CN107650327B

CN107650327B - Laser head and forming die thereof

Info

Publication number: CN107650327B
Application number: CN201710906411.0A
Authority: CN
Inventors: 何少敏
Original assignee: Wenzhou Lebang Optoelectronics Technology Co ltd
Current assignee: Wenzhou Lebang Optoelectronics Technology Co ltd
Priority date: 2017-09-29
Filing date: 2017-09-29
Publication date: 2024-02-27
Anticipated expiration: 2037-09-29
Also published as: CN107650327A

Abstract

The invention discloses a laser head, which comprises a circuit board and a fixing frame, wherein a printed circuit, a laser chip and an electronic element are arranged on the circuit board, the laser chip is adhered on the circuit board through conductive silver adhesive, and the laser chip is connected with the printed circuit through an uninsulated wire, and the laser head is characterized in that: the circuit board both sides all are equipped with a plurality of through-holes, the mount is the tubulose, and the mount fuses in one side of circuit board through moulding plastics, and forms after the mount shaping and pass through the through-hole and with through-hole complex reference column. The laser head circuit board and the fixing frame are integrated through the special forming die in an injection molding mode, so that the positioning column penetrates through the circuit board through hole to be matched, the structure of the laser head is more stable, the reject ratio of products is reduced, and the cost is greatly reduced. The invention also discloses a forming die for preparing the laser head.

Description

Laser head and forming die thereof

Technical Field

The invention relates to a laser head and a forming die thereof.

Background

At present, the laser head that provides in the market generally includes circuit board and mount, is equipped with printed circuit, laser chip and electronic component on the circuit board, and this kind of laser head is slotted on the mount, then the manual work is pegged graft the circuit board in the groove, glues at the groove both sides again and fixes, and structural stability is relatively poor, artifical intensity of labour is high, inefficiency and cost are higher, if the structure of through-hole and reference column is to be adopted on the laser head, the mount must be the ingredient grafting of doing, like this makes the preparation technology loaded down with trivial details, the structure is complicated, and the product reject ratio is higher all comes down through a set of flow of manual operation, causes with high costs. The invention overcomes the defects that the circuit board is fixed with the electronic element and the laser chip, and the electronic element and the laser chip can be integrated by injection molding in a special die after being welded with the insulated wire.

Disclosure of Invention

In view of the shortcomings of the background art, the invention provides a laser head and a forming die thereof, which overcome the related problems of the existing laser head.

According to a first aspect of the present invention, there is provided a laser head comprising a circuit board and a holder, wherein a printed circuit, a laser chip and an electronic component are provided on the circuit board, the laser chip is adhered to the circuit board by a conductive silver paste, and the laser chip is connected to the printed circuit by an uninsulated wire, characterized in that: the circuit board both sides all are equipped with a plurality of through-holes, the mount is tubulose, and the mount through injection moulding integrated into one piece and form with through-hole complex reference column.

After the technical scheme is adopted, the circuit board and the fixing frame are matched with the positioning column through the through hole, so that the structure of the laser head is more stable.

According to a second aspect of the invention, there is provided a forming die for preparing the laser head, comprising an upper locking template, a connecting plate, a static template, a die core, a movable template, two vertical plates and a lower locking template which are sequentially arranged from top to bottom, wherein a plurality of guide posts are arranged on the upper locking template, guide holes which are movably matched with the guide posts are respectively arranged on the connecting plate, the static template, the movable template and the two vertical plates, a plurality of rows of cavities matched with the laser head are arranged in the die core, the die core comprises the static die, the movable die and an inner core, the static die is arranged on the static template, the movable die is arranged on the movable template, a groove is arranged on the movable die, the inner core is arranged in the groove, a top rod plate and a top hole are arranged on the lower locking template, the top rod plate is arranged between the two vertical plates, a top rod facing the inner core is arranged on the top rod plate, a hole for allowing the top rod to pass through is arranged on the movable template, and the top hole is aligned with the top rod plate.

After the technical scheme is adopted, the circuit board with the matched quantity with the cavity is placed into the inner core, the inner core is placed into the cavity, the static mold, the movable mold and the inner core are attached together, then hot materials are injected into the cavity through injection molding, the static mold, the movable mold and the inner core are separated after the hot materials are cooled, and the laser head semi-finished product with the electronic element, the laser chip and the circuit board without insulated wires and the fixing frame which are integrally bonded together can be taken out, so that the manufacturing process is simple, the labor intensity is greatly reduced, the cost is lower, the efficiency is higher, and the quality of the product is greatly improved.

Drawings

The invention has the following drawings:

FIG. 1 is a schematic diagram of the structure of a laser head according to the present invention;

FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;

FIG. 3 is a schematic perspective view of FIG. 1;

FIG. 4 is a schematic perspective view of a molding die according to the present invention;

FIG. 5 is a top view of a forming die of the present invention;

FIG. 6 is a schematic view of the D-D structure of FIG. 5;

FIG. 7 is an enlarged view of the portion L of FIG. 6;

FIG. 8 is an exploded view of the structure of the molding die of the present invention;

FIG. 9 is a schematic view of an embodiment of a laser head according to the present invention;

FIG. 10 is a cross-sectional view taken along B-B in FIG. 9;

FIG. 11 is a schematic view of another embodiment of the laser head according to the present invention;

fig. 12 is a cross-sectional view taken along line C-C of fig. 11.

Detailed Description

Referring to fig. 1-3, the laser head provided by the invention comprises a circuit board 1 and a fixing frame 2, wherein a printed circuit 3, a laser chip 4 and an electronic element 5 are arranged on the circuit board 1, the laser chip 4 is adhered on the circuit board 1 through conductive silver paste, the laser chip 4 is connected with the printed circuit 3 through an uninsulated wire 6, a plurality of through holes 7 are arranged on two sides of the circuit board 1, the fixing frame 2 is tubular, the fixing frame 2 is integrally formed through injection molding and forms a positioning column 8 matched with the through holes 7, the upper surface of the circuit board 1 with the laser chip 4 is flush with the transverse central line of the fixing frame 2, a placement groove 41 for placing the laser chip 4 and the uninsulated wire 6 is arranged on the inner wall of one side of the fixing frame 2, a spring 38 is arranged on the other side of the fixing frame 2, the spring 38 and the fixing frame 2 are integrally formed through injection molding, the split structure of the original metal spring is replaced, and the assembly is more convenient.

Referring to fig. 9 and 10, in an embodiment of the laser head according to the present invention, a lens tube 34 is disposed on the other side of the fixing frame 2, a condensing lens 36 is disposed in the lens tube 34, an internal thread 35 is disposed in the lens tube 34, an external thread 37 matching with the internal thread 35 is disposed on the fixing frame 2, a spring 38 can be abutted against the condensing lens 36, a linear counter bore or a cross counter bore or a hexagon counter bore is disposed at the outer end of the lens tube 34, and the assembly mode is diversified and is convenient for automatic assembly.

Referring to fig. 11 and 12, in another embodiment of the laser head according to the present invention, a middle sleeve 39 is disposed on the other side of the fixing frame 2, a hollow bolt 40 is disposed on the other side of the middle sleeve 39, a condensing lens 36 is disposed in the hollow bolt 40, the middle sleeve 39 is connected with the fixing frame 2 through threads, the hollow bolt 40 is connected with the middle sleeve 39 through threads, a straight counter bore or a cross counter bore or a hexagon counter bore is disposed at the outer end of the hollow bolt 40, the assembly mode is diversified, and the automatic assembly is convenient.

Referring to fig. 4-8, the forming mold provided by the invention comprises an upper locking mold plate 10, a connecting plate 11, a static mold plate 12, a mold core, a movable mold plate 13, two vertical plates 14 and a lower locking mold plate 15 which are sequentially arranged from top to bottom, wherein a plurality of guide posts 16 are arranged on the upper locking mold plate 10, guide holes 17 which are movably matched with the guide posts 16 are arranged on the connecting plate 11, the static mold plate 12, the movable mold plate 13 and the two vertical plates 14, a plurality of rows of cavities 18 which are matched with laser heads are arranged in the mold core, the mold core comprises a static mold 19, a movable mold 20 and an inner core 21, the static mold 19 is arranged on the static mold plate 12, the movable mold 20 is arranged on the movable mold plate 13, a groove 22 is arranged on the movable mold 20, the inner core 21 is arranged in the groove 22, a push rod plate 23 and a top hole 24 are movably arranged on the lower locking mold plate 15, the push rod plate 23 can move up and down on the lower locking mold plate 15, the push rod plate 23 is positioned between the two vertical plates 14, a push rod 25 which faces the inner core 21 is arranged on the push rod plate 23, the movable mold plate 13 and the movable mold plate 20 are provided with holes 26 for allowing ejector rods 25 to pass through, the ejector holes 24 are used for being matched with ejector pins of an injection molding machine, the upper lock mold plate 10, the connecting plate 11 and the static mold plate 12 are connected through bolts, the static mold 19 and the static mold plate 12 are connected through bolts, the movable mold plate 13, the vertical plate 14 and the lower lock mold plate 15 are connected through bolts, the movable mold plate 20 and the movable mold plate 13 are connected through bolts, the upper lock mold plate 10 is provided with an injection molding feed port 27, the connecting plate 11, the static mold plate 12 and the static mold plate 19 are provided with a runner 28 for communicating the injection molding feed port 27 and the cavity 18, a guide block 29 for fixing a mold core is arranged between the static mold plate 12 and the movable mold plate 13, two sides of the static mold plate 12 are provided with inclined guide columns 30, the guide block 29 and the inclined guide columns 30 are in sliding fit, a mold rod 31 capable of being inserted into the cavity 18 is arranged on the guide block 29, the inner end of the mold rod 31 is provided with a yielding groove 32 for accommodating the laser chip 4 and the lead 6, a guide sleeve 33 is arranged in the guide hole 17, the guide sleeve 33 is movably matched with the guide post 16, and an avoidance groove 9 for accommodating the electronic element 5 is arranged on one surface of the static mold 19 facing the cavity 18.

The working principle of the forming die is as follows:

1. moving the movable mould plate 13, the vertical plate 14, the ejector rod plate 23 and the lower locking mould plate 15 downwards to separate the movable mould 20 from the static mould 19, wherein in the process, the guide block 29 is matched with the inclined guide post 30, so that the guide block 29 moves outwards to separate the mould rod 31 from the mould core, then the circuit board 1 with the quantity matched with the mould cavity 18 is placed into the inner core 21, and then the inner core 21 is placed into the mould cavity 18;

2. moving the movable mould plate 13, the vertical plate 14, the ejector rod plate 23 and the lower locking mould plate 15 upwards to enable the static mould 19, the movable mould 20 and the inner core 21 to be attached together, resetting the guide block 29 at the moment, and inserting the mould rod 31 into the mould core;

3. injecting hot material into the injection molding feed port 27 through an injection molding machine, enabling the hot material to pass through the runner 28 and fill the cavity 18, enabling the relief groove 32 and the relief groove 39 to avoid the hot material from contacting the laser chip 4, the uninsulated wire 6 and the electronic element 5, and waiting for the hot material to cool;

4. after the hot material is cooled, the movable mold plate 13, the vertical plate 14, the ejector rod plate 23 and the lower locking mold plate 15 are moved downwards, so that the movable mold 20 and the static mold 19 are separated, the guide block 29 is moved outwards, the mold rod 31 is separated from the mold core, after the movable mold 20 moves for a certain distance, the ejector pins of the injection molding machine penetrate through the ejector holes 24 to jack up the ejector rod plate 23 and the ejector rods 25, the ejector rods 25 eject the inner cores 21 and all laser heads, and the laser heads are conveniently taken out.

Claims

1. The utility model provides a laser head, includes circuit board and mount, be equipped with printed circuit, laser chip and electronic component on the circuit board, laser chip is glued on the circuit board through electrically conductive silver, and laser chip passes through non-insulated wire and printed circuit connection, characterized by: the circuit board both sides all are equipped with a plurality of through-holes, the mount is the tubulose, and the mount fuses in one side of circuit board through moulding plastics, and forms after the mount shaping and pass through the through-hole and with through-hole complex reference column, the mount opposite side is equipped with well sleeve pipe, well sleeve pipe opposite side is equipped with the cavity bolt, be equipped with the spotlight lens in the cavity bolt, well sleeve pipe and mount pass through threaded connection, cavity bolt and well sleeve pipe pass through threaded connection, the cavity bolt outer end is equipped with a word counter bore or cross counter bore or interior hexagonal counter bore, the mount opposite side is equipped with the lens pipe, and is equipped with the spotlight lens in the lens pipe, have the internal thread in the lens pipe, be equipped with the external screw thread that matches with the internal thread on the mount, the lens pipe outer end is equipped with a word counter bore or cross counter bore or interior hexagonal counter bore.

2. A laser head according to claim 1, characterized in that: the circuit board upper surface with laser chip flushes with the mount lateral center line, mount one side inner wall is equipped with the standing groove of placing laser chip and no insulated wire, and the mount opposite side has the spring, the spring can support on the condensing lens.

3. A forming die for manufacturing the laser head according to claim 1 or 2, characterized in that: including the lock mould board, link board, quiet template, mold core, movable mould board, biplate and the lower lock mould board that from the top down set gradually, be equipped with many guide posts on the lock mould board, link board, quiet template, movable mould board and biplate on all be equipped with guide post clearance fit's guiding hole, be equipped with multirow die cavity with the laser head matching in the mold core, and the mold core includes quiet mould, movable mould and inner core, quiet mould locates on the quiet template, and the movable mould is located on the movable mould board, is equipped with the recess on the movable mould, and the inner core is located in the recess, the activity is equipped with ejector pin board and roof hole on the lower lock mould board, and be equipped with the ejector pin towards the inner core on the ejector pin board, be equipped with the hole that holds the ejector pin and pass, this hole aims at the ejector pin board, be equipped with the guide block that is used for fixed mold core between quiet template and the movable mould board, quiet template both sides are equipped with the slant guide post, guide block and slant guide post sliding fit, be equipped with the die bar that can insert the die cavity, die bar inner is equipped with and holds laser chip and the insulating wire place, be equipped with the guide pin that keeps away from the guide pin, the guide pin is equipped with the clearance towards the guide pin, one side of die cavity is equipped with the clearance.

4. A molding die according to claim 3, characterized in that: the upper locking template is provided with an injection molding feeding hole, and the connecting plate, the static template and the static mould are provided with flow passages which are communicated with the injection molding feeding hole and the cavity.