JPS6061736U

JPS6061736U - Hybrid IC

Info

Publication number: JPS6061736U
Application number: JP15425583U
Authority: JP
Inventors: 秀樹上田
Original assignee: 日本電気株式会社
Priority date: 1983-10-04
Filing date: 1983-10-04
Publication date: 1985-04-30

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図、第２図及び第３図は、それぞれ従来のハイブリ
ッドＩＣの例を示す図、第４図ａ及びｂは本考案による
ハイブリッドＩＣの実施例を宗す平面図及びそのＤ−Ｄ
’断面図、第５図は第４図中の貫通型中継端子の断面図
、第６図は本考案によるハイブリッドＩＣの実装手順を
説明するための図である。図において、１・・・半田付可能な金属プレート、２・
・・セラミック基板、３・・・基体パターン、４，４１
・・・貫通型中継端子、５・・・導体線材、６・・・貫
通型中継端子取付穴、７・・・Ｌ字に折り曲げられた電
極リード、８・・・誘電体、９・・・外部電極、１０・
・・電気部品、１１・・・導体パターン、１２・・・ク
リーム半田、１３・・・ペレット半田、１４・・・ペレ
ット半田、１５・・・熱電導のよい金属、１６・・・貫
通型中継端子４１のリードが接触しないための溝、１７
・・・ホットプレートである。1, 2, and 3 are diagrams showing examples of conventional hybrid ICs, respectively, and FIGS. 4a and 4b are plan views and D-D views of the embodiments of the hybrid IC according to the present invention.
5 is a sectional view of the through-type relay terminal in FIG. 4, and FIG. 6 is a diagram for explaining the mounting procedure of the hybrid IC according to the present invention. In the figure, 1... metal plate that can be soldered, 2...
...Ceramic substrate, 3...Base pattern, 4,41
...Through type relay terminal, 5...Conductor wire, 6...Through type relay terminal mounting hole, 7...L-shaped electrode lead, 8...Dielectric material, 9... External electrode, 10・
...Electrical component, 11...Conductor pattern, 12...Cream solder, 13...Pellet solder, 14...Pellet solder, 15...Metal with good thermal conductivity, 16...Through type relay Groove for preventing the lead of terminal 41 from contacting 17
...It's a hot plate.

Claims

[Scope of utility model registration request]

It includes a ceramic substrate on which circuit components are mounted, a through-type relay terminal with one electrode lead bent into an L shape, and a metal plate to which the ceramic substrate and the through-type relay terminal can be soldered, the same surface of the metal plate. The ceramic substrate and the through-type relay terminal are placed on top, and the L of the through-type relay terminal is placed on the conductor pattern of the ceramic substrate.
A hybrid IC0 characterized in that the through-type relay terminal is arranged so that the palm-side electrode lead comes into contact with the hybrid IC0.