JPS6474715A - Manufacture of electron component - Google Patents

Manufacture of electron component

Info

Publication number
JPS6474715A
JPS6474715A JP62233536A JP23353687A JPS6474715A JP S6474715 A JPS6474715 A JP S6474715A JP 62233536 A JP62233536 A JP 62233536A JP 23353687 A JP23353687 A JP 23353687A JP S6474715 A JPS6474715 A JP S6474715A
Authority
JP
Japan
Prior art keywords
lead
preliminary
bath
soldering
immersed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62233536A
Other languages
Japanese (ja)
Inventor
Buei Watabe
Takashi Abe
Keiji Yuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marcon Electronics Co Ltd
Original Assignee
Marcon Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marcon Electronics Co Ltd filed Critical Marcon Electronics Co Ltd
Priority to JP62233536A priority Critical patent/JPS6474715A/en
Publication of JPS6474715A publication Critical patent/JPS6474715A/en
Pending legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PURPOSE:To secure reliable connecting conditions by forming a preliminary solder plating layer having a specific composition ratio in a lead, immersing them in a soldering bath of low melting point and truly connecting them after an outer electrode and the lead are preliminarily connected. CONSTITUTION:The edge of a lead 2 fixed on a folder 1 every pair is immersed in a flux bath 3, next, soaked in a high temperature soldering bath 4 having composition ratio of silver of 3-8wt.% and lead of 97-92wt.% and a preliminary soldering plating layer 5 is formed on the edge of the lead 2. Next, it is immersed in a flux bath 6, thereafter a laminated ceramic capacitor element assembly 8 on which an outside electrode 7 is abutted between preliminary solder plating layers of the lead 2 is sandwiched, a soldering copper 10 controlled at 320 deg.C+10 deg.C is pressed from both sides after preliminary heat 9, a preliminary solder plating layer 5 is melted and preliminary connection is performed. Next, after the laminated ceramic capacitor element assembly 8 is immersed in a flux bath 11 and heated preliminarily 12, it is soaked in a solder bath 13 of low melting point of 230 deg.C and connected truly.
JP62233536A 1987-09-16 1987-09-16 Manufacture of electron component Pending JPS6474715A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62233536A JPS6474715A (en) 1987-09-16 1987-09-16 Manufacture of electron component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62233536A JPS6474715A (en) 1987-09-16 1987-09-16 Manufacture of electron component

Publications (1)

Publication Number Publication Date
JPS6474715A true JPS6474715A (en) 1989-03-20

Family

ID=16956589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62233536A Pending JPS6474715A (en) 1987-09-16 1987-09-16 Manufacture of electron component

Country Status (1)

Country Link
JP (1) JPS6474715A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244049A (en) * 1989-11-02 1994-09-02 Taiyo Yuden Co Ltd Method for lead wire connection
JP2005072111A (en) * 2003-08-21 2005-03-17 Murata Mfg Co Ltd Lead-type capacitor and manufacturing method therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244049A (en) * 1989-11-02 1994-09-02 Taiyo Yuden Co Ltd Method for lead wire connection
JP2005072111A (en) * 2003-08-21 2005-03-17 Murata Mfg Co Ltd Lead-type capacitor and manufacturing method therefor

Similar Documents

Publication Publication Date Title
CN107484408B (en) Electronic device and method for manufacturing electronic device
US4109292A (en) Ceramic capacitor with nickel-solder electrodes
US4483062A (en) Method for manufacturing solid electrolyte condensers
JP3115713B2 (en) Ceramic electronic components
JPS6474715A (en) Manufacture of electron component
US4734672A (en) Variable resistor circuit module and method of manufacture
JPS6160570B2 (en)
JPS643333B2 (en)
JPH06342734A (en) Ceramic electronic component
KR810002375Y1 (en) Solid electrolytic capitors
JPS623522B2 (en)
JPH0729625Y2 (en) Multilayer LC composite parts
JPS59137174A (en) Preliminary soldering method
JP2787743B2 (en) Feed-through porcelain capacitor
JPH02265202A (en) Chip component
KR800001299Y1 (en) Air-proof terminal
JPS5932148Y2 (en) Chip parts for jumpers
JPH04208510A (en) Chip type electronic part
JPS58102596A (en) Metal core printed circuit board
SU446490A1 (en) Solder
JP2886945B2 (en) Wiring board
JPS62128553A (en) Manufacture of semiconductor package
JP2003303736A (en) Electronic component with outer metal terminal
JPS6136681B2 (en)
JPH05234812A (en) Coaxial ceramic capacitor and manufacture thereof