JPH0124612B2 - - Google Patents
Info
- Publication number
- JPH0124612B2 JPH0124612B2 JP56088282A JP8828281A JPH0124612B2 JP H0124612 B2 JPH0124612 B2 JP H0124612B2 JP 56088282 A JP56088282 A JP 56088282A JP 8828281 A JP8828281 A JP 8828281A JP H0124612 B2 JPH0124612 B2 JP H0124612B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- molding
- gate
- vent
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 238000001721 transfer moulding Methods 0.000 description 16
- 239000012778 molding material Substances 0.000 description 12
- 238000001746 injection moulding Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000010107 reaction injection moulding Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- -1 Diaryl phthalate Chemical compound 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0061—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the material feeding channel
- B29C33/0066—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the material feeding channel with a subdivided channel for feeding the material to a plurality of locations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2708—Gates
- B29C2045/2712—Serial gates for moulding articles in successively filled serial mould cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
- B29C67/246—Moulding high reactive monomers or prepolymers, e.g. by reaction injection moulding [RIM], liquid injection moulding [LIM]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
本発明は、熱硬化性樹脂成形材料（以下成形材
料と略記する）のインジエクシヨン成形、トラン
スフア成形又は反応射出成形（RIM）若しくは
液体射出成形（LIM）に用いる成形用金型に関
する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to molding materials used for injection molding, transfer molding, reaction injection molding (RIM), or liquid injection molding (LIM) of thermosetting resin molding materials (hereinafter abbreviated as molding materials). Regarding molds.
従来、成形材料の成形にはコンプレツシヨン、
トランスフア、インジエクシヨンなどの成形法が
採用されているが、その中でトランスフア又はイ
ンジエクシヨン成形法が能率的である。成形材料
の中で比較的流動性の良いジアリルフタレート、
不飽和ポリエステル、エポキシ樹脂などの成形材
料は、比較的大形で流動距離の長い成形品を有効
に成形することが可能である。一方、最近の
RIM又はLIM成形法は、流動性が極めて良い材
料で比較的小物の成形品を大量生産するのに有効
である。また最近のICやLSIなどの半導体装置の
樹脂封止ではエポキシ樹脂のトランスフア成形法
が主流をなしている。 Conventionally, compression,
Molding methods such as transfer and injection molding are employed, and among these, the transfer or injection molding method is the most efficient. Diaryl phthalate has relatively good fluidity among molding materials.
Molding materials such as unsaturated polyester and epoxy resin are capable of effectively molding relatively large molded products with a long flow distance. On the other hand, recent
The RIM or LIM molding method is effective for mass producing relatively small molded products using materials with extremely good fluidity. Furthermore, in recent years, transfer molding of epoxy resin has become mainstream for resin encapsulation of semiconductor devices such as ICs and LSIs.
しかしながら、この種の流動性のよい成形材料
のトランスフア及びインジエクシヨン成形法にお
いては、成形材料の流動性が良いために凹凸の激
しい部分に空気などのガスが溜まり、成形品が充
填不足となることが多く、特に小物の成形品では
微小な欠陥でも問題になることが多いので解決が
望まれている。 However, in this type of transfer and injection molding method using molding materials with good fluidity, gases such as air may accumulate in areas with severe irregularities due to the fluidity of the molding materials, resulting in insufficient filling of the molded product. Especially in small molded products, even minute defects often cause problems, so a solution is desired.
また、成形材料の流動性が良いことを利用して
ランナーの長い多数個取りの成形品を得る場合
に、成形品が小物であるとランナー部分の材料ロ
ス割合が大きくなるという欠点もあつた。 In addition, when using the good fluidity of the molding material to obtain a multi-piece molded product with long runners, there is also a drawback that if the molded product is small, the rate of material loss in the runner portion becomes large.
このような傾向は最近のICやLSIなどの半導体
装置の樹脂封止の際にも共通する問題点であり、
特に今後装置の小形化が必至とみられる半導体業
界において、それらの問題点の解決が迫られてい
る。 This trend is a common problem in recent resin encapsulation of semiconductor devices such as ICs and LSIs.
Particularly in the semiconductor industry, where it seems inevitable that equipment will become smaller in the future, solutions to these problems are urgently needed.
上記問題点の解決法の一つとして、エアーベン
トを金型のパーテイング面に比較的大きくつける
か、溶融した成形材料が流出する程度の「ベント
兼用溜め」をつけるなどの方法が採用されてきた
が、これらの方法では必然的にバリの多い成形品
となり、金型寿命、バリ取り工数の増加など生産
コスト面にマイナスの要素となることが多かつ
た。 As one of the solutions to the above problems, methods have been adopted such as installing a relatively large air vent on the parting surface of the mold, or installing a "vent-cum-reservoir" that is large enough to allow the molten molding material to flow out. However, these methods inevitably result in molded products with a lot of burrs, which often has negative effects on production costs, such as increased die life and increased deburring man-hours.
本発明の目的は、上記のような充填不足、必要
以上のバリの発生、ランナー部分の材料ロスなど
を極めて少くして成形品を成形できる金型を提供
することである。 An object of the present invention is to provide a mold that can mold a molded product while minimizing the above-mentioned insufficient filling, occurrence of more burrs, and material loss in the runner portion.
即ち本発明は、多数個取り又はフアミリーモー
ルドの熱硬化性樹脂成形用金型において、ランナ
ーに直結したゲートの少くとも１つに２個以上の
キヤビテイを直列に配置し、上記キヤビテイ間を
フイルム状のベント兼ゲートで連結することを特
徴とする成形用金型である。 That is, the present invention provides a multi-cavity mold or family mold mold for thermosetting resin, in which two or more cavities are arranged in series in at least one of the gates directly connected to the runner, and a film-like film is formed between the cavities. This mold is characterized by being connected by a vent/gate.
また本発明の金型は、従来の帯状リードフレー
ムを複数同一平面内に並列に一体化した形状のリ
ードフレームを用いることができるように構成
し、半導体装置の樹脂封止に使用できる。 Further, the mold of the present invention is configured so that a lead frame having a shape in which a plurality of conventional strip-shaped lead frames are integrated in parallel in the same plane can be used, and can be used for resin sealing of semiconductor devices.
一般に成形品の容積がＡcm3であるときにそのゲ
ートの断面積Ｂmm2は、
Ｂ＝（１〜３）Ａ／５の範囲に選択される。例え
ば、10cm3の成形品のゲートとしては、２〜６mm2の
断面積をもつものであり、幅５mm程度でその深さ
は0.4〜1.2mmの範囲である。10cm3の成形品の寸法
が幅20mm、長さ30mm、厚さ16.7mmであるとする
と、ゲートがつけられる成形品幅寸法20mmに対し
てゲート幅寸法は前記のとおり５mmであつて、ゲ
ート左右の死角におけるガスを十分に逃がすこと
ができない。本願発明でいうベント兼ゲートは、
成形品幅寸法20mmに対して実質的に同寸法の20mm
幅にして、ゲートの深さを0.1〜0.3mmの範囲とな
るようにされる。換言をすれば、材料の流動方向
にかかる成形品幅に関してガス溜り死角がないよ
うにゲート幅が選択されることを意味する。 Generally, when the volume of the molded product is Acm 3 , the cross-sectional area Bmm 2 of the gate is selected within the range of B=(1-3)A/5. For example, a gate for a 10 cm 3 molded product has a cross-sectional area of 2 to 6 mm 2 , a width of about 5 mm, and a depth of 0.4 to 1.2 mm. Assuming that the dimensions of a 10 cm 3 molded product are 20 mm wide, 30 mm long, and 16.7 mm thick, the width of the molded product to which the gate is attached is 20 mm, and the gate width is 5 mm as described above. Gas in blind spots cannot escape sufficiently. The vent/gate referred to in the present invention is
20mm, which is essentially the same size as the molded product width of 20mm
The width and depth of the gate are set to be in the range of 0.1 to 0.3 mm. In other words, it means that the gate width is selected so that there is no dead area for gas accumulation with respect to the width of the molded product in the direction of flow of the material.
以下図面によつて本発明の金型の構成を、トラ
ンスフア成形用金型を例として説明する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of the mold of the present invention will be explained below with reference to the drawings, taking a transfer molding mold as an example.
従来のトランスフア成形用金型は、第１図平面
図に例示するように下型Ａにカル２、ランナー３
及びゲート４からなる樹脂通路が設けられ、各ゲ
ートにはそれぞれ１個のキヤビテイ５及びエアー
ベント７が設けられている。これに対し、本発明
のトランスフア成形用金型は、第２図又は第３図
に例示するように、各ゲート４にはそれぞれ複数
個のキヤビテイが設けられている。第２図は一般
の絶縁物などの成形品を成形するための本発明の
トランスフア成形用金型の構成例であり、第３図
はICやLSIなどの半導体装置を樹脂封止するため
のトランスフア成形用金型の構成例であり、用い
るリードフレーム９のレイアウトが略示されてい
る。 A conventional transfer molding mold has a lower mold A with a cull 2 and a runner 3, as illustrated in the plan view of FIG.
and a gate 4, and each gate is provided with a cavity 5 and an air vent 7, respectively. In contrast, in the transfer molding die of the present invention, each gate 4 is provided with a plurality of cavities, as illustrated in FIG. 2 or 3. Figure 2 shows an example of the configuration of the transfer molding mold of the present invention for molding molded products such as general insulators, and Figure 3 shows a configuration example of the transfer molding mold of the present invention for molding molded products such as general insulators. This is an example of the configuration of a mold for transfer molding, and the layout of a lead frame 9 to be used is schematically shown.
金型下型Ｂ又はＣには、カル２、ランナー３及
びゲート４からなる樹脂通路が設けられ、各ゲー
ト４には複数個のキヤビテイ５，５′又は８，
８′，８″が直列に設けられている。第３図に示す
リードフレーム９は、１列に半導体素子１２をマ
ウントした帯状のリードフレームを複数並行に配
置してもよく、複数列に半導体素子１２をマウン
トした板状のリードフレームを配置してもよい。
上記リードフレームは、通常金型のパーテイング
面に配置されるように構成され、キヤビテイ８，
８′，８″で素子１２が樹脂封止される。 The mold lower mold B or C is provided with a resin passage consisting of a cull 2, a runner 3, and a gate 4, and each gate 4 has a plurality of cavities 5, 5' or 8,
8' and 8'' are provided in series.The lead frame 9 shown in FIG. A plate-shaped lead frame on which the element 12 is mounted may be arranged.
The lead frame is usually arranged on the parting surface of the mold, and has cavities 8,
The element 12 is sealed with resin at 8' and 8''.
キヤビテイ５，５′間、８，８′間、８′，８″間
にはそれぞれ樹脂通路とベントとの性格を併有す
るベント兼ゲート６，１０，１１が設けられてい
る。キヤビテイ５′及び８″には通常の金型と同様
のエアーベント７が設けられている。ベント兼ゲ
ート６，１０，１１はフイルム状に形成され、樹
脂通路とベントとの性格をもたせたもので、例え
ばベント兼ゲート６はキヤビテイ５に対しては、
エアーベントとなり、キヤビテイ５′に対しては、
ゲートの役割を果すものである。同様にベント兼
ゲート１０はキヤビテイ８に対してエアーベン
ト、キヤビテイ８′に対してゲートの役割を、ベ
ント兼ゲート１１はキヤビテイ８′に対してエア
ーベント、キヤビテイ８″に対してゲートの役割
を果す。エアーベント７の形状はベント兼ゲート
６，１０，１１の形状と同様のフイルム状で、厚
さを20％程度小さい形状とすることが好ましく、
それにより、エアーベントの働きをし、しかも必
要以上の溶融成形材料の流入を阻止することが可
能となる。 Vent-cum-gates 6, 10, and 11 are provided between the cavities 5 and 5', between the cavities 8 and 8', and between the cavities 8' and 8'', respectively, having the characteristics of a resin passage and a vent. 8'' is provided with an air vent 7 similar to a normal mold. The vent-cum-gates 6, 10, and 11 are formed in a film shape and have the characteristics of resin passages and vents.For example, the vent-cum-gate 6 has the same characteristics as the cavity 5.
It becomes an air vent, and for cavity 5',
It plays the role of a gate. Similarly, the vent/gate 10 serves as an air vent for cavity 8 and as a gate for cavity 8', and the vent/gate 11 serves as an air vent for cavity 8' and as a gate for cavity 8''. The shape of the air vent 7 is preferably a film shape similar to the shape of the vent/gates 6, 10, and 11, and the thickness is approximately 20% smaller.
This makes it possible to function as an air vent and prevent more molten molding material from flowing in than necessary.
上記のような本発明の金型を用いてトランスフ
ア成形法により予熱したタブレツトを投入して一
般の絶縁物や半導体の樹脂封止などの成形を行う
と、溶融した成形材料がプランジヤーにより金型
Ｂ又はＣのカル２、ランナー３、ゲート４、キヤ
ビテイ５，５′又は８，８′，８″に注入される。
このとき成形材料中に含まれているガスや空気及
び金型内の空気は溶融材料とともにカル２、ラン
ナー３及びゲート４並びに各キヤビテイを経てエ
アーベント７まで流動するが、ベント兼ゲート
６，１０，１１により流動性の良い材料であつて
も必要以外の部分（パーテイング面）には流れ込
まず、そのため注入の加圧力が極めて効率良く各
キヤビテイ、ゲート、ベントに伝えられる。また
ベント兼ゲート６，１０，１１及びエアーベント
７部分の「紋り」の効果により流動性良好な材料
であつてもキヤビテイへのバツク圧力的有効圧力
のためにボイドや充填不足のない優れた成形品
を、従来の金型に比べてより多数個同時に得るこ
とができる。本発明の構成はトランスフア成形の
みでなく、カル部分がスプルーに換つたいわゆる
インジエクシヨン、RIM又はLIM成形用の金型
にも同様に適用できること、また本発明は、半導
体用のリードフレーム入り製品及びリードフレー
ムのない製品の何れに適用しても上記効果が得ら
れることは明らかである。 When the above-mentioned mold of the present invention is used to mold a tablet preheated by the transfer molding method for resin encapsulation of general insulators or semiconductors, the molten molding material is transferred to the mold by the plunger. It is injected into the cull 2, runner 3, gate 4, cavity 5, 5' or 8, 8', 8'' of B or C.
At this time, the gas and air contained in the molding material and the air in the mold flow together with the molten material through the cull 2, runner 3, gate 4, and each cavity to the air vent 7. , 11, even if the material has good fluidity, it does not flow into areas other than necessary (parting surface), and therefore the injection pressure is transmitted to each cavity, gate, and vent extremely efficiently. In addition, due to the effect of the "curving" on the vent-cum-gates 6, 10, 11 and the air vent 7, even if the material has good fluidity, there is no void or insufficient filling due to effective back pressure to the cavity. A larger number of molded products can be obtained at the same time than with conventional molds. The structure of the present invention is applicable not only to transfer molding, but also to molds for so-called injection molding, RIM, or LIM molding in which the cull part is replaced with a sprue. It is clear that the above effects can be obtained no matter which product has no lead frame.
第１図は従来のトランスフア成形用金型の下型
平面図、第２図は本発明の一実施例であるトラン
スフア成形用金型の下型平面図、第３図は本発明
の他の実施例であるIC又はLSIの樹脂封止用金型
の下型平面図で、左下四半分の部分においては、
リードフレームの配置を示す。
２……カル、３……ランナー、４……ゲート、
５，５′，８，８′，８″……キヤビテイ、７……
エアーベント、６，１０，１１……ベント兼ゲー
ト、９……リードフレーム、１２……半導体素
子。
Fig. 1 is a plan view of the lower mold of a conventional transfer molding die, Fig. 2 is a plan view of the lower mold of a transfer molding die according to an embodiment of the present invention, and Fig. 3 is a plan view of the lower mold of a conventional transfer molding die. This is a bottom plan view of the mold for resin encapsulation of IC or LSI, which is an example of . In the lower left quarter part,
The lead frame arrangement is shown. 2...Cal, 3...Runner, 4...Gate,
5, 5', 8, 8', 8''...Cavity, 7...
Air vent, 6, 10, 11...Vent/gate, 9...Lead frame, 12...Semiconductor element.
Claims (1)
性樹脂成形用金型において、ランナーに直結した
ゲートの少くとも１つに、２個以上のキヤビテイ
を直列に配置し、上記キヤビテイ間をフイルム状
のベント兼ゲートで連結することを特徴とする成
形用金型。 ２ 成形用金型が半導体素子を搭置したリードフ
レームを樹脂封止する金型であつて、金型内に、
１列に素子封止部を設けた帯状のリードフレーム
を複数並行に配置するか、複数列に素子封止部を
設けた板状のリードフレームを配置して成形す
る、特許請求の範囲第１項記載の成形用金型。[Claims] 1. In a multi-cavity mold or family mold thermosetting resin mold, two or more cavities are arranged in series in at least one of the gates directly connected to the runner, and there is a gap between the cavities. A mold for molding that is characterized by connecting two parts with a film-like vent/gate. 2. The molding mold is a mold for resin-sealing a lead frame on which a semiconductor element is mounted, and in the mold,
Claim 1: Molding is performed by arranging a plurality of strip-shaped lead frames in parallel with each other, or by arranging plate-shaped lead frames in which element sealing parts are provided in a plurality of rows. Molding mold described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8828281A JPS57203532A (en) | 1981-06-10 | 1981-06-10 | Mold for molding thermosetting resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8828281A JPS57203532A (en) | 1981-06-10 | 1981-06-10 | Mold for molding thermosetting resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57203532A JPS57203532A (en) | 1982-12-13 |
| JPH0124612B2 true JPH0124612B2 (en) | 1989-05-12 |
Family
ID=13938539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8828281A Granted JPS57203532A (en) | 1981-06-10 | 1981-06-10 | Mold for molding thermosetting resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57203532A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62122254A (en) * | 1985-11-22 | 1987-06-03 | Mitsubishi Electric Corp | Frame for resin molded semiconductor device |
| JPS63164453A (en) * | 1986-12-26 | 1988-07-07 | Idec Izumi Corp | Manufacture of coupler of small-sized electronic component |
| JPH0258344A (en) * | 1988-08-24 | 1990-02-27 | Rohm Co Ltd | Molding equipment for molded part of lead frame |
| AU689953B2 (en) * | 1994-09-21 | 1998-04-09 | Jimro Co., Ltd. | Method of manufacturing spheroidal moldings |
| US6316821B1 (en) * | 1998-09-28 | 2001-11-13 | Cypress Semiconductor Corporation | High density lead frames and methods for plastic injection molding |
| WO2006129926A1 (en) * | 2005-06-02 | 2006-12-07 | Tsp Co., Ltd. | Mold for manufacturing semiconductor device and semiconductor device manufactred using the same |
| US7691315B2 (en) | 2005-07-18 | 2010-04-06 | T.F.H. Publications, Inc. | Injection mold having cavities in series |
| JP2012030536A (en) * | 2010-07-30 | 2012-02-16 | Toshiba Corp | Casting mold and gas-insulated switchgear |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5228554A (en) * | 1975-08-30 | 1977-03-03 | Matsushita Electric Works Ltd | Method of molding products by picking up multiple blanks |
-
1981
- 1981-06-10 JP JP8828281A patent/JPS57203532A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5228554A (en) * | 1975-08-30 | 1977-03-03 | Matsushita Electric Works Ltd | Method of molding products by picking up multiple blanks |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57203532A (en) | 1982-12-13 |
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