JPS5733304A - Method and device for shape inspection - Google Patents
Method and device for shape inspectionInfo
- Publication number
- JPS5733304A JPS5733304A JP10719380A JP10719380A JPS5733304A JP S5733304 A JPS5733304 A JP S5733304A JP 10719380 A JP10719380 A JP 10719380A JP 10719380 A JP10719380 A JP 10719380A JP S5733304 A JPS5733304 A JP S5733304A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- light
- slit light
- accomplished
- stable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007689 inspection Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title 1
- 230000002950 deficient Effects 0.000 abstract 1
- 238000001514 detection method Methods 0.000 abstract 1
- 238000000605 extraction Methods 0.000 abstract 1
- 230000007246 mechanism Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/024—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of diode-array scanning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10719380A JPS5733304A (en) | 1980-08-06 | 1980-08-06 | Method and device for shape inspection |
| US06/181,768 US4343553A (en) | 1979-09-03 | 1980-08-27 | Shape testing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10719380A JPS5733304A (en) | 1980-08-06 | 1980-08-06 | Method and device for shape inspection |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63325766A Division JPH01199102A (ja) | 1988-12-26 | 1988-12-26 | 立体形状検査装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5733304A true JPS5733304A (en) | 1982-02-23 |
| JPS639602B2 JPS639602B2 (enrdf_load_stackoverflow) | 1988-03-01 |
Family
ID=14452825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10719380A Granted JPS5733304A (en) | 1979-09-03 | 1980-08-06 | Method and device for shape inspection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5733304A (enrdf_load_stackoverflow) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60125547A (ja) * | 1983-12-09 | 1985-07-04 | Fujitsu Ltd | 検査装置 |
| JPS61162706A (ja) * | 1985-01-14 | 1986-07-23 | Hitachi Zosen Corp | 立体計測方法 |
| JPS61162705A (ja) * | 1985-01-14 | 1986-07-23 | Hitachi Zosen Corp | 立体計測方法 |
| DE3540288A1 (de) * | 1985-06-21 | 1987-01-02 | Matsushita Electric Works Ltd | Anordnung und verfahren zur durchfuehrung von kontrollen an loetstellen |
| JPS62138709A (ja) * | 1985-12-12 | 1987-06-22 | Ono Sokki Co Ltd | 変位の測定方法および装置 |
| JPS62249005A (ja) * | 1986-04-22 | 1987-10-30 | Bridgestone Corp | 物体の形状異常検査装置 |
| JPS6488686A (en) * | 1987-09-29 | 1989-04-03 | Fujitsu Ltd | Deficient parts inspecting device for packaged parts |
| JPH02271209A (ja) * | 1989-04-13 | 1990-11-06 | Fuamosu:Kk | 三次元表面形状判別装置 |
| JP2002107311A (ja) * | 2000-09-28 | 2002-04-10 | Mitsubishi Heavy Ind Ltd | 実装基板検査装置及び方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5530659A (en) * | 1978-08-25 | 1980-03-04 | Mitsubishi Electric Corp | Parts inspecting device for print substrate |
-
1980
- 1980-08-06 JP JP10719380A patent/JPS5733304A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5530659A (en) * | 1978-08-25 | 1980-03-04 | Mitsubishi Electric Corp | Parts inspecting device for print substrate |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60125547A (ja) * | 1983-12-09 | 1985-07-04 | Fujitsu Ltd | 検査装置 |
| JPS61162706A (ja) * | 1985-01-14 | 1986-07-23 | Hitachi Zosen Corp | 立体計測方法 |
| JPS61162705A (ja) * | 1985-01-14 | 1986-07-23 | Hitachi Zosen Corp | 立体計測方法 |
| DE3540288A1 (de) * | 1985-06-21 | 1987-01-02 | Matsushita Electric Works Ltd | Anordnung und verfahren zur durchfuehrung von kontrollen an loetstellen |
| JPS62138709A (ja) * | 1985-12-12 | 1987-06-22 | Ono Sokki Co Ltd | 変位の測定方法および装置 |
| JPS62249005A (ja) * | 1986-04-22 | 1987-10-30 | Bridgestone Corp | 物体の形状異常検査装置 |
| JPS6488686A (en) * | 1987-09-29 | 1989-04-03 | Fujitsu Ltd | Deficient parts inspecting device for packaged parts |
| JPH02271209A (ja) * | 1989-04-13 | 1990-11-06 | Fuamosu:Kk | 三次元表面形状判別装置 |
| JP2002107311A (ja) * | 2000-09-28 | 2002-04-10 | Mitsubishi Heavy Ind Ltd | 実装基板検査装置及び方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS639602B2 (enrdf_load_stackoverflow) | 1988-03-01 |
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