JPS57207338A - Method for treating resist film for electron beam - Google Patents
Method for treating resist film for electron beamInfo
- Publication number
- JPS57207338A JPS57207338A JP9340181A JP9340181A JPS57207338A JP S57207338 A JPS57207338 A JP S57207338A JP 9340181 A JP9340181 A JP 9340181A JP 9340181 A JP9340181 A JP 9340181A JP S57207338 A JPS57207338 A JP S57207338A
- Authority
- JP
- Japan
- Prior art keywords
- resist film
- substrate
- electron beam
- sensitivity
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electron Beam Exposure (AREA)
Abstract
PURPOSE:To prevent the spread of the resist film after development, by using the same resist material, changing the heat treating temperature after application, and lowering the sensitivity of the layer which is closest to a substrate. CONSTITUTION:The negative type resist film 3 having the width of 4,000Angstrom is formed on the substrate 1, and the heat treatment is performed at 100 deg.C for 20min (sensitivity 2X10<-8>C/cm<2>). Then the same material is deposited 4 to the thickness of 6,000Angstrom , and the heat treatment is performed at 100 deg.C for 20min (sensitivity 1.5X10<-8>C/cm<2>). When exposure is performed by the electron beam whose irradiating amount is 1.5X10<-5>C/cm<2>, the exposure of the resist film 3 in the vicinity of the substrate 1 becomes insufficient with respect to the reflected electrons from the substrate, the spread of the resist width is suppressed, and the mask of the resist film, which is close to the width of the incident electron beam flux, is completed. Said treatment is very effective for the high integration of a semiconductor device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9340181A JPS57207338A (en) | 1981-06-16 | 1981-06-16 | Method for treating resist film for electron beam |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9340181A JPS57207338A (en) | 1981-06-16 | 1981-06-16 | Method for treating resist film for electron beam |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57207338A true JPS57207338A (en) | 1982-12-20 |
Family
ID=14081270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9340181A Pending JPS57207338A (en) | 1981-06-16 | 1981-06-16 | Method for treating resist film for electron beam |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57207338A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02150015A (en) * | 1988-12-01 | 1990-06-08 | Fujitsu Ltd | Pattern forming |
US7038204B2 (en) | 2004-05-26 | 2006-05-02 | International Business Machines Corporation | Method for reducing proximity effects in electron beam lithography |
US7545603B2 (en) | 2004-04-30 | 2009-06-09 | Tdk Corporation | Magnetic head and manufacturing method thereof |
-
1981
- 1981-06-16 JP JP9340181A patent/JPS57207338A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02150015A (en) * | 1988-12-01 | 1990-06-08 | Fujitsu Ltd | Pattern forming |
US7545603B2 (en) | 2004-04-30 | 2009-06-09 | Tdk Corporation | Magnetic head and manufacturing method thereof |
US7038204B2 (en) | 2004-05-26 | 2006-05-02 | International Business Machines Corporation | Method for reducing proximity effects in electron beam lithography |
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