380A Granted JPS5733304A (en) | 1979-09-03 | 1980-08-06 | Method and device for shape inspection |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5733304A (enrdf_load_stackoverflow) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60125547A (ja) * | 1983-12-09 | 1985-07-04 | Fujitsu Ltd | 検査装置 |
JPS61162705A (ja) * | 1985-01-14 | 1986-07-23 | Hitachi Zosen Corp | 立体計測方法 |
JPS61162706A (ja) * | 1985-01-14 | 1986-07-23 | Hitachi Zosen Corp | 立体計測方法 |
DE3540288A1 (de) * | 1985-06-21 | 1987-01-02 | Matsushita Electric Works Ltd | Anordnung und verfahren zur durchfuehrung von kontrollen an loetstellen |
JPS62138709A (ja) * | 1985-12-12 | 1987-06-22 | Ono Sokki Co Ltd | 変位の測定方法および装置 |
JPS62249005A (ja) * | 1986-04-22 | 1987-10-30 | Bridgestone Corp | 物体の形状異常検査装置 |
JPS6488686A (en) * | 1987-09-29 | 1989-04-03 | Fujitsu Ltd | Deficient parts inspecting device for packaged parts |
JPH02271209A (ja) * | 1989-04-13 | 1990-11-06 | Fuamosu:Kk | 三次元表面形状判別装置 |
JP2002107311A (ja) * | 2000-09-28 | 2002-04-10 | Mitsubishi Heavy Ind Ltd | 実装基板検査装置及び方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5530659A (en) * | 1978-08-25 | 1980-03-04 | Mitsubishi Electric Corp | Parts inspecting device for print substrate |
-
1980
- 1980-08-06 JP JP10719380A patent/JPS5733304A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5530659A (en) * | 1978-08-25 | 1980-03-04 | Mitsubishi Electric Corp | Parts inspecting device for print substrate |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60125547A (ja) * | 1983-12-09 | 1985-07-04 | Fujitsu Ltd | 検査装置 |
JPS61162705A (ja) * | 1985-01-14 | 1986-07-23 | Hitachi Zosen Corp | 立体計測方法 |
JPS61162706A (ja) * | 1985-01-14 | 1986-07-23 | Hitachi Zosen Corp | 立体計測方法 |
DE3540288A1 (de) * | 1985-06-21 | 1987-01-02 | Matsushita Electric Works Ltd | Anordnung und verfahren zur durchfuehrung von kontrollen an loetstellen |
JPS62138709A (ja) * | 1985-12-12 | 1987-06-22 | Ono Sokki Co Ltd | 変位の測定方法および装置 |
JPS62249005A (ja) * | 1986-04-22 | 1987-10-30 | Bridgestone Corp | 物体の形状異常検査装置 |
JPS6488686A (en) * | 1987-09-29 | 1989-04-03 | Fujitsu Ltd | Deficient parts inspecting device for packaged parts |
JPH02271209A (ja) * | 1989-04-13 | 1990-11-06 | Fuamosu:Kk | 三次元表面形状判別装置 |
JP2002107311A (ja) * | 2000-09-28 | 2002-04-10 | Mitsubishi Heavy Ind Ltd | 実装基板検査装置及び方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS639602B2 (enrdf_load_stackoverflow) | 1988-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY104394A (en) | Function inspecting system | |
JPS5733304A (en) | Method and device for shape inspection | |
JPS56168281A (en) | Control method for electronic apparatus | |
JPS54102837A (en) | Pattern check system | |
JPS56169481A (en) | Inspection signal analyzer in catv system | |
JPS6117310B2 (enrdf_load_stackoverflow) | ||
JPS642130A (en) | Electronic blackboard and electronic blackboard system | |
JPS5737743A (en) | Retrieving method of disk device | |
JP2610295B2 (ja) | 位置認識装置 | |
JPS6413406A (en) | Body recognition device | |
JPS6488900A (en) | Device for guiding airplane | |
JPS56161651A (en) | Malfunction analysing method of semiconductor element | |
JPS5542013A (en) | Automatic appearance test system | |
SU785803A1 (ru) | Телевизионное устройство дл автоматического контрол рисунка печатных плат | |
JPS6466546A (en) | Package inspection equipment | |
JPS6488207A (en) | Slit light type detection apparatus | |
JPS57112035A (en) | Position sensing system | |
JPS567429A (en) | Patterning device | |
DE3469670D1 (en) | Assembling components on a printed circuit board | |
JPH02148897A (ja) | 電子部品挿入装置 | |
DE59102038D1 (de) | Verfahren und schaltungsanordnung zur automatischen zeichenerkennung auf dokumenten. | |
JPS55135307A (en) | Signal extractor | |
JPS5951535A (ja) | パタ−ン認識方法及びその装置 | |
JPS6228880A (ja) | 物体認識方法およびその装置 | |
JPS6486090A (en) | Inspection method for existence of substance |