CN219466797U - Semiconductor diode injection molding device - Google Patents
Semiconductor diode injection molding device Download PDFInfo
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- CN219466797U CN219466797U CN202320387104.7U CN202320387104U CN219466797U CN 219466797 U CN219466797 U CN 219466797U CN 202320387104 U CN202320387104 U CN 202320387104U CN 219466797 U CN219466797 U CN 219466797U
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- fixedly connected
- injection molding
- injection
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- workbench
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses a semiconductor diode injection molding device, which belongs to the technical field of diode injection molding and aims at the problem of low injection molding efficiency of semiconductor diodes, and the device comprises a mounting block, wherein a plurality of groups of clamping grooves with uniform intervals are arranged in the mounting block, a plurality of groups of pins are connected to the upper sides of the inner parts of the clamping grooves in a sliding manner, and clamping plates are connected to the lower sides of the inner parts of the clamping grooves in a sliding manner; according to the utility model, the servo cylinder is started, the output end of the servo cylinder extends to enable the connecting plate and the clamping plate to move upwards, so that pins at the inner side of the clamping groove are pushed upwards through the clamping plate, then the first cylinder is started, the output end of the first cylinder extends to push the pins to the guide groove in the placing block through the push plate, the part needing to be injection molded is positioned at the upper side of the injection lower die, then the injection lower die and the injection upper die are matched to carry out injection molding on the part needing to be injection molded, the diode injection molding process is automated through the arrangement, multiple groups of diodes can be injection molded at the same time, and the injection molding efficiency of the injection molding device is greatly improved.
Description
Technical Field
The utility model belongs to the technical field of diode injection molding, and particularly relates to a semiconductor diode injection molding device.
Background
The diode, the most common function of the diode is to allow only one direction to pass and block in the reverse direction, so the diode can be regarded as a check valve of an electronic plate, an injection mold is a tool for producing plastic products, and also a tool for endowing the plastic products with complete structures and precise dimensions, and the injection molding device is required to be used for injection molding in the diode production process.
When manufacturing a diode in the prior art, welding a chip in a lead frame provided with each channel structure, putting the frame connected with the chip into an injection mold, injecting a fluid insulating material into the mold through an injection molding machine, cooling and molding the insulating material, demolding, taking out, cutting to obtain an independent diode product, and fixing a diode pin manually and putting the diode pin into the injection mold for injection molding when the diode is molded.
Therefore, there is a need for a semiconductor diode injection molding apparatus that solves the problem of low injection molding efficiency of semiconductor diodes in the prior art.
Disclosure of Invention
The present utility model is directed to a semiconductor diode injection molding apparatus, which solves the above-mentioned problems.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the semiconductor diode injection molding device comprises a workbench, wherein an automatic feeding mechanism is arranged at the front side of the workbench;
the automatic feeding mechanism comprises a mounting block, the inside draw-in groove that is provided with multiunit interval uniformity of installation piece, the equal sliding connection of the inside upside of draw-in groove has multiunit pin, the equal sliding connection of draw-in groove inside downside has the cardboard, the equal fixedly connected with backup pad in connecting plate roof and evenly distributed of cardboard, both ends equal fixedly connected with backup pad about the workstation bottom, the backup pad is close to the equal fixedly connected with fixed plate in a lateral wall middle part front end mutually, the equal fixedly connected with servo cylinder in fixed plate roof middle part, the equal fixedly connected with L template in upper portion in the installation piece front wall, the equal fixedly connected with first cylinder in both sides about the L template back wall, two sets of fixedly connected with push pedal between the first cylinder output.
In the scheme, the output ends of the servo cylinders are fixedly connected to the left side and the right side of the bottom wall of the connecting plate respectively, and the mounting blocks are fixedly connected to the front end of the top wall of the workbench.
It is further worth to say that workstation roof installation piece rear side fixedly connected with places the piece, it is provided with multiunit evenly distributed's guide way to place the piece roof.
The lower injection mold is fixedly connected to the rear side of the top wall placing block of the workbench, and support rods are fixedly connected to the middle parts of the left side wall and the right side wall of the workbench.
As a preferable implementation mode, two groups of support rods are close to the middle upper part of a side wall and are respectively provided with a sliding groove, sliding blocks are connected inside the sliding grooves in a sliding mode, and the sliding blocks are respectively and fixedly connected to the middle parts of the left side wall and the right side wall of the injection upper die.
As a preferred implementation mode, a top plate is fixedly connected between the two groups of support rods, second cylinders are fixedly connected to the left side and the right side of the bottom wall of the top plate, and output ends of the second cylinders are respectively and fixedly connected to the left side and the right side of the top wall of the injection upper die.
Compared with the prior art, the injection molding device for the semiconductor diode provided by the utility model at least comprises the following beneficial effects:
through starting servo cylinder, servo cylinder output extension makes connecting plate and cardboard upwards move to upwards push up the inboard pin of draw-in groove through the cardboard and move, later start first cylinder, first cylinder output extension pushes away the pin through the push pedal and places the intraductal guide way of piece, and make it need mould plastics the position and be in the lower mould upside of moulding plastics, later mould plastics it through the lower mould of moulding plastics and mould cooperation on moulding plastics, make diode injection process automation through this kind of setting, and can mould plastics the multiunit diode simultaneously, the injection molding efficiency of injection molding device has been improved greatly.
Drawings
FIG. 1 is a schematic front perspective view of the present utility model;
FIG. 2 is a schematic rear perspective view of the present utility model;
fig. 3 is a schematic top perspective view of the present utility model.
In the figure: 1. a work table; 2. an automatic feeding mechanism; 3. a support plate; 4. a fixing plate; 5. a servo cylinder; 6. a connecting plate; 7. a clamping plate; 8. a mounting block; 9. a clamping groove; 10. pins; 11. an L-shaped plate; 12. a first cylinder; 13. a push plate; 14. placing a block; 15. a guide groove; 16. injection molding of a lower die; 17. injection molding an upper die; 18. a support rod; 19. a slide block; 20. a chute; 21. a top plate; 22. and a second cylinder.
Description of the embodiments
The utility model is further described below with reference to examples.
Referring to fig. 1-3, the utility model provides a semiconductor diode injection molding device, which comprises a workbench 1, wherein an automatic feeding mechanism 2 is arranged at the front side of the workbench 1;
the automatic feeding mechanism 2 comprises a mounting block 8, the inside draw-in groove 9 that is provided with multiunit interval uniformity of the mounting block 8, the equal sliding connection of the inside upside of draw-in groove 9 has multiunit pin 10, a diode is constituteed to the inside pin 10 of two sets of adjacent draw-in grooves 9, the equal sliding connection of downside has cardboard 7 in the draw-in groove 9, cardboard 7 can upwards slide and make pin 10 follow the inside ejecting of draw-in groove 9, cardboard 7 equal fixed connection is at connecting plate 6 roof and evenly distributed, both ends are equal fixedly connected with backup pad 3 about workstation 1 bottom, backup pad 3 can support fixedly to workstation 1, backup pad 3 is close to a lateral wall middle part front end all fixedly connected with fixed plate 4 mutually, fixed plate 4 can fix servo cylinder 5, equal fixedly connected with servo cylinder 5 in fixed plate 4 roof middle part, upper portion fixedly connected with L template 11 in the front wall of installation piece 8, both sides fixedly connected with first cylinder 12 about the L template 11 back wall, fixedly connected with push pedal 13 between the output of two sets of first cylinder 12, push pedal 13 moves backward in the push pedal 13 removal process can promote pin 10 backward.
Further, as shown in fig. 1, 2 and 3, it is worth specifically explaining that the output ends of the servo cylinders 5 are respectively and fixedly connected to the left side and the right side of the bottom wall of the connecting plate 6, the connecting plate 6 can fix the clamping plate 7, and the mounting block 8 is fixedly connected to the front end of the top wall of the workbench 1.
Further, as shown in fig. 3, it is worth specifically explaining that the rear side of the top wall mounting block 8 of the workbench 1 is fixedly connected with a placement block 14, the top wall of the placement block 14 is provided with a plurality of groups of guide grooves 15 which are uniformly distributed, the placement block 14 can support the diode, and the guide grooves 15 can guide the diode.
The scheme comprises the following working processes: when the semiconductor diode is required to be injection molded, the servo cylinder 5 is started firstly, the output end of the servo cylinder 5 extends to enable the connecting plate 6 and the clamping plate 7 to move upwards, so that the pin 10 at the inner side of the clamping groove 9 is pushed upwards through the clamping plate 7, then the first cylinder 12 is started, the output end of the first cylinder 12 extends to push the pin 10 at the upper side to the guide groove 15 in the placing block 14 through the push plate 13, the part required to be injection molded is located at the upper side of the injection molding lower die 16, then the second cylinder 22 is started, and the output end of the second cylinder 22 extends to enable the injection molding upper die 17 to be matched with the injection molding lower die 16, so that the diode can be injection molded.
The working process can be as follows: the whole injection molding process of the diode can be automated through the cooperation of the servo cylinder 5, the connecting plate 6, the clamping plate 7, the clamping groove 9, the mounting block 8, the fixing plate 4 and the L-shaped plate 11 and the placing block 14, and meanwhile, the method is suitable for mass production, and the production rate of the diode is greatly improved.
Further, as shown in fig. 1, 2 and 3, it is worth specifically explaining that the rear side of the top wall placing block 14 of the workbench 1 is fixedly connected with an injection lower mold 16, the middle parts of the left and right side walls of the workbench 1 are fixedly connected with support rods 18, and the injection lower mold 16 and the injection upper mold 17 cooperate to form an injection cavity therein.
Further, as shown in fig. 1, it is worth specifically explaining that the two groups of support rods 18 are close to the middle upper portion of a side wall and are respectively provided with a sliding groove 20, sliding blocks 19 are slidably connected inside the sliding grooves 20, the sliding blocks 19 are respectively and fixedly connected to the middle portions of the left side wall and the right side wall of the injection upper die 17, and the sliding blocks 19 and the sliding grooves 20 are matched to enable the injection upper die 17 to move more stably.
Further, as shown in fig. 1, it is worth specifically explaining that the top between the two groups of support rods 18 is fixedly connected with a top plate 21, both the left side and the right side of the bottom wall of the top plate 21 are fixedly connected with second cylinders 22, the output ends of the second cylinders 22 are respectively and fixedly connected to the left side and the right side of the top wall of the injection upper die 17, and the output ends of the second cylinders 22 extend to enable the injection upper die 17 to be driven to move downwards.
To sum up: the injection lower die 16 and the injection upper die 17 are matched to form an injection cavity in the injection lower die, the sliding block 19 and the sliding groove 20 are matched to enable the injection upper die 17 to move more stably, and the output end of the second air cylinder 22 extends to enable the injection upper die 17 to be driven to move downwards.
Claims (6)
1. The utility model provides a semiconductor diode injection molding device, includes workstation (1), its characterized in that: an automatic feeding mechanism (2) is arranged at the front side of the workbench (1);
automatic feed mechanism (2) are including installation piece (8), inside draw-in groove (9) that are provided with multiunit interval uniformity, the equal sliding connection of the inside upside of draw-in groove (9) has multiunit pin (10), equal sliding connection of draw-in groove (9) inside downside has cardboard (7), cardboard (7) equal fixedly connected with backup pad (3) in connecting plate (6) roof and evenly distributed, both ends are all fixedly connected with backup pad (3) about workstation (1) bottom, backup pad (3) are close to one lateral wall middle part front end all fixedly connected with fixed plate (4) mutually, all fixedly connected with servo cylinder (5) in fixed plate (4) roof middle part, upper portion fixedly connected with L template (11) in installation piece (8) front wall, both sides all fixedly connected with first cylinder (12) about the L template (11), two sets of fixedly connected with push pedal (13) between first cylinder (12) output.
2. A semiconductor diode injection molding apparatus as claimed in claim 1, wherein: the output ends of the servo cylinders (5) are respectively and fixedly connected to the left side and the right side of the bottom wall of the connecting plate (6), and the mounting blocks (8) are fixedly connected to the front end of the top wall of the workbench (1).
3. A semiconductor diode injection molding apparatus as claimed in claim 1, wherein: the workbench is characterized in that a placement block (14) is fixedly connected to the rear side of the top wall mounting block (8) of the workbench (1), and a plurality of groups of guide grooves (15) which are uniformly distributed are formed in the top wall of the placement block (14).
4. A semiconductor diode injection molding apparatus as claimed in claim 1, wherein: the back side of the top wall placing block (14) of the workbench (1) is fixedly connected with an injection lower die (16), and the middle parts of the left side wall and the right side wall of the workbench (1) are fixedly connected with supporting rods (18).
5. The semiconductor diode injection molding apparatus of claim 4, wherein: the two groups of supporting rods (18) are close to the middle upper part of one side wall and are respectively provided with a sliding groove (20), sliding blocks (19) are connected inside the sliding grooves (20) in a sliding mode, and the sliding blocks (19) are respectively and fixedly connected to the middle parts of the left side wall and the right side wall of the injection upper die (17).
6. The semiconductor diode injection molding apparatus of claim 4, wherein: top fixedly connected with roof (21) between two sets of bracing piece (18), roof (21) diapire left and right sides all fixedly connected with second cylinder (22), second cylinder (22) output is fixed connection respectively in mould (17) roof left and right sides on moulding plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320387104.7U CN219466797U (en) | 2023-03-06 | 2023-03-06 | Semiconductor diode injection molding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320387104.7U CN219466797U (en) | 2023-03-06 | 2023-03-06 | Semiconductor diode injection molding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219466797U true CN219466797U (en) | 2023-08-04 |
Family
ID=87465615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320387104.7U Active CN219466797U (en) | 2023-03-06 | 2023-03-06 | Semiconductor diode injection molding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219466797U (en) |
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2023
- 2023-03-06 CN CN202320387104.7U patent/CN219466797U/en active Active
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