JPS57203532A - Mold for molding thermosetting resin - Google Patents

Mold for molding thermosetting resin

Info

Publication number
JPS57203532A
JPS57203532A JP8828281A JP8828281A JPS57203532A JP S57203532 A JPS57203532 A JP S57203532A JP 8828281 A JP8828281 A JP 8828281A JP 8828281 A JP8828281 A JP 8828281A JP S57203532 A JPS57203532 A JP S57203532A
Authority
JP
Japan
Prior art keywords
gates
mold
cavities
thermosetting resin
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8828281A
Other languages
Japanese (ja)
Other versions
JPH0124612B2 (en
Inventor
Kazuo Nagai
Tadayuki Ozawa
Kazuyuki Kaminari
Takeshi Ono
Nagao Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP8828281A priority Critical patent/JPS57203532A/en
Publication of JPS57203532A publication Critical patent/JPS57203532A/en
Publication of JPH0124612B2 publication Critical patent/JPH0124612B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0061—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the material feeding channel
    • B29C33/0066—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the material feeding channel with a subdivided channel for feeding the material to a plurality of locations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B29C45/2708—Gates
    • B29C2045/2712—Serial gates for moulding articles in successively filled serial mould cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
    • B29C67/246—Moulding high reactive monomers or prepolymers, e.g. by reaction injection moulding [RIM], liquid injection moulding [LIM]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To provide a mold used for (reaction) injection-molding a thermosetting resin molding material by arranging a plurality of cavities in series with gates which are coupled directly to the runners of the mold and coupling between the cavities through film-shaped venting gates. CONSTITUTION:Resin passages having culls 2, runners 3 and gates 4 are, for example, provided in lower molds B, C, and a plurality of cavities 5, 5' and 8, 8', 8'' are formed in series at the respective gates 4. Further, a thermosetting resin is (reaction, liquid) injection-molded with a mold which has venting gates 6, 10, 11 formed in film shape incorporating venting property with the resin passages between the cavities 5 and 5', between 8' and 8'', and between 8' and 8'', and is transfer molded. When a lead frame 9 which places semiconductors is sealed with resin, strip lead frames, each on which semiconductor elements 12 are mounted in one row, are disposed in parallel with each other, or a planar lead frame, on which semiconductor elements 12 are mounted in plural rows, is disposed.
JP8828281A 1981-06-10 1981-06-10 Mold for molding thermosetting resin Granted JPS57203532A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8828281A JPS57203532A (en) 1981-06-10 1981-06-10 Mold for molding thermosetting resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8828281A JPS57203532A (en) 1981-06-10 1981-06-10 Mold for molding thermosetting resin

Publications (2)

Publication Number Publication Date
JPS57203532A true JPS57203532A (en) 1982-12-13
JPH0124612B2 JPH0124612B2 (en) 1989-05-12

Family

ID=13938539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8828281A Granted JPS57203532A (en) 1981-06-10 1981-06-10 Mold for molding thermosetting resin

Country Status (1)

Country Link
JP (1) JPS57203532A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62122254A (en) * 1985-11-22 1987-06-03 Mitsubishi Electric Corp Frame for resin molded semiconductor device
JPS63164453A (en) * 1986-12-26 1988-07-07 Idec Izumi Corp Manufacture of coupler of small-sized electronic component
JPH0258344A (en) * 1988-08-24 1990-02-27 Rohm Co Ltd Molding equipment for molded part of lead frame
EP0730938A1 (en) * 1994-09-21 1996-09-11 Sekisui Kagaku Kogyo Kabushiki Kaisha Method of manufacturing spheroidal moldings
US6649447B1 (en) * 1998-09-28 2003-11-18 Cypress Semiconductor Corporation Methods for plastic injection molding, with particular applicability in facilitating use of high density lead frames
WO2006129926A1 (en) * 2005-06-02 2006-12-07 Tsp Co., Ltd. Mold for manufacturing semiconductor device and semiconductor device manufactred using the same
US7691315B2 (en) 2005-07-18 2010-04-06 T.F.H. Publications, Inc. Injection mold having cavities in series
EP2412504A3 (en) * 2010-07-30 2012-03-28 Kabushiki Kaisha Toshiba Casting mold and gas insulated switchgear

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5228554A (en) * 1975-08-30 1977-03-03 Matsushita Electric Works Ltd Method of molding products by picking up multiple blanks

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5228554A (en) * 1975-08-30 1977-03-03 Matsushita Electric Works Ltd Method of molding products by picking up multiple blanks

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62122254A (en) * 1985-11-22 1987-06-03 Mitsubishi Electric Corp Frame for resin molded semiconductor device
JPS63164453A (en) * 1986-12-26 1988-07-07 Idec Izumi Corp Manufacture of coupler of small-sized electronic component
JPH0548954B2 (en) * 1986-12-26 1993-07-22 Idec Izumi Corp
JPH0258344A (en) * 1988-08-24 1990-02-27 Rohm Co Ltd Molding equipment for molded part of lead frame
EP0730938A1 (en) * 1994-09-21 1996-09-11 Sekisui Kagaku Kogyo Kabushiki Kaisha Method of manufacturing spheroidal moldings
EP0730938A4 (en) * 1994-09-21 1998-05-27 Seikisui Chemical Co Ltd Method of manufacturing spheroidal moldings
US6649447B1 (en) * 1998-09-28 2003-11-18 Cypress Semiconductor Corporation Methods for plastic injection molding, with particular applicability in facilitating use of high density lead frames
WO2006129926A1 (en) * 2005-06-02 2006-12-07 Tsp Co., Ltd. Mold for manufacturing semiconductor device and semiconductor device manufactred using the same
US7691315B2 (en) 2005-07-18 2010-04-06 T.F.H. Publications, Inc. Injection mold having cavities in series
EP2412504A3 (en) * 2010-07-30 2012-03-28 Kabushiki Kaisha Toshiba Casting mold and gas insulated switchgear
EP2540468A1 (en) * 2010-07-30 2013-01-02 Kabushiki Kaisha Toshiba Injection mold

Also Published As

Publication number Publication date
JPH0124612B2 (en) 1989-05-12

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