JPS57211255A - Manufacture of airtight terminal - Google Patents
Manufacture of airtight terminalInfo
- Publication number
- JPS57211255A JPS57211255A JP9707281A JP9707281A JPS57211255A JP S57211255 A JPS57211255 A JP S57211255A JP 9707281 A JP9707281 A JP 9707281A JP 9707281 A JP9707281 A JP 9707281A JP S57211255 A JPS57211255 A JP S57211255A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- plating
- outer ring
- electric
- cracks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 7
- 238000000034 method Methods 0.000 abstract 4
- 238000007747 plating Methods 0.000 abstract 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 239000010931 gold Substances 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 238000005452 bending Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9707281A JPS57211255A (en) | 1981-06-22 | 1981-06-22 | Manufacture of airtight terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9707281A JPS57211255A (en) | 1981-06-22 | 1981-06-22 | Manufacture of airtight terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57211255A true JPS57211255A (en) | 1982-12-25 |
| JPS6349902B2 JPS6349902B2 (enrdf_load_stackoverflow) | 1988-10-06 |
Family
ID=14182432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9707281A Granted JPS57211255A (en) | 1981-06-22 | 1981-06-22 | Manufacture of airtight terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57211255A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009545729A (ja) * | 2006-08-02 | 2009-12-24 | ハインリッヒ・ジッツマン | 温度センサの製造方法 |
| WO2015019863A1 (ja) * | 2013-08-09 | 2015-02-12 | 日立金属株式会社 | 熱式質量流量計及び質量流量制御装置 |
| KR20220069945A (ko) | 2019-09-30 | 2022-05-27 | 히타치 긴조쿠 가부시키가이샤 | 기밀 접속용 유닛, 기밀 접속용 어셈블리, 기밀 용기 및 기화기, 그리고 기밀 접속용 어셈블리의 제조 방법 |
-
1981
- 1981-06-22 JP JP9707281A patent/JPS57211255A/ja active Granted
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009545729A (ja) * | 2006-08-02 | 2009-12-24 | ハインリッヒ・ジッツマン | 温度センサの製造方法 |
| US8168258B2 (en) | 2006-08-02 | 2012-05-01 | Heinrich Zitzmann | Method of producing a temperature sensor |
| WO2015019863A1 (ja) * | 2013-08-09 | 2015-02-12 | 日立金属株式会社 | 熱式質量流量計及び質量流量制御装置 |
| JP2015034748A (ja) * | 2013-08-09 | 2015-02-19 | 日立金属株式会社 | 熱式質量流量計及び質量流量制御装置 |
| CN105452818A (zh) * | 2013-08-09 | 2016-03-30 | 日立金属株式会社 | 热式质量流量计和质量流量控制装置 |
| US10041823B2 (en) | 2013-08-09 | 2018-08-07 | Hitachi Metals, Ltd. | Thermal mass flow meter and mass flow controller |
| KR20220069945A (ko) | 2019-09-30 | 2022-05-27 | 히타치 긴조쿠 가부시키가이샤 | 기밀 접속용 유닛, 기밀 접속용 어셈블리, 기밀 용기 및 기화기, 그리고 기밀 접속용 어셈블리의 제조 방법 |
| US12349300B2 (en) | 2019-09-30 | 2025-07-01 | Kuwana Metals, Ltd. | Airtight connection unit, airtight connection assembly, airtight container and vaporizer, as well as production method of airtight connection assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6349902B2 (enrdf_load_stackoverflow) | 1988-10-06 |
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