JPS57207362A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57207362A
JPS57207362A JP56093277A JP9327781A JPS57207362A JP S57207362 A JPS57207362 A JP S57207362A JP 56093277 A JP56093277 A JP 56093277A JP 9327781 A JP9327781 A JP 9327781A JP S57207362 A JPS57207362 A JP S57207362A
Authority
JP
Japan
Prior art keywords
film
coated
substrate
shaped
end section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56093277A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6137798B2 (https=
Inventor
Hiroshi Shibata
Hidefumi Nakada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56093277A priority Critical patent/JPS57207362A/ja
Publication of JPS57207362A publication Critical patent/JPS57207362A/ja
Publication of JPS6137798B2 publication Critical patent/JPS6137798B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H10W72/01255—Changing the shapes of bumps by using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP56093277A 1981-06-16 1981-06-16 Semiconductor device Granted JPS57207362A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56093277A JPS57207362A (en) 1981-06-16 1981-06-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56093277A JPS57207362A (en) 1981-06-16 1981-06-16 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57207362A true JPS57207362A (en) 1982-12-20
JPS6137798B2 JPS6137798B2 (https=) 1986-08-26

Family

ID=14077934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56093277A Granted JPS57207362A (en) 1981-06-16 1981-06-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57207362A (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61229342A (ja) * 1985-04-03 1986-10-13 Fujitsu Ltd バンプ電極の接続方法
JPS61256745A (ja) * 1985-05-10 1986-11-14 Fujitsu Ltd 半導体装置
JPS6439043A (en) * 1987-08-05 1989-02-09 Nippon Denso Co Semiconductor integrated circuit device
US6740600B2 (en) * 2000-12-07 2004-05-25 International Business Machines Corporation Enhanced interface thermoelectric coolers with all-metals tips
EP1647053A2 (fr) * 2003-07-18 2006-04-19 Commissariat à l'Energie Atomique Procede de fabrication de film conducteur anisotrope
US7390732B1 (en) 1997-07-15 2008-06-24 Hitachi, Ltd. Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004921A (ja) * 2011-06-21 2013-01-07 Shinko Electric Ind Co Ltd 突起電極の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61229342A (ja) * 1985-04-03 1986-10-13 Fujitsu Ltd バンプ電極の接続方法
JPS61256745A (ja) * 1985-05-10 1986-11-14 Fujitsu Ltd 半導体装置
JPS6439043A (en) * 1987-08-05 1989-02-09 Nippon Denso Co Semiconductor integrated circuit device
US7390732B1 (en) 1997-07-15 2008-06-24 Hitachi, Ltd. Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip
US6740600B2 (en) * 2000-12-07 2004-05-25 International Business Machines Corporation Enhanced interface thermoelectric coolers with all-metals tips
EP1647053A2 (fr) * 2003-07-18 2006-04-19 Commissariat à l'Energie Atomique Procede de fabrication de film conducteur anisotrope

Also Published As

Publication number Publication date
JPS6137798B2 (https=) 1986-08-26

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