JPS57207362A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57207362A
JPS57207362A JP56093277A JP9327781A JPS57207362A JP S57207362 A JPS57207362 A JP S57207362A JP 56093277 A JP56093277 A JP 56093277A JP 9327781 A JP9327781 A JP 9327781A JP S57207362 A JPS57207362 A JP S57207362A
Authority
JP
Japan
Prior art keywords
film
coated
substrate
shaped
end section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56093277A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6137798B2 (enExample
Inventor
Hiroshi Shibata
Hidefumi Nakada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56093277A priority Critical patent/JPS57207362A/ja
Publication of JPS57207362A publication Critical patent/JPS57207362A/ja
Publication of JPS6137798B2 publication Critical patent/JPS6137798B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/1147—Manufacturing methods using a lift-off mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1301—Shape
    • H01L2224/13016—Shape in side view
    • H01L2224/13017—Shape in side view being non uniform along the bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP56093277A 1981-06-16 1981-06-16 Semiconductor device Granted JPS57207362A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56093277A JPS57207362A (en) 1981-06-16 1981-06-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56093277A JPS57207362A (en) 1981-06-16 1981-06-16 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57207362A true JPS57207362A (en) 1982-12-20
JPS6137798B2 JPS6137798B2 (enExample) 1986-08-26

Family

ID=14077934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56093277A Granted JPS57207362A (en) 1981-06-16 1981-06-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57207362A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61229342A (ja) * 1985-04-03 1986-10-13 Fujitsu Ltd バンプ電極の接続方法
JPS61256745A (ja) * 1985-05-10 1986-11-14 Fujitsu Ltd 半導体装置
JPS6439043A (en) * 1987-08-05 1989-02-09 Nippon Denso Co Semiconductor integrated circuit device
US6740600B2 (en) * 2000-12-07 2004-05-25 International Business Machines Corporation Enhanced interface thermoelectric coolers with all-metals tips
EP1647053A2 (fr) * 2003-07-18 2006-04-19 Commissariat à l'Energie Atomique Procede de fabrication de film conducteur anisotrope
US7390732B1 (en) 1997-07-15 2008-06-24 Hitachi, Ltd. Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004921A (ja) * 2011-06-21 2013-01-07 Shinko Electric Ind Co Ltd 突起電極の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61229342A (ja) * 1985-04-03 1986-10-13 Fujitsu Ltd バンプ電極の接続方法
JPS61256745A (ja) * 1985-05-10 1986-11-14 Fujitsu Ltd 半導体装置
JPS6439043A (en) * 1987-08-05 1989-02-09 Nippon Denso Co Semiconductor integrated circuit device
US7390732B1 (en) 1997-07-15 2008-06-24 Hitachi, Ltd. Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip
US6740600B2 (en) * 2000-12-07 2004-05-25 International Business Machines Corporation Enhanced interface thermoelectric coolers with all-metals tips
EP1647053A2 (fr) * 2003-07-18 2006-04-19 Commissariat à l'Energie Atomique Procede de fabrication de film conducteur anisotrope

Also Published As

Publication number Publication date
JPS6137798B2 (enExample) 1986-08-26

Similar Documents

Publication Publication Date Title
IE821477L (en) Hybrid integrated circuit device
EP0402114A3 (en) Opto-semiconductor device and method of fabrication of the same
JPS57207362A (en) Semiconductor device
JPS56114361A (en) Semiconductor container
EP0155698A3 (en) A method for manufacturing a semiconductor integrated circuit device provided with an improved isolation structure
JPS6468727A (en) Thin film transistor
JPS57149752A (en) Structure of multilayer wiring
JPS5796561A (en) Lead for connection of semiconductor device
JPS5591850A (en) Bias circuit module
JPS57181134A (en) Manufacture of semiconductor device
JPS5585042A (en) Semiconductor device
JPS5460582A (en) Electrode wiring and its forming method in semiconductor device
JPS57132341A (en) Multilayer wiring structure in semiconductor device
JPS5732653A (en) Manufacture of semiconductor device
JPS56110283A (en) Manufacture of embedded circuit structure-type semiconductor laser device
JPS5730390A (en) Josephson junction element
JPS5732654A (en) Semiconductor integrated circuit device
JPS57160154A (en) Manufacture of semiconductor device
JPS57160160A (en) Semiconductor device
EP0398364A3 (en) Thick-film element having flattened resistor layer
JPS56115566A (en) Manufacture of mos semiconductor device
JPS5732655A (en) Semiconductor integrated circuit device
JPS57201026A (en) Manufacture of semiconductor device
JPS6471150A (en) Manufacture of semiconductor device
JPS6444027A (en) Semiconductor device