JPH0548954B2 - - Google Patents
Info
- Publication number
- JPH0548954B2 JPH0548954B2 JP61312488A JP31248886A JPH0548954B2 JP H0548954 B2 JPH0548954 B2 JP H0548954B2 JP 61312488 A JP61312488 A JP 61312488A JP 31248886 A JP31248886 A JP 31248886A JP H0548954 B2 JPH0548954 B2 JP H0548954B2
- Authority
- JP
- Japan
- Prior art keywords
- planned
- runner
- electronic components
- locations
- frame plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 238000000465 moulding Methods 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract 2
- 238000010137 moulding (plastic) Methods 0.000 abstract 1
- 238000001746 injection moulding Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Abstract
Description
【発明の詳細な説明】
＜産業上の利用分野＞
本発明は外被が樹脂により封止され、少くとも
２本のリード線が導出された小型電子部品を製造
する過程で得られる小型電子部品の連結体の製造
方法に関する。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a small electronic component obtained in the process of manufacturing a small electronic component whose outer cover is sealed with resin and at least two lead wires are led out. The present invention relates to a method for manufacturing a connected body.
＜従来の技術＞
このような小型電子部品は、リード線となる導
体板を樹脂に埋め込む一体成形により製造され
る。また、製造過程の取扱いを容易にするため、
複数個の電子部品のリード線を網状につないで帯
状の導体フレーム板に形成し、複数個の電子部品
の樹脂部をランナーで連結して、これを一回の射
出成形により一体成形していた。<Prior Art> Such small electronic components are manufactured by integral molding in which a conductor plate serving as a lead wire is embedded in resin. In addition, in order to facilitate handling of the manufacturing process,
The lead wires of multiple electronic components were connected in a net shape to form a strip-shaped conductor frame plate, the resin parts of multiple electronic components were connected with runners, and this was integrally molded in a single injection molding process. .
しかし、一個のノズルによる一回の射出成形で
得られる部品の個数は、樹脂材料の粘性、射出後
の冷却速度、成形すべき型の流体抵抗等により限
度がある。 However, the number of parts that can be obtained by one injection molding using one nozzle is limited by the viscosity of the resin material, the cooling rate after injection, the fluid resistance of the mold to be molded, etc.
＜発明が解決しようとする問題点＞
一方、電子部品の製造コストを低減化するた
め、製造工程の一貫自動化の要請が強く、そのた
めに上記した一回の射出成形により得られる個数
の限界を超えて、多数個の電子部品を連ねた連結
体を得ることが望まれる。<Problems to be solved by the invention> On the other hand, in order to reduce the manufacturing cost of electronic components, there is a strong demand for integrated automation of the manufacturing process, and for this purpose it is necessary to exceed the limit of the number of parts that can be obtained by one injection molding as described above. Therefore, it is desired to obtain a connected body in which a large number of electronic components are connected.
＜問題点を解決するための手段＞
本発明の小型電子部品の連結体の製造方法は、
下記の工程Ａ〜Ｃを有することを特徴としてい
る。<Means for solving the problems> The method for manufacturing a connected body of small electronic components of the present invention includes the following steps:
It is characterized by having the following steps A to C.
Ａ 全体として帯状をなし、その中心線上に沿つ
て所定のピツチで複数の小型電子部品の配設予
定個所が設けられ、各配設予定個所から両側辺
に伸びる導体が配設予定個所において互に近接
し、かつ、上記配設予定個所を挟んでその両側
の導体がこの配設予定個所の配列方向に沿つて
相互に連結されている導体フレーム板を打ち抜
く工程。A: The overall shape is a belt, and along the center line there are a plurality of locations where small electronic components are planned to be installed, and conductors extending from each planned location to both sides are connected to each other at the planned locations. A step of punching out a conductor frame plate in which conductors that are adjacent to each other and on both sides of the planned placement location are interconnected along the arrangement direction of the planned placement location.
Ｂ 上記導体フレーム板を載置する凹所と、上記
各配設予定個所に成形体を形成するための第１
の空間と、その第１の空間すべてを連通するラ
ンナーを形成するための第２の空間と、これら
第１および第２の空間の所定の複数個所へ１個
の射出ノズルから樹脂を注入する分岐型ランナ
ーを形成するための第３の空間が形成された樹
脂成形用金型に、上記導体フレーム板をセツト
する工程。B. A recess for placing the conductor frame plate, and a first cavity for forming molded bodies in each of the planned locations.
a second space for forming a runner that communicates all of the first spaces, and a branch for injecting resin into a plurality of predetermined locations in the first and second spaces from one injection nozzle. A step of setting the conductor frame plate in a resin molding mold in which a third space for forming a mold runner is formed.
Ｃ 上記射出ノズルから樹脂を射出し、連結体を
形成した後、その形成された連結体の一端に設
けられた連結部を、次工程で形成される連結体
の一端の所定位置に配置し、その連結部近傍に
設けたヒータにより上記連結部を加熱しながら
射出することにより上記連結部が相互に連結さ
れた連結体を形成し、その後所定回数、すでに
形成された連結体と次に形成する連結体とを連
結すべく上記工程を繰り返し行う工程。C. After injecting the resin from the injection nozzle to form a connecting body, placing the connecting part provided at one end of the formed connecting body at a predetermined position at one end of the connecting body to be formed in the next step, By injecting the connecting portion while heating it with a heater provided near the connecting portion, a connected body in which the connecting portions are interconnected is formed, and then the connected body is formed next with the already formed connected body a predetermined number of times. A step of repeating the above steps to connect the connecting body.
＜実施例＞
第１図は本発明による製造方法の一過程を示す
図である。<Example> FIG. 1 is a diagram showing one process of the manufacturing method according to the present invention.
連続的に打抜き加工された帯状の導体フレーム
板１がプラスチツク成形用金型上にセツトされ、
成形物２…２と一体成形される。成形物２…２は
ランナー３…３により連結された連結体として成
形される。この連結体の例えば３個所に樹脂ラン
ナー４のゲート５Ａ，５Ｂ，５Ｃが設けられ、こ
のランナーは、押出機のノズル７に連通するラン
ナースプル６から分岐した構造になつている。連
結体の先端には連結部９が一体成形され、一方、
過去に成形された連結体１０との結合部の近傍
に、ヒータ８が設けられ、今回の成形時に加熱融
合されて連結体同士が連結される。 A continuously punched strip-shaped conductor frame plate 1 is set on a plastic mold,
It is integrally molded with the molded article 2...2. The molded articles 2...2 are molded as a connected body connected by runners 3...3. Gates 5A, 5B, and 5C of the resin runner 4 are provided at, for example, three locations on this connected body, and this runner has a structure that branches from a runner sprue 6 that communicates with a nozzle 7 of the extruder. A connecting part 9 is integrally molded at the tip of the connecting body, and on the other hand,
A heater 8 is provided near the joint portion with the previously molded connecting body 10, and the connecting bodies are connected to each other by heating and fusing during the current molding.
以下、更に具体的に説明する。 This will be explained in more detail below.
第２図に導体フレーム板１の一実施例を示す。 FIG. 2 shows an embodiment of the conductor frame plate 1. As shown in FIG.
全体として帯状の導体フレーム板１は工程が進
む矢印方向Ａに向つて左側のフレーム１Ａと右側
のフレーム１Ｂに分割構成されている。左側のフ
レーム１Ａは左側辺のガイドフレーム１１、中心
から左辺へ伸びる主リードフレーム１２、先端が
主リードフレームの先端に近接し斜め方向に導出
されている副リードフレーム１３，１４、各主リ
ードフレーム１２を連結する補助フレーム１５、
副リードフレーム１３，１４を支持するための補
助フレーム１６より形成され、ガイドフレーム１
１には所定のピツチで位置決め孔１９が穿たれて
いる。右側のフレーム１Ｂは右側辺のガイドフレ
ーム２１、中心から右辺へ伸びる主リードフレー
ム２２、先端が主リードフレームの先端に近接し
斜め方向に導出されている副リードフレーム２
３，２４、各主リードフレーム２２を連結する３
本の補助フレーム２５，２６，２７、副リードフ
レーム２３，２４を支持し主リードフレーム２２
と平行に右辺まで伸びていく補助フレーム２８よ
り形成され、ガイドフレーム２１には所定のピツ
チで位置決め孔２９が穿たれている。主リードフ
レーム１２，２２の先端は、中心線を挟んで近接
している。 As a whole, the strip-shaped conductor frame plate 1 is divided into a left frame 1A and a right frame 1B in the direction of the arrow A in which the process advances. The left frame 1A includes a guide frame 11 on the left side, a main lead frame 12 extending from the center to the left side, sub lead frames 13 and 14 whose tips are close to the tips of the main lead frame and are led out in an oblique direction, and each main lead frame. Auxiliary frame 15 connecting 12,
The guide frame 1 is formed of an auxiliary frame 16 for supporting the auxiliary lead frames 13 and 14.
1 has positioning holes 19 bored at a predetermined pitch. The frame 1B on the right side includes a guide frame 21 on the right side, a main lead frame 22 extending from the center to the right side, and a sub lead frame 2 whose tip is close to the tip of the main lead frame and led out in an oblique direction.
3, 24, 3 connecting each main lead frame 22
The main lead frame 22 supports the book auxiliary frames 25, 26, 27 and the sub lead frames 23, 24.
The guide frame 21 is formed of an auxiliary frame 28 extending parallel to the right side thereof, and positioning holes 29 are bored in the guide frame 21 at a predetermined pitch. The tips of the main lead frames 12 and 22 are close to each other with the center line in between.
主リードフレーム１２，２２の先端、及び副リ
ードフレーム１３，１４，２３，２４の先端が互
に近接している場所に電子部品をマウントするた
めの成形体２…２が一体成形され、その間がラン
ナー３…３により連結される。次の成形物と連結
するための連結部９の構造は、例えば、ランナー
部の中間部、すなわち補助フレーム１６と２８を
結ぶ線との交点付近に肉厚が半分の段部を設けそ
の段部に、下方から突き上げたテーパーピン６５
（第３図）によりテーパ孔を形成したものである。 Molded bodies 2...2 for mounting electronic components are integrally molded at locations where the tips of the main lead frames 12, 22 and the tips of the sub lead frames 13, 14, 23, 24 are close to each other, and the space between them is They are connected by runners 3...3. The structure of the connecting part 9 for connecting with the next molded product is, for example, by providing a step with half the wall thickness in the middle part of the runner part, that is, near the intersection with the line connecting the auxiliary frames 16 and 28. Taper pin 65 pushed up from below
(Fig. 3), a tapered hole is formed.
第３図に本発明品の製造に使用する金型の要部
を示す。 FIG. 3 shows the main parts of the mold used for manufacturing the product of the present invention.
金型は主として下型６０と上型７０より成り、
下型６０の上面には導体フレーム１を所定位置に
載せる凹所６１が形成されている。成形品を得る
ための型は、上型７０に形成されたものとして、
所定ピツチで配列された成形体２…２を形成する
ための第１の空間の一部７１…７１と、その第１
の空間を連通するランナー部を形成するための第
２の空間７２…７２が連続し、それにランナーを
形成するための第３の空間７５が連通している。
また、これら第１及び第２の空間の一端に形成さ
れた連結部９を形成するための第４の空間７３
と、過去に成形された成形物を所定位置に保持す
るための第５の空間の一部７４が互に連通してい
る。下型６に形成されたものとして、第１の空間
の一部６２…６２と第５の空間の一部を含む凹所
６３が形成されている。 The mold mainly consists of a lower mold 60 and an upper mold 70,
A recess 61 is formed on the upper surface of the lower mold 60, on which the conductor frame 1 is placed in a predetermined position. Assuming that the mold for obtaining the molded product is formed in the upper mold 70,
Parts 71...71 of the first spaces for forming the molded bodies 2...2 arranged at a predetermined pitch, and
The second spaces 72...72 for forming runner portions communicating with the spaces are continuous, and the third spaces 75 for forming runners are in communication therewith.
Additionally, a fourth space 73 for forming the connecting portion 9 is formed at one end of these first and second spaces.
and a portion 74 of a fifth space for holding a previously molded article in a predetermined position are in communication with each other. A recess 63 is formed in the lower mold 6 and includes a portion of the first space 62 . . . 62 and a portion of the fifth space.
これらに付随する装置として、各成形体２…２
の直下に設けられた成形体突き出しピン６４…６
４、連結部９の孔を形成するためのテーパーピン
６５、成形スタート時のみ下降してランナー成形
用空間７２の１個所を遮断するストツパーピン７
６、過去の成形物との接続部を加熱するためのヒ
ータ８が設けられている。このようにして一体成
形された連続体の成形体２…２のそれぞれに、第
４図に示すように５個のLED４１，４２，４３，
４４，４５がマウントされ、各リードフレーム先
端とワイヤにより接続される。その後、必要なリ
ード線を残してフレームの余分な部分を切断除去
し、ランナー部３…３にて帯状の連続体のままで
検査が行われたのち、ランナー部３…３が切断除
去される。 As a device accompanying these, each molded body 2...2
The molded body ejecting pins 64...6 provided directly below the
4. A taper pin 65 for forming a hole in the connecting portion 9; a stopper pin 7 that descends only at the start of molding to block one part of the runner molding space 72;
6. A heater 8 is provided to heat the connection portion with the previous molded product. As shown in FIG. 4, five LEDs 41, 42, 43,
44 and 45 are mounted and connected to the tips of each lead frame by wires. After that, the excess part of the frame is cut and removed, leaving the necessary lead wires, and the runner parts 3...3 are inspected as they are as continuous strips, and then the runner parts 3...3 are cut and removed. .
＜発明の効果＞
本発明によれば、１個の射出用ノズルから、い
くつかに分岐したランナーをもつ金型を用いてい
るので、従来の限界を超えて、多数個の電子部品
を一度に成形することができ、生産能率が向上す
る。<Effects of the Invention> According to the present invention, since a mold having runners branching from one injection nozzle is used, it is possible to manufacture a large number of electronic components at once, exceeding the conventional limit. It can be molded, improving production efficiency.
更に、連結体の一端に連結部を一体成形し、そ
の成形品を再び金型内に位置を移動させてセツト
し、次の成形を行う場合は、半無限長の長尺連結
体を能率的に得ることができる。しかも、連結部
を連結する場合には、ヒータによりその連結部を
加熱しながら射出成形を行うので連結部の連結は
確実になされる。 Furthermore, when a connecting part is integrally molded at one end of the connecting body, and the molded product is moved and set in the mold again for the next molding, it is possible to efficiently form a long connecting body with a semi-infinite length. can be obtained. Moreover, when connecting the connecting parts, injection molding is performed while heating the connecting parts with a heater, so that the connecting parts can be reliably connected.
第１図は本発明による製造方法の一過程を示す
要部斜視図である。第２図は導体フレーム板１の
具体例を示す正面図、第３図は本発明の製造に使
用する金型を示す断面図、第４図は第２図に示す
実施例に電子部品を取付けた状態を示す正面図で
ある。
１……導体フレーム、２……成形体、３……ラ
ンナー、４……樹脂ランナー、８……ヒータ、９
……連結部、７……射出口。
FIG. 1 is a perspective view of a main part showing one step of the manufacturing method according to the present invention. FIG. 2 is a front view showing a specific example of the conductor frame plate 1, FIG. 3 is a sectional view showing a mold used for manufacturing the present invention, and FIG. 4 is an electronic component attached to the embodiment shown in FIG. FIG. 1... Conductor frame, 2... Molded body, 3... Runner, 4... Resin runner, 8... Heater, 9
...Connection part, 7...Ejection port.
Claims (1)
結体の製造方法。 Ａ 全体として帯状をなし、その中心線上に沿つ
て所定のピツチで複数の小型電子部品の配設予
定個所が設けられ、各配設予定個所から両側辺
に伸びる導体が配設予定個所において互に近接
し、かつ、上記配設予定個所を挟んでその両側
の導体がこの配設予定個所の配列方向に沿つて
相互に連結されている導体フレーム板を打ち抜
く工程。 Ｂ 上記導体フレーム板を載置する凹所と、上記
各配設予定個所に成形体を形成するための第１
の空間と、その第１の空間すべてを連通するラ
ンナーを形成するための第２の空間と、これら
第１および第２の空間の所定の複数個所へ１個
の射出ノズルから樹脂を注入する分岐型ランナ
ーを形成するための第３の空間が形成された樹
脂成形用金型に、上記導体フレーム板をセツト
する工程。 Ｃ 上記射出ノズルから樹脂を射出し、連結体を
形成した後、その形成された連結体の一端に設
けられた連結部を、次工程で形成される連結体
の一端の所定位置に配置し、その連結部近傍に
設けたヒータにより上記連結部を加熱しながら
射出することにより上記連結部が相互に連結さ
れた連結体を形成し、その後所定回数、すでに
形成された連結体と次に形成する連結体とを連
結すべく上記工程を繰り返し行う工程。[Scope of Claims] 1. A method for manufacturing a connected body of small electronic components, comprising the following steps A to C. A: The overall shape is a belt, and along the center line there are a plurality of locations where small electronic components are planned to be installed, and conductors extending from each planned location to both sides are connected to each other at the planned locations. A step of punching out a conductor frame plate in which conductors that are adjacent to each other and on both sides of the planned placement location are interconnected along the arrangement direction of the planned placement location. B. A recess for placing the conductor frame plate, and a first cavity for forming molded bodies in each of the planned locations.
a second space for forming a runner that communicates all of the first spaces, and a branch for injecting resin into a plurality of predetermined locations in the first and second spaces from one injection nozzle. A step of setting the conductor frame plate in a resin molding mold in which a third space for forming a mold runner is formed. C. After injecting the resin from the injection nozzle to form a connecting body, placing the connecting part provided at one end of the formed connecting body at a predetermined position at one end of the connecting body to be formed in the next step, By injecting the connecting portion while heating it with a heater provided near the connecting portion, a connected body in which the connecting portions are interconnected is formed, and then the connected body is formed next with the already formed connected body a predetermined number of times. A step of repeating the above steps to connect the connecting body.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31248886A JPS63164453A (en) | 1986-12-26 | 1986-12-26 | Manufacture of coupler of small-sized electronic component |
| EP87119047A EP0273364B1 (en) | 1986-12-26 | 1987-12-22 | Electronic part carrying strip and method of manufacturing the same |
| DE8787119047T DE3777785D1 (en) | 1986-12-26 | 1987-12-22 | CARRIER TAPE FOR ELECTRONIC COMPONENTS AND PRODUCTION METHOD. |
| US07/137,025 US4937654A (en) | 1986-12-26 | 1987-12-23 | Electronic part carrying strip and method of manufacturing the same |
| US07/509,786 US5059373A (en) | 1986-12-26 | 1990-04-17 | Method of manufacturing continuous strip of electronic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31248886A JPS63164453A (en) | 1986-12-26 | 1986-12-26 | Manufacture of coupler of small-sized electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63164453A JPS63164453A (en) | 1988-07-07 |
| JPH0548954B2 true JPH0548954B2 (en) | 1993-07-22 |
Family
ID=18029811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31248886A Granted JPS63164453A (en) | 1986-12-26 | 1986-12-26 | Manufacture of coupler of small-sized electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63164453A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6127660B2 (en) * | 2013-03-29 | 2017-05-17 | 株式会社カネカ | Light emitting element mounting lead frame, light emitting element mounting resin molded body and manufacturing method thereof, and transfer molding die |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4913663U (en) * | 1972-05-08 | 1974-02-05 | ||
| JPS57203532A (en) * | 1981-06-10 | 1982-12-13 | Toshiba Chem Corp | Mold for molding thermosetting resin |
| JPS5840335A (en) * | 1981-09-03 | 1983-03-09 | C I Kasei Co Ltd | Calenderable polyethylene composition |
| JPS6120755U (en) * | 1984-07-09 | 1986-02-06 | 株式会社 ゴ−ル | key storage device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58184839U (en) * | 1982-05-31 | 1983-12-08 | 日本電気ホームエレクトロニクス株式会社 | Resin mold equipment |
-
1986
- 1986-12-26 JP JP31248886A patent/JPS63164453A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4913663U (en) * | 1972-05-08 | 1974-02-05 | ||
| JPS57203532A (en) * | 1981-06-10 | 1982-12-13 | Toshiba Chem Corp | Mold for molding thermosetting resin |
| JPS5840335A (en) * | 1981-09-03 | 1983-03-09 | C I Kasei Co Ltd | Calenderable polyethylene composition |
| JPS6120755U (en) * | 1984-07-09 | 1986-02-06 | 株式会社 ゴ−ル | key storage device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63164453A (en) | 1988-07-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |