JPS57211255A - Manufacture of airtight terminal - Google Patents
Manufacture of airtight terminalInfo
- Publication number
- JPS57211255A JPS57211255A JP9707281A JP9707281A JPS57211255A JP S57211255 A JPS57211255 A JP S57211255A JP 9707281 A JP9707281 A JP 9707281A JP 9707281 A JP9707281 A JP 9707281A JP S57211255 A JPS57211255 A JP S57211255A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- plating
- outer ring
- electric
- cracks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To easily form the base Ni plated layer as well as to prevent the occurence of cracks for the titled terminal by a method wherein electric Ni plating is performed on an outer metal ring and a lead wire having the linear expansion coefficient of 75X 10<-7>/ deg.C or below at the temperature of 450 deg.C or below, the lead wire is airtightly sealed in the outer metal ring through the intermediary of BSG, and then gold plating is performed. CONSTITUTION:Electric Ni plated layers 9 and 10 of 8mum or thereabouts are formed on the whole surface of the outer ring 4 made of the alloy of 58% of FE and 42% of Ni, and the lead wire 6 of 53% of FE, 28% of Ni and 18% of Co, a lead wire 6 is airtightly sealed in the outer ring 4 through the intermediary of the BSG5, and gold plated layers 11 and 12 of 2mum in thickness are formed on the surface of the outer ring 4 and a lead wire 6. According to this method, the electric Ni plated layers 9 and 10 can be formed without generation of bending on the lead wire and the cracks on the glass by performing simplicial barrel plating on the outer ring 4 and the lead wire 6 before the sealing is performed. Also, even when a heat treatment is performed in the after process as in the case wherein chemical Ni plating is performed, cracks due to the increased hardness are not generated. This method is effective for the materials having the linear expansion coefficient of 75X10<-7>/ deg.C or below at the temperature lower than 450 deg.C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9707281A JPS57211255A (en) | 1981-06-22 | 1981-06-22 | Manufacture of airtight terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9707281A JPS57211255A (en) | 1981-06-22 | 1981-06-22 | Manufacture of airtight terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57211255A true JPS57211255A (en) | 1982-12-25 |
| JPS6349902B2 JPS6349902B2 (en) | 1988-10-06 |
Family
ID=14182432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9707281A Granted JPS57211255A (en) | 1981-06-22 | 1981-06-22 | Manufacture of airtight terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57211255A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0266368A1 (en) * | 1986-04-21 | 1988-05-11 | Aegis, Inc. | Corrosion resistant pins for metal packaged microcircuits |
| JP2009545729A (en) * | 2006-08-02 | 2009-12-24 | ハインリッヒ・ジッツマン | Manufacturing method of temperature sensor |
| WO2015019863A1 (en) * | 2013-08-09 | 2015-02-12 | 日立金属株式会社 | Thermal mass flow meter and mass flow control device |
| KR20220069945A (en) | 2019-09-30 | 2022-05-27 | 히타치 긴조쿠 가부시키가이샤 | A unit for hermetic connection, an assembly for hermetic connection, a hermetic container and vaporizer, and a method for manufacturing an assembly for hermetic connection |
-
1981
- 1981-06-22 JP JP9707281A patent/JPS57211255A/en active Granted
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0266368A1 (en) * | 1986-04-21 | 1988-05-11 | Aegis, Inc. | Corrosion resistant pins for metal packaged microcircuits |
| JP2009545729A (en) * | 2006-08-02 | 2009-12-24 | ハインリッヒ・ジッツマン | Manufacturing method of temperature sensor |
| US8168258B2 (en) | 2006-08-02 | 2012-05-01 | Heinrich Zitzmann | Method of producing a temperature sensor |
| WO2015019863A1 (en) * | 2013-08-09 | 2015-02-12 | 日立金属株式会社 | Thermal mass flow meter and mass flow control device |
| JP2015034748A (en) * | 2013-08-09 | 2015-02-19 | 日立金属株式会社 | Thermal type mass flowmeter and mass flow control device |
| CN105452818A (en) * | 2013-08-09 | 2016-03-30 | 日立金属株式会社 | Thermal mass flow meter and mass flow control device |
| US10041823B2 (en) | 2013-08-09 | 2018-08-07 | Hitachi Metals, Ltd. | Thermal mass flow meter and mass flow controller |
| KR20220069945A (en) | 2019-09-30 | 2022-05-27 | 히타치 긴조쿠 가부시키가이샤 | A unit for hermetic connection, an assembly for hermetic connection, a hermetic container and vaporizer, and a method for manufacturing an assembly for hermetic connection |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6349902B2 (en) | 1988-10-06 |
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