JPS6474715A - Manufacture of electron component - Google Patents
Manufacture of electron componentInfo
- Publication number
- JPS6474715A JPS6474715A JP62233536A JP23353687A JPS6474715A JP S6474715 A JPS6474715 A JP S6474715A JP 62233536 A JP62233536 A JP 62233536A JP 23353687 A JP23353687 A JP 23353687A JP S6474715 A JPS6474715 A JP S6474715A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- preliminary
- bath
- soldering
- immersed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
PURPOSE:To secure reliable connecting conditions by forming a preliminary solder plating layer having a specific composition ratio in a lead, immersing them in a soldering bath of low melting point and truly connecting them after an outer electrode and the lead are preliminarily connected. CONSTITUTION:The edge of a lead 2 fixed on a folder 1 every pair is immersed in a flux bath 3, next, soaked in a high temperature soldering bath 4 having composition ratio of silver of 3-8wt.% and lead of 97-92wt.% and a preliminary soldering plating layer 5 is formed on the edge of the lead 2. Next, it is immersed in a flux bath 6, thereafter a laminated ceramic capacitor element assembly 8 on which an outside electrode 7 is abutted between preliminary solder plating layers of the lead 2 is sandwiched, a soldering copper 10 controlled at 320 deg.C+10 deg.C is pressed from both sides after preliminary heat 9, a preliminary solder plating layer 5 is melted and preliminary connection is performed. Next, after the laminated ceramic capacitor element assembly 8 is immersed in a flux bath 11 and heated preliminarily 12, it is soaked in a solder bath 13 of low melting point of 230 deg.C and connected truly.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62233536A JPS6474715A (en) | 1987-09-16 | 1987-09-16 | Manufacture of electron component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62233536A JPS6474715A (en) | 1987-09-16 | 1987-09-16 | Manufacture of electron component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6474715A true JPS6474715A (en) | 1989-03-20 |
Family
ID=16956589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62233536A Pending JPS6474715A (en) | 1987-09-16 | 1987-09-16 | Manufacture of electron component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6474715A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06244049A (en) * | 1989-11-02 | 1994-09-02 | Taiyo Yuden Co Ltd | Method for lead wire connection |
JP2005072111A (en) * | 2003-08-21 | 2005-03-17 | Murata Mfg Co Ltd | Lead-type capacitor and manufacturing method therefor |
-
1987
- 1987-09-16 JP JP62233536A patent/JPS6474715A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06244049A (en) * | 1989-11-02 | 1994-09-02 | Taiyo Yuden Co Ltd | Method for lead wire connection |
JP2005072111A (en) * | 2003-08-21 | 2005-03-17 | Murata Mfg Co Ltd | Lead-type capacitor and manufacturing method therefor |
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