JPH0548954B2 - - Google Patents

Info

Publication number
JPH0548954B2
JPH0548954B2 JP31248886A JP31248886A JPH0548954B2 JP H0548954 B2 JPH0548954 B2 JP H0548954B2 JP 31248886 A JP31248886 A JP 31248886A JP 31248886 A JP31248886 A JP 31248886A JP H0548954 B2 JPH0548954 B2 JP H0548954B2
Authority
JP
Grant status
Grant
Patent type
Prior art keywords
runner
electronic components
molding
formed
moldings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP31248886A
Other versions
JPS63164453A (en )
Inventor
Michio Hirabayashi
Original Assignee
Idec Izumi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Abstract

PURPOSE:To simultaneously form many electronic components without using a metal mold having a branched runner. CONSTITUTION:Moldings 2...2 set on a plastic molding metal mold for mounting electronic components are integrally formed with a striplike conductor frame plate 1 which is continuously punched to be formed. A runner 4 has three gates 5A, 5B, 5C branched from a runner spool 6 which communicates with the nozzle 7 of an extruder. Then, many electronic components can be simultaneously formed. A heater 8 is provided near a coupler of a molding 10 which was molded in the past to a molding which is molded this time, and both the moldings are thermally fused to be integrated. Then, a long coupler of semi- indefinite length can be efficiently obtained. Thus, the integrated automation of the manufacture can be facilitated.
JP31248886A 1986-12-26 1986-12-26 Expired - Fee Related JPH0548954B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31248886A JPH0548954B2 (en) 1986-12-26 1986-12-26

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP31248886A JPH0548954B2 (en) 1986-12-26 1986-12-26
EP19870119047 EP0273364B1 (en) 1986-12-26 1987-12-22 Electronic part carrying strip and method of manufacturing the same
DE19873777785 DE3777785D1 (en) 1986-12-26 1987-12-22 Traegerband for electronic components and manufacturing processes.
US07137025 US4937654A (en) 1986-12-26 1987-12-23 Electronic part carrying strip and method of manufacturing the same
US07509786 US5059373A (en) 1986-12-26 1990-04-17 Method of manufacturing continuous strip of electronic devices

Publications (2)

Publication Number Publication Date
JPS63164453A true JPS63164453A (en) 1988-07-07
JPH0548954B2 true JPH0548954B2 (en) 1993-07-22

Family

ID=18029811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31248886A Expired - Fee Related JPH0548954B2 (en) 1986-12-26 1986-12-26

Country Status (1)

Country Link
JP (1) JPH0548954B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6127660B2 (en) * 2013-03-29 2017-05-17 株式会社カネカ Emitting element mounting lead frame, the light emitting element mounting resin molded body and method of manufacturing the same, and the transfer mold

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4913663U (en) * 1972-05-08 1974-02-05
JPS57203532A (en) * 1981-06-10 1982-12-13 Toshiba Chem Corp Mold for molding thermosetting resin
JPS5840335A (en) * 1981-09-03 1983-03-09 C I Kasei Co Ltd Calenderable polyethylene composition
JPS6120755U (en) * 1984-07-09 1986-02-06

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58184839U (en) * 1982-05-31 1983-12-08

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4913663U (en) * 1972-05-08 1974-02-05
JPS57203532A (en) * 1981-06-10 1982-12-13 Toshiba Chem Corp Mold for molding thermosetting resin
JPS5840335A (en) * 1981-09-03 1983-03-09 C I Kasei Co Ltd Calenderable polyethylene composition
JPS6120755U (en) * 1984-07-09 1986-02-06

Also Published As

Publication number Publication date Type
JPS63164453A (en) 1988-07-07 application

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees