JPS57199228A - Wire bonding pad device - Google Patents

Wire bonding pad device

Info

Publication number
JPS57199228A
JPS57199228A JP56084594A JP8459481A JPS57199228A JP S57199228 A JPS57199228 A JP S57199228A JP 56084594 A JP56084594 A JP 56084594A JP 8459481 A JP8459481 A JP 8459481A JP S57199228 A JPS57199228 A JP S57199228A
Authority
JP
Japan
Prior art keywords
lead wire
adjacent
bonding pad
pad
bonding pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56084594A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6342853B2 (enrdf_load_stackoverflow
Inventor
Keiichi Takizawa
Kenzo Ashiuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56084594A priority Critical patent/JPS57199228A/ja
Publication of JPS57199228A publication Critical patent/JPS57199228A/ja
Publication of JPS6342853B2 publication Critical patent/JPS6342853B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061—Disposition
    • H01L2224/0612—Layout
    • H01L2224/0615—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
    • H01L2224/06153—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry with a staggered arrangement, e.g. depopulated array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49431—Connecting portions the connecting portions being staggered on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electronic Switches (AREA)
  • Facsimile Heads (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP56084594A 1981-06-02 1981-06-02 Wire bonding pad device Granted JPS57199228A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56084594A JPS57199228A (en) 1981-06-02 1981-06-02 Wire bonding pad device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56084594A JPS57199228A (en) 1981-06-02 1981-06-02 Wire bonding pad device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP1144105A Division JPH0242737A (ja) 1989-06-08 1989-06-08 ワイヤボンディングパッド装置

Publications (2)

Publication Number Publication Date
JPS57199228A true JPS57199228A (en) 1982-12-07
JPS6342853B2 JPS6342853B2 (enrdf_load_stackoverflow) 1988-08-25

Family

ID=13835002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56084594A Granted JPS57199228A (en) 1981-06-02 1981-06-02 Wire bonding pad device

Country Status (1)

Country Link
JP (1) JPS57199228A (enrdf_load_stackoverflow)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6035524A (ja) * 1983-08-08 1985-02-23 Hitachi Micro Comput Eng Ltd 半導体装置
JPS6114740A (ja) * 1984-06-29 1986-01-22 Toshiba Corp ボンデイングパツド
JPS61186227U (enrdf_load_stackoverflow) * 1985-05-13 1986-11-20
JPS63276235A (ja) * 1987-05-08 1988-11-14 Nec Corp 半導体集積回路装置
JPH01174927U (enrdf_load_stackoverflow) * 1988-05-30 1989-12-13
JPH0242737A (ja) * 1989-06-08 1990-02-13 Toshiba Corp ワイヤボンディングパッド装置
JPH02145349A (ja) * 1988-11-29 1990-06-04 Fuji Xerox Co Ltd 印字記録ヘッド
JPH0292905U (enrdf_load_stackoverflow) * 1989-01-10 1990-07-24
JPH08109U (ja) * 1995-07-28 1996-01-23 ローム株式会社 熱印字ヘッド
US5767527A (en) * 1994-07-07 1998-06-16 Fujitsu Limited Semiconductor device suitable for testing
EP1545170A1 (en) * 2003-12-16 2005-06-22 Nitto Denko Corporation Wiring circuit board
US7183660B2 (en) 2003-10-04 2007-02-27 Samsung Electronics Co., Ltd. Tape circuit substrate and semicondutor chip package using the same
JP2011049327A (ja) * 2009-08-26 2011-03-10 Renesas Electronics Corp Ｔｃｐ型半導体装置
JP2019083312A (ja) * 2017-10-16 2019-05-30 シトロニックス テクノロジー コーポレーション 回路のリード構造

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5277744A (en) * 1975-12-24 1977-06-30 Seiko Epson Corp Liqud crystal display device
JPS53145468U (enrdf_load_stackoverflow) * 1977-04-19 1978-11-16
JPS5470056U (enrdf_load_stackoverflow) * 1977-10-27 1979-05-18
JPS5759641U (enrdf_load_stackoverflow) * 1980-09-27 1982-04-08

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5277744A (en) * 1975-12-24 1977-06-30 Seiko Epson Corp Liqud crystal display device
JPS53145468U (enrdf_load_stackoverflow) * 1977-04-19 1978-11-16
JPS5470056U (enrdf_load_stackoverflow) * 1977-10-27 1979-05-18
JPS5759641U (enrdf_load_stackoverflow) * 1980-09-27 1982-04-08

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6035524A (ja) * 1983-08-08 1985-02-23 Hitachi Micro Comput Eng Ltd 半導体装置
JPS6114740A (ja) * 1984-06-29 1986-01-22 Toshiba Corp ボンデイングパツド
JPS61186227U (enrdf_load_stackoverflow) * 1985-05-13 1986-11-20
JPS63276235A (ja) * 1987-05-08 1988-11-14 Nec Corp 半導体集積回路装置
JPH01174927U (enrdf_load_stackoverflow) * 1988-05-30 1989-12-13
JPH02145349A (ja) * 1988-11-29 1990-06-04 Fuji Xerox Co Ltd 印字記録ヘッド
JPH0292905U (enrdf_load_stackoverflow) * 1989-01-10 1990-07-24
JPH0242737A (ja) * 1989-06-08 1990-02-13 Toshiba Corp ワイヤボンディングパッド装置
US5904506A (en) * 1994-07-07 1999-05-18 Fujitsu Limited Semiconductor device suitable for testing
US5767527A (en) * 1994-07-07 1998-06-16 Fujitsu Limited Semiconductor device suitable for testing
JPH08109U (ja) * 1995-07-28 1996-01-23 ローム株式会社 熱印字ヘッド
US7183660B2 (en) 2003-10-04 2007-02-27 Samsung Electronics Co., Ltd. Tape circuit substrate and semicondutor chip package using the same
EP1545170A1 (en) * 2003-12-16 2005-06-22 Nitto Denko Corporation Wiring circuit board
US7087844B2 (en) 2003-12-16 2006-08-08 Nitto Denko Corporation Wiring circuit board
JP2011049327A (ja) * 2009-08-26 2011-03-10 Renesas Electronics Corp Ｔｃｐ型半導体装置
CN102005428A (zh) * 2009-08-26 2011-04-06 瑞萨电子株式会社 Tcp型半导体器件
US8310068B2 (en) 2009-08-26 2012-11-13 Renesas Electronics Corporation TCP-type semiconductor device
JP2019083312A (ja) * 2017-10-16 2019-05-30 シトロニックス テクノロジー コーポレーション 回路のリード構造

Also Published As

Publication number Publication date
JPS6342853B2 (enrdf_load_stackoverflow) 1988-08-25

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