JPS5932148Y2 - Chip parts for jumpers - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a jumper chip component used for electrical connection between conductor portions of a printed circuit board.

In the field, this type of jumper chip component is produced by printing a glaze-based conductive material on the surface of an alumina substrate 1 and baking it at a high temperature to form a conductive film 2, as shown in Figure 1. In order to insulate a part, an insulating glass layer 3 is formed by printing a glass material leaving both ends and firing it at high temperature, and further, the same conductive film 2 is formed on the connection part with the external circuit at both ends. It is constructed by printing a material and firing it at a high temperature to form the end face electrode part 4.

However, in the case of such conventional chip parts for jumpers, as mentioned above, the printing and firing processes are required three times, which poses a big problem in terms of mass production. In order to achieve this, the conductive film 2 must be formed quite thick, and the base is alumina base 1
Therefore, it had the disadvantage of poor thermal conductivity.

The present invention was devised to solve such conventional drawbacks, and the jumper chip component according to the present invention will be explained below with reference to the drawings of FIGS. 2 and 3.

FIG. 2 shows a jumper chip component according to an embodiment of the present invention. In the figure, 5 is a rectangular base made of a conductive material, and this base 5 includes copper, silver, gold, lead, and tin. , formed by forming an aluminum layer on zinc, iron, cobalt, nickel, platinum or their alloys.

Reference numeral 6 denotes an insulating aluminum oxide layer formed on the surface of the base 5, leaving both end faces that will be connected to an external circuit, and is formed by oxidizing the aluminum layer of the base 6.

Reference numeral 7 designates electrodes formed by tin or solder plating on both end surfaces of the base 5 on which the aluminum oxide layer 6 is not formed.

FIG. 3 is a diagram showing another embodiment of the present invention, in which the aluminum oxide layer 6 at both ends of the upper surface of the base 5 is removed to increase the area of the electrode 7. .

Next, a specific example of obtaining the jumper chip component of the present invention will be described.

A rectangular wire with a length Q of 5 mm, a width of 1.6 mm, and a length of 300 mm is used, and the center core is copper and the circumference is 0.2 mm thick.The aluminum part around the aluminum clad wire is Electrically oxidize to form an aluminum oxide layer of approximately 30μ, followed by a length of 3
．． Cut into 2 mm pieces.

Then, solder plating was applied to the net portion of the cut surface of the small piece to prepare it for completion.

The characteristics of this jumper chip component are shown in the table below.

According to the jumper chip component of the present invention as described above, the following effects can be obtained.

(1) Since the entire base is made of a conductive material, electrical conductivity is good.

(2) The entire base is made of metal and has low electrical resistance and good thermal conductivity, so it is possible to flow a large current with a small size.

(3) Since the aluminum layer of the base is electrically or chemically oxidized to form an aluminum oxide layer, it has excellent heat resistance, insulation, hardness, and abrasion resistance, and does not require high-temperature treatment. Therefore, mass production can be easily carried out.

(4) The electrodes are formed by applying tin or solder plating directly on the substrate, and can be formed very easily and have good soldering properties.

(5) When forming the aluminum oxide layer electrically,
The thickness of the aluminum oxide layer can be adjusted with high precision.

(6) If an aluminum clad wire is used as the substrate, it can be obtained at low cost with high dimensional accuracy using general commercially available products.

[Brief explanation of drawings]

FIG. 1 is a partially cross-sectional perspective view of a conventional jumper chip component, and FIGS. 2 and 3 are partially cross-sectional perspective views of jumper chip components according to embodiments of the present invention. It is. 5... Substrate, 6... Aluminum oxide layer, 7... Electrode.

Claims (2)

[Scope of utility model registration request] (1) A jumper chip part formed by forming an insulating aluminum oxide layer on the surface of a base made of a conductive material, leaving a connection part with an external circuit, and applying tin or solder plating to the connection part with the external circuit. Rolo 0 (2) The substrate is copper, silver, gold, lead, tin, zinc, iron, or cobalt. A chip component for a jumper according to claim 1, which is constructed by forming an aluminum layer on nickel, platinum, or an alloy thereof.