JPS53145468U - - Google Patents

Info

Publication number
JPS53145468U
JPS53145468U JP5108277U JP5108277U JPS53145468U JP S53145468 U JPS53145468 U JP S53145468U JP 5108277 U JP5108277 U JP 5108277U JP 5108277 U JP5108277 U JP 5108277U JP S53145468 U JPS53145468 U JP S53145468U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5108277U
Other languages
Japanese (ja)
Other versions
JPS5756528Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5108277U priority Critical patent/JPS5756528Y2/ja
Publication of JPS53145468U publication Critical patent/JPS53145468U/ja
Application granted granted Critical
Publication of JPS5756528Y2 publication Critical patent/JPS5756528Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP5108277U 1977-04-19 1977-04-19 Expired JPS5756528Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5108277U JPS5756528Y2 (enrdf_load_stackoverflow) 1977-04-19 1977-04-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5108277U JPS5756528Y2 (enrdf_load_stackoverflow) 1977-04-19 1977-04-19

Publications (2)

Publication Number Publication Date
JPS53145468U true JPS53145468U (enrdf_load_stackoverflow) 1978-11-16
JPS5756528Y2 JPS5756528Y2 (enrdf_load_stackoverflow) 1982-12-04

Family

ID=28939783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5108277U Expired JPS5756528Y2 (enrdf_load_stackoverflow) 1977-04-19 1977-04-19

Country Status (1)

Country Link
JP (1) JPS5756528Y2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57199228A (en) * 1981-06-02 1982-12-07 Toshiba Corp Wire bonding pad device
JPH06334100A (ja) * 1993-05-25 1994-12-02 Seiko Epson Corp 半導体装置及びそのリードフレーム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57199228A (en) * 1981-06-02 1982-12-07 Toshiba Corp Wire bonding pad device
JPH06334100A (ja) * 1993-05-25 1994-12-02 Seiko Epson Corp 半導体装置及びそのリードフレーム

Also Published As

Publication number Publication date
JPS5756528Y2 (enrdf_load_stackoverflow) 1982-12-04

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