CN218593552U

CN218593552U - Plastic package mold for lead frame of two triodes

Info

Publication number: CN218593552U
Application number: CN202222475139.4U
Authority: CN
Inventors: 蔡登标; 陶坚
Original assignee: Changzhou Dingyi Electronics Co ltd
Current assignee: Changzhou Dingyi Electronics Co ltd
Priority date: 2022-09-19
Filing date: 2022-09-19
Publication date: 2023-03-10
Anticipated expiration: 2032-09-19

Abstract

The utility model discloses a two triode lead frame plastic envelope moulds, including die holder, upper die base and buffering subassembly, a plurality of die cavity has been seted up to the top equidistance of die holder, a plurality of recess, a plurality of have been seted up to the bottom equidistance of upper die base four round holes have all been seted up to the inner wall of recess, the buffering subassembly is including running through the screw rod of round hole, setting are in the diaphragm capsule of screw rod bottom, with screw rod threaded connection's nut, cup joint spring and setting on the screw rod are in the hose at diaphragm capsule top. The utility model discloses in, the upper die base that sets up when the butt joint die holder, the spring of buffering subassembly makes the diaphragm capsule have certain buffering effect for the top of two triodes can be hugged closely to the diaphragm capsule, then can be with in the mould box is injected into to the plastic envelope material through the hose, the lead frame at two triode tops of plastic envelope, labour saving and time saving, then the nut that sets up is rotatable breaks away from the screw rod, so that change maintenance buffering subassembly.

Description

Plastic package mold for lead frame of two triodes

Technical Field

The utility model relates to a lead frame plastic envelope technical field specifically is two triode lead frame plastic envelope moulds.

Background

The lead frame is an important composition structure of the two triodes, is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of a bonding material to form an electrical loop, and plays a role of a bridge connected with an external lead. The traditional plastic package mold for the lead frame of the two triodes has the defects that the whole two triodes are subjected to plastic package, so that waste is caused, and meanwhile, the positions of the structure need to be positioned, so that the plastic package difficulty is increased, and certain defects exist.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art or the correlation technique.

Therefore, the utility model discloses the technical scheme who adopts does: two triode lead frame plastic envelope moulds, including die holder, upper die base and buffering subassembly, a plurality of die cavity has been seted up to the top equidistance of die holder, a plurality of recess, a plurality of have been seted up to the bottom equidistance of upper die base four round holes have all been seted up to the inner wall of recess, the buffering subassembly is including running through the screw rod of round hole, setting are in the diaphragm capsule of screw rod bottom, with screw rod threaded connection's nut, cup joint spring and the setting on the screw rod are in the hose at diaphragm capsule top.

Preferably, the top end of the lower die holder is symmetrically provided with two upright posts, and a plurality of clamping grooves are formed in the top end of the lower die holder at equal intervals.

Preferably, the ejection device further comprises an ejection frame, and the ejection frame is connected with the lower die holder in a clamping mode through a clamping groove.

Preferably, the upper die base is provided with a through hole, a long rod is inserted into the through hole, and the upper die base is symmetrically provided with two positioning holes.

Preferably, the buffering assembly further comprises a buffering pad sleeved on the screw rod, and the top end of the buffering pad is connected with the nut in an abutting mode.

Preferably, the screw rod, the adjacent nut and the adjacent spring form a group, and four groups are arranged.

Preferably, the hose is arranged on the upper die base, and the hose is connected with external plastic package material supply equipment.

Preferably, a plurality of the buffer assemblies are arranged on the upper die base at equal intervals.

By adopting the technical scheme, the utility model discloses the beneficial effect who gains does: the utility model provides an upper die base is when butt joint die holder, the spring of buffering subassembly makes the diaphragm capsule have certain buffering effect, make the diaphragm capsule can hug closely the top of two triodes, then can be with in the plastic envelope material injection diaphragm capsule through the hose, the lead frame at two triode tops of plastic envelope, time saving and labor saving, then the rotatable screw rod that breaks away from of nut that sets up, so that change maintenance buffering subassembly, the stock that sets up afterwards can insert in the through-hole, but insert back portable screw rod and stock butt, rotatable nut set screw behind the butt, can keep a plurality of buffering subassembly in same straight line, the ejecting frame that sets up at last can block in the draw-in groove, then remove the two triodes behind the ejecting frame can ejecting plastic envelope, so that the drawing of patterns.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of the lower die holder of FIG. 1 according to the present invention;

fig. 3 is a schematic structural view of the ejector rack of fig. 1 according to the present invention;

FIG. 4 is a schematic view of the upper die base of FIG. 1 according to the present invention;

fig. 5 is a schematic structural view of the buffering assembly of fig. 1 according to the present invention.

Reference numerals:

100. a lower die holder; 110. a mold cavity; 120. a column; 130. a card slot;

200. an ejection frame;

300. an upper die holder; 310. a through hole; 320. a long rod; 330. positioning holes; 340. a groove; 350. a circular hole;

400. a buffer assembly; 410. a mold box; 420. a screw; 430. a cushion pad; 440. a nut; 450. a spring; 460. a hose.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict.

Some embodiments of the present invention provide a mold for molding a two-transistor lead frame with plastic.

The first embodiment is as follows:

referring to fig. 1, 2, 4 and 5, for a first embodiment of the present invention, this embodiment provides a mold for plastic encapsulation of a triode lead frame, which includes a lower die base 100, an upper die base 300 and a buffer assembly 400.

Specifically, a plurality of die cavities 110 are equidistantly formed in the top end of the lower die holder 100, and when the plastic package lead frame is used specifically, the two triodes which are not subjected to plastic package can be conveniently placed in the plurality of die cavities 110, so that the plastic package lead frame is conveniently subjected to plastic package.

Further, two columns 120 are symmetrically arranged at the top end of the lower die holder 100, a plurality of slots 130 are equidistantly formed in the top end of the lower die holder 100, and when the die holder is used specifically, the two columns 120 are matched with the positioning holes 330, so that the upper die holder 300 can be conveniently butted against the lower die holder 100.

Specifically, a plurality of recess 340 has been seted up to the bottom equidistance of upper die base 300, and four round hole 350 have all been seted up to the inner wall of a plurality of recess 340, and when specifically using, recess 340 and round hole 350 are buffer unit 400 easy to assemble.

Specifically, the buffer assembly 400 includes a screw 420 penetrating through the circular hole 350, a mold box 410 disposed at the bottom end of the screw 420, a nut 440 in threaded connection with the screw 420, a spring 450 sleeved on the screw 420, and a hose 460 disposed at the top of the mold box 410, wherein when in specific use, the elasticity of the spring 450 enables the mold box 410 to be tightly attached to the two triodes which are not plastic-encapsulated, so as to plastic-encapsulate the lead frames at the tops of the two triodes.

Further, the buffer assembly 400 further includes a buffer 430 sleeved on the screw rod 420, and a top end of the buffer 430 is connected to the nut 440 in an abutting manner, so that the buffer 430 can reduce wear between the nut 440 and the upper die base 300 in specific use.

Further, the screw 420 is grouped with adjacent nuts 440 and springs 450, for a total of four groups.

Further, the hose 460 is disposed on the upper mold base 300, the hose 460 is connected to an external plastic package material supply device, and in specific use, the hose 460 can transport the plastic package material to the non-plastic-sealed triodes for plastic sealing.

Further, a plurality of buffer assemblies 400 are equidistantly disposed on the upper die base 300.

Example two:

referring to fig. 1 and 3, a second embodiment of the present invention, which is different from the first embodiment, is: the ejection device further comprises an ejection frame 200, the ejection frame 200 is connected with the lower die holder 100 in a clamping mode through the clamping groove 130, and when the ejection device is used specifically, the ejection frame 200 can eject the two triodes after plastic packaging so as to facilitate demolding.

Example three:

referring to fig. 1, a third embodiment of the present invention is different from the first two embodiments: the upper die holder 300 is provided with a through hole 310, a long rod 320 is inserted into the through hole 310, two positioning holes 330 are symmetrically formed in the upper die holder 300, and when the upper die holder is used specifically, the long rod 320 can be inserted into the through hole 310, and the inserted long rod 320 is abutted to the screw 420, so that the buffer assemblies 400 are kept on the same straight line.

The utility model discloses a theory of operation and use flow: during use, firstly, the triodes which are not subjected to plastic packaging are placed in the die cavity 110, then the upper die holder 300 is controlled to move downwards through external pressure equipment, in the moving process, the spring 450 of the buffer assembly 400 enables the die box 410 to be tightly attached to the tops of the triodes, then the plastic packaging material can be injected into the die box 410 through the hose 460, namely, a lead frame at the tops of the triodes can be subjected to plastic packaging, time and labor are saved, when the buffer assembly 400 needs to be disassembled and maintained, the nut 440 can be rotated until the nut 440 is separated from the screw rod 420, so that the buffer assembly 400 can be replaced and maintained, during installation, the long rod 320 can be inserted into the through hole 310, the installed screw rod 420 can be abutted against the bottom of the long rod 320 after being inserted, the nut 440 can be rotated to fix the screw rod 420 after being abutted, so as to keep a plurality of the buffer assemblies 400 in the same straight line, during demolding, the ejection frame 200 is firstly clamped into the clamping groove 130, then the ejection frame 200 is moved, and the triodes subjected to plastic ejection are convenient to demolding.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the claims and their equivalents.

Claims

1. Two triode lead frame plastic envelope moulds, its characterized in that includes:

the die comprises a lower die holder (100), wherein a plurality of die cavities (110) are formed in the top end of the lower die holder (100) at equal intervals;

the die comprises an upper die holder (300), wherein a plurality of grooves (340) are formed in the bottom end of the upper die holder (300) at equal intervals, and four round holes (350) are formed in the inner walls of the grooves (340);

the buffer assembly (400) comprises a screw rod (420) penetrating through the round hole (350), a mold box (410) arranged at the bottom end of the screw rod (420), a nut (440) in threaded connection with the screw rod (420), a spring (450) sleeved on the screw rod (420) and a hose (460) arranged at the top of the mold box (410).

2. The plastic package mold for the lead frame of the triode according to claim 1, wherein two upright posts (120) are symmetrically arranged at the top end of the lower die holder (100), and a plurality of clamping grooves (130) are formed at the top end of the lower die holder (100) at equal intervals.

3. The plastic package mold for the triode lead frame according to claim 1, further comprising an ejection frame (200), wherein the ejection frame (200) is connected with the lower die holder (100) in a clamping manner through a clamping groove (130).

4. The mold for plastic package of a two-transistor lead frame according to claim 1, wherein the upper mold base (300) has a through hole (310), a long rod (320) is inserted into the through hole (310), and the upper mold base (300) has two positioning holes (330) symmetrically formed therein.

5. The mold for plastic package of a two-transistor lead frame according to claim 1, wherein the buffer assembly (400) further comprises a buffer pad (430) sleeved on the screw (420), and a top end of the buffer pad (430) is connected with a nut (440) in an abutting manner.

6. The mold for plastic package of a triode lead frame according to claim 1, wherein the screw (420) and the adjacent nut (440) and spring (450) are in one group, and four groups are provided.

7. The plastic package mold for the triac lead frame according to claim 1, wherein the flexible tube (460) is disposed on the upper mold base (300), and the flexible tube (460) is connected to an external molding compound supply device.

8. The plastic package mold for the two-transistor lead frame according to claim 1, wherein a plurality of the buffer assemblies (400) are equidistantly disposed on the upper mold base (300).