CN214111208U - Injection mold is used in production of windshield wiper circuit substrate - Google Patents

Injection mold is used in production of windshield wiper circuit substrate Download PDF

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Publication number
CN214111208U
CN214111208U CN202023082403.5U CN202023082403U CN214111208U CN 214111208 U CN214111208 U CN 214111208U CN 202023082403 U CN202023082403 U CN 202023082403U CN 214111208 U CN214111208 U CN 214111208U
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cavity
template
mold
circuit substrate
pipeline
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CN202023082403.5U
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Chinese (zh)
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黄道锡
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Jiangsu Zento Electronic Co ltd
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Jiangsu Zento Electronic Co ltd
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Abstract

The utility model discloses an injection mold for wiper circuit substrate production, an upper fixed plate, a front template, a rear template, a lower fixed plate, an injection pipeline arranged in the middle position of the front template and used for conveying raw materials, a cavity module arranged at the feeding end of the injection pipeline and used for providing an injection cavity of a wiper circuit substrate finished product, a cooling pipeline arranged in the front template and the rear template and used for accelerating injection molding, a buffer module arranged below the cavity module and above the lower fixed plate and used for supporting the cavity module and playing a buffering role in pressing the cavity module, and a forced return device arranged on the front template, the rear template and the lower fixed plate and used for forcibly returning the mold, wherein a feeding hole connected with the injection pipeline is arranged in the middle position of the upper fixed plate; the beneficial effects of the utility model are that, can be equipped with in the outside of mould and force return means to the better injection moulding that carries on of wiper circuit substrate, can force the return to the mould, the use under the multiple condition of being convenient for.

Description

Injection mold is used in production of windshield wiper circuit substrate
Technical Field
The utility model relates to a technical field, especially injection mold is used in wiper circuit substrate production of moulding plastics.
Background
In recent years, with the demands for higher performance and smaller size of electronic devices, demands for higher density and higher functionality of semiconductors have been further advanced, and thus circuit boards for packaging semiconductors have been demanded to be smaller and higher density, and as a result, the demands for injection molding have been increasing.
In view of the above, there is a need for an improved injection mold that can accommodate the needs of the wiper circuit substrate.
SUMMERY OF THE UTILITY MODEL
Because the existing mold for injection molding of the wiper circuit substrate cannot meet the injection molding requirement of the wiper circuit substrate, the injection mold for production of the wiper circuit substrate is designed on the basis of the defects of the prior art, the wiper circuit substrate can be well injected, and one mold and two cavities are adopted, so that the efficiency is higher.
The technical scheme of the utility model is that the injection mold for producing the wiper circuit substrate is provided with an upper fixed plate, a front template, a rear template and a lower fixed plate in sequence; further comprising:
the injection molding pipeline is arranged in the middle of the front template and used for conveying raw materials;
the cavity module is arranged at the feeding tail end of the injection pipeline and is used for providing an injection molding cavity for the finished wiper circuit substrate product;
the cooling pipeline is arranged in the front template and the rear template and used for accelerating injection molding, cooling and shaping;
the buffer module is arranged below the cavity module and above the lower fixing plate and used for supporting the cavity module and simultaneously playing a buffer role in pressing the cavity module;
the forced return device is arranged on the front template, the rear template and the lower fixing plate and is used for forcibly returning the mold;
wherein, the middle position of an upper fixing plate is provided with a feed port connected with an injection molding pipeline.
In addition to the scheme, the injection molding pipeline comprises a funnel seat, a feeding pipe arranged below the funnel seat, a main pipeline connected with one side of the feeding pipe, which is far away from the funnel seat, and branch pipelines arranged on the side surfaces of the main pipeline; the funnel seat sets up under the feed port and rather than the intercommunication, inlet pipe and funnel seat intercommunication, trunk line, branch pipeline are seted up on the die cavity module.
In addition to the further supplement of the scheme, the cavity module comprises a front die insert and a rear die insert, and the front die insert and the rear die insert are respectively embedded in the front template and the rear template; the rear die insert is provided with a cavity; the end part of the branch pipeline is aligned to the cavity, and a groove is formed in the position, corresponding to the cavity in the rear die insert, of the front die insert; the cavity position on the cavity after the groove and the cavity are combined is the appearance of an injection molding product, and a thimble is arranged below the cavity; one end of the ejector pin is arranged below the cavity position of the cavity, and the other end of the ejector pin is arranged on the buffering module.
The scheme is further supplemented, a front mold core is arranged on the side face, located in the groove, of the front mold insert, and a rear mold core is arranged on the side face, located in the cavity, of the rear mold insert.
The scheme is further supplemented, the cooling pipeline comprises an upper cooling pipeline and a lower cooling pipeline which are not communicated with each other, the upper cooling pipeline and the lower cooling pipeline are both one-way pipes, and cooling liquid enters from one end and flows out from the other end; the upper cooling pipeline is arranged on the front die insert, and the lower cooling pipeline is arranged on the rear die insert.
The scheme is further supplemented, and the buffer module comprises a plurality of cushion blocks, a support plate arranged above the cushion blocks, a support column arranged above the support plate and a spring sleeved on the support column; the four cushion blocks are arranged on the periphery of the lower fixing plate, the cushion blocks are fixedly arranged on the lower fixing plate, one ends of the supporting columns are fixedly arranged on the supporting plate, and the other ends of the supporting columns are arranged below the front template; the support column penetrates through the upper surface and the lower surface of the rear template, one end of the spring abuts against the lower part of the rear template, and the other end of the spring abuts against the support plate.
Further supplement to this scheme, the backup pad both sides are equipped with the mould foot, the mould foot is installed between back template, bottom plate.
The scheme is further supplemented, and the forced return device comprises a forced return rod, a connecting rod and a supporting block; the forced return rod abuts against the front template, the rear template and the supporting plate, the forced return rod is installed on the front template through a bolt, a limiting block is arranged on one side, located on the forced return rod, of the rear template, the limiting block is fixedly installed on the rear template, the connecting rod is installed on the rear template through a bolt, and the supporting block is installed on the supporting plate and abuts against one side, far away from the limiting block, of the forced return rod.
The windshield wiper circuit substrate has the advantages that the special mold is designed aiming at different shapes and sizes of the existing windshield wiper circuit substrate, the windshield wiper circuit substrate can be better subjected to injection molding, and compared with the existing mold, the utility model is provided with the forced return device outside the mold, can be used for forcibly returning the mold, and is convenient to use under various conditions; and set up buffering module and cooling line, the buffering module can insert the effect of the at work buffering pressure to front mould and back mould, and the cooling line can insert the during work refrigerated effect to front mould, back mould to accelerate product injection moulding's speed.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the installation structure of the front mold insert and the rear mold insert of the present invention;
fig. 3 is a first angle schematic view of the rear die insert mounting structure of the present invention;
fig. 4 is a second angle schematic view of the rear die insert mounting structure of the present invention;
fig. 5 is a third angle schematic diagram of the rear die insert mounting structure of the present invention;
FIG. 6 is a schematic view of the installation structure of the front mold insert and the cavity of the present invention;
in the figure, 1, an upper fixing plate; 11. a feed port; 2. a front template; 3. a rear template; 4. a lower fixing plate; 51. a funnel base; 52. a feed pipe; 53. a main pipeline; 54. dividing pipelines; 61. a front die insert; 611. a front mold core; 62. a rear die insert; 621. a cavity; 622. a rear mold core; 63. a thimble; 7. a cooling pipeline; 71. an upper cooling pipeline; 72. a lower cooling line; 81. cushion blocks; 82. a support plate; 83. a support pillar; 84. a spring; 85. a mould leg; 91. a forced return rod; 92. a connecting rod; 93. a support block; 94. and a limiting block.
Detailed Description
It should be noted that, the utility model discloses the mould is used for processing wiper circuit substrate, also exists on this wiper circuit substrate market, but its specification and shape differ, can't be suitable for all wiper circuit substrate's use, and the utility model discloses a special injection mold to the design of wiper circuit substrate in the scheme.
The technical solution of the present invention will be explained in detail with reference to the accompanying drawings 1-6:
the utility model discloses current including upper fixed plate 1, front mould board 2, back template 3 and bottom plate 4, these are all current structures, the utility model discloses mainly include 5 parts, the pipeline of moulding plastics, the die cavity module, cooling pipeline 7, buffer module and force return means, the middle part position of top end plate is offered and is supplied the feed port 11 that the pipeline of moulding plastics cross-under connects, wherein mould plastics pipeline and die cavity module are the utility model discloses a core structure can realize the injection moulding of product; the injection molding pipeline can convey raw materials to the cavity module, the cavity module is used for performing injection molding on products, the cooling pipeline 7 is used for cooling and accelerating the injection molding of the products, and the buffer module can play a certain buffer role in the operation of the cavity module; the forced return device is used for forcibly returning the die to work, so that emergency is facilitated; the following will explain the main parts of the present invention in detail:
1. the injection molding pipeline comprises a hopper seat 51, a feeding pipe 52 arranged below the hopper seat 51, a main pipeline 53 connected with one side of the feeding pipe 52 far away from the hopper seat 51, and a branch pipeline 54 arranged on the side surface of the main pipeline 53; the hopper seat 51 is arranged right below the feeding hole 11 and communicated with the feeding hole, the feeding pipe 52 is communicated with the hopper seat 51, the main pipeline 53 and the branch pipeline 54 are arranged on the cavity module, the branch pipeline is connected with the cavity module and used for directly conveying raw materials into the cavity module, the main pipeline 53 is communicated with the branch pipeline 54, the raw materials firstly enter from the feeding hole 11, then enter into the feeding pipe 52 through the hopper seat 51, then enter into the main feeding pipe 53 and then are divided into the branch pipeline 54; the four branch pipelines 54 are symmetrically extended to two sides from the main pipeline 53, so that the cavity module can be better injected.
2. The die cavity module comprises a front die insert 61 and a rear die insert 62, and the front die insert 61 and the rear die insert 62 are respectively embedded in the front template 2 and the rear template 3; the rear die insert block 62 is provided with a die cavity 621; the end of the branch pipe 54 is aligned with the cavity 621, wherein the main pipe 53 and the branch pipe 54 are pipe grooves formed on the rear die insert 62 and can flow raw materials into the cavity 621; a groove (not shown) is arranged on the front die insert 61 at a position corresponding to the cavity 621 of the rear die insert 62; the cavity position on the cavity 621 after the groove is combined with the cavity 621 is the product appearance of injection molding, namely, the raw material flows into the cavity through the branch pipe 54, the raw material has the same appearance as the cavity, then the product is formed after the raw material is cooled, and finally the product is taken out after the front die insert 61 and the rear die insert 62 are opened; in order to open the mold and take out the product better, a thimble 63 is arranged below the cavity 621; one end of the thimble 63 is arranged below the cavity position of the cavity 621, and the other end is arranged on the buffer module; the ejector pin 63 can eject a product formed in the cavity 621; if the cavity 621 is directly installed in the rear mold insert 62, the positioning and fixing effect of the cavity 621 is not good, so that a rear mold core 622 is arranged on the side surface, located on the cavity 621, of the rear mold insert 62, and is used for better positioning of the cavity 621; wherein a front core 611 is mounted on the front insert 61 at the side of the recess in order to correspond to the rear core 622 on the rear insert 62.
3. The cooling pipeline 7 is used for conveying raw materials to the cavity 621 during injection molding, the product can be produced only after the raw materials are cooled and molded, but normal natural cooling is achieved, the efficiency is low, and the effect is poor, so that the cooling pipeline 7 is designed on the cavity module, the number of the cooling pipelines 7 is two, namely the upper cooling pipeline 71 and the lower cooling pipeline 72, the upper cooling pipeline 71 is installed on the front die insert 61, the lower cooling pipeline 72 is installed on the rear die insert 62, the upper cooling pipeline 71 and the lower cooling pipeline 72 are not communicated with each other, the upper cooling pipeline 71 and the lower cooling pipeline 72 are both one-way pipes, cooling liquid enters from one end and flows out from the other end, and cooling media can be selected according to needs.
4. The buffer module is designed to prolong the service life of the die and reduce loss, and comprises a plurality of cushion blocks 81, a supporting plate 82 arranged above the cushion blocks 81, supporting columns 83 arranged above the supporting plates 82 and springs 84 sleeved on the supporting columns 83; four cushion blocks 81 are arranged on the periphery of the lower fixing plate 4, the cushion blocks 81 are fixedly arranged on the lower fixing plate 4, the cushion blocks 81 are made of hard elastic rubber pads, a good buffering effect can be achieved, the arrangement number and the positions of the support columns 83 are the same as those of the cushion blocks 81, one ends of the support columns 83 are fixedly arranged on the support plate 82, and the other ends of the support columns 83 are arranged below the front template 2; the supporting column 83 penetrates through the upper surface and the lower surface of the rear template 3, one end of the spring 84 abuts against the lower part of the rear template 3, and the other end abuts against the supporting plate 82; the spring 84 can play a certain role in buffering and decompressing the rear template 3, and because the front die insert 61 can slightly impact the rear die insert 62 when pressed downwards, the number of the slight impact can be omitted, but once the number of the slight impact is large, the mold can be greatly worn, the service life of the mold can be seriously shortened for a long time, and therefore a buffering module is designed; the two opposite sides of the buffer module are exposed outside during operation, the space between the rear template 3 and the lower fixing plate 4 is hollow, in order to protect the two sides of the buffer module and design a connecting surface between the rear template 3 and the lower fixing plate 4, the two sides of the supporting plate 82 are provided with mold feet 85, and the mold feet 85 are arranged between the rear template 3 and the lower fixing plate 4.
5. Forced returning devices are designed, and comprise forced returning rods 91, connecting rods 92 and supporting blocks 93; the forced return rod 91 is abutted against the front template 2, the rear template 3 and the supporting plate 82, one end of the forced return rod 91 is installed on the front template 2 through a bolt, the other end of the forced return rod is fixedly installed on the supporting plate 82, a limiting block 94 is arranged on one side, located on the forced return rod 91, of the rear template 3 and used for primarily limiting the forced return rod 91, the limiting block 94 is fixedly installed on the rear template 3, the connecting rod 92 is installed on the rear template 3 through a bolt, the supporting block 93 is installed on the supporting plate 82 and abutted against one side, far away from the limiting block 94, of the forced return rod 91 and can play a role of limiting the forced return rod 91 again, wherein in a normal working state, the connecting rod 92 is vertically placed, when forced return is needed, the other end of the connecting rod 92 is tightly pressed on the supporting block 93 and abutted against the forced return rod 91, and the forced return rod 91 is pressed by the forced return rod 91, The connecting rod 92 and the supporting block 93 can be used for forcibly closing the die, so that people can use the die conveniently in emergency.
Above-mentioned technical scheme has only embodied the utility model discloses technical scheme's preferred technical scheme, some changes that this technical field's technical personnel probably made to some parts wherein have all embodied the utility model discloses a principle belongs to within the protection scope of the utility model.

Claims (9)

1. The injection mold for producing the wiper circuit substrate is sequentially provided with an upper fixing plate, a front template, a rear template and a lower fixing plate; it is characterized by also comprising:
the injection molding pipeline is arranged in the middle of the front template and used for conveying raw materials;
the cavity module is arranged at the feeding tail end of the injection pipeline and is used for providing an injection molding cavity for the finished wiper circuit substrate product;
the cooling pipeline is arranged in the front template and the rear template and used for accelerating injection molding, cooling and shaping;
the buffer module is arranged below the cavity module and above the lower fixing plate and used for supporting the cavity module and simultaneously playing a buffer role in pressing the cavity module;
the forced return device is arranged on the front template, the rear template and the lower fixing plate and is used for forcibly returning the mold;
wherein, the middle position of an upper fixing plate is provided with a feed port connected with an injection molding pipeline.
2. The injection mold for producing the wiper circuit substrate according to claim 1, wherein the injection pipeline comprises a hopper base, a feed pipe arranged below the hopper base, a main pipeline connected with one side of the feed pipe away from the hopper base, and branch pipelines arranged on the side surfaces of the main pipeline; the funnel seat sets up under the feed port and rather than the intercommunication, inlet pipe and funnel seat intercommunication, trunk line, branch pipeline are seted up on the die cavity module.
3. The injection mold for producing the wiper circuit substrate according to claim 2, wherein the cavity module comprises a front mold insert and a rear mold insert, and the front mold insert and the rear mold insert are respectively embedded in the front mold plate and the rear mold plate; the rear die insert is provided with a cavity; the end part of the branch pipeline is aligned to the cavity, and a groove is formed in the position, corresponding to the cavity in the rear die insert, of the front die insert; the cavity position on the cavity after the groove and the cavity are combined is the appearance of an injection molding product, and a thimble is arranged below the cavity; one end of the ejector pin is arranged below the cavity position of the cavity, and the other end of the ejector pin is arranged on the buffering module.
4. The injection mold for producing a wiper circuit substrate according to claim 3, wherein a front core is mounted on the front core block on a side surface of the recess.
5. The injection mold for producing a wiper circuit substrate according to claim 4, wherein the cooling line comprises an upper cooling line and a lower cooling line which are not communicated with each other, the upper cooling line and the lower cooling line are both one-way pipes, and the cooling liquid enters from one end and flows out from the other end; the upper cooling pipeline is arranged on the front die insert, and the lower cooling pipeline is arranged on the rear die insert.
6. The injection mold for producing the wiper circuit substrate according to claim 3, wherein the cushion module comprises a plurality of cushion blocks, a support plate disposed above the cushion blocks, a support pillar disposed above the support plate, and a spring fitted over the support pillar; the four cushion blocks are arranged on the periphery of the lower fixing plate, the cushion blocks are fixedly arranged on the lower fixing plate, one ends of the supporting columns are fixedly arranged on the supporting plate, and the other ends of the supporting columns are arranged below the front template; the support column penetrates through the upper surface and the lower surface of the rear template, one end of the spring abuts against the lower part of the rear template, and the other end of the spring abuts against the support plate.
7. The injection mold for producing a wiper circuit substrate according to claim 6, wherein the support plate is provided at both sides thereof with mold legs, the mold legs being installed between the rear mold plate and the lower fixing plate.
8. The injection mold for producing a wiper circuit substrate according to claim 7, wherein the forced returning means comprises a forced returning rod, a connecting rod, a supporting block; the forced return rod abuts against the front template, the rear template and the supporting plate, the forced return rod is installed on the front template through a bolt, a limiting block is arranged on one side, located on the forced return rod, of the rear template, the limiting block is fixedly installed on the rear template, the connecting rod is installed on the rear template through a bolt, and the supporting block is installed on the supporting plate and abuts against one side, far away from the limiting block, of the forced return rod.
9. The injection mold for producing a wiper circuit substrate according to claim 3, wherein a rear core is provided on the rear core block on the side of the cavity.
CN202023082403.5U 2020-12-18 2020-12-18 Injection mold is used in production of windshield wiper circuit substrate Active CN214111208U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202023082403.5U CN214111208U (en) 2020-12-18 2020-12-18 Injection mold is used in production of windshield wiper circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202023082403.5U CN214111208U (en) 2020-12-18 2020-12-18 Injection mold is used in production of windshield wiper circuit substrate

Publications (1)

Publication Number Publication Date
CN214111208U true CN214111208U (en) 2021-09-03

Family

ID=77513074

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202023082403.5U Active CN214111208U (en) 2020-12-18 2020-12-18 Injection mold is used in production of windshield wiper circuit substrate

Country Status (1)

Country Link
CN (1) CN214111208U (en)

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