JPS57196555A - Manufacture of hybrid integrated circuit - Google Patents

Manufacture of hybrid integrated circuit

Info

Publication number
JPS57196555A
JPS57196555A JP56081401A JP8140181A JPS57196555A JP S57196555 A JPS57196555 A JP S57196555A JP 56081401 A JP56081401 A JP 56081401A JP 8140181 A JP8140181 A JP 8140181A JP S57196555 A JPS57196555 A JP S57196555A
Authority
JP
Japan
Prior art keywords
layer
integrated circuit
hybrid integrated
capacitor
reduced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56081401A
Other languages
English (en)
Inventor
Toshiro Sasamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56081401A priority Critical patent/JPS57196555A/ja
Publication of JPS57196555A publication Critical patent/JPS57196555A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP56081401A 1981-05-28 1981-05-28 Manufacture of hybrid integrated circuit Pending JPS57196555A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56081401A JPS57196555A (en) 1981-05-28 1981-05-28 Manufacture of hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56081401A JPS57196555A (en) 1981-05-28 1981-05-28 Manufacture of hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS57196555A true JPS57196555A (en) 1982-12-02

Family

ID=13745287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56081401A Pending JPS57196555A (en) 1981-05-28 1981-05-28 Manufacture of hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS57196555A (ja)

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