JPS60181075U - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPS60181075U JPS60181075U JP6873984U JP6873984U JPS60181075U JP S60181075 U JPS60181075 U JP S60181075U JP 6873984 U JP6873984 U JP 6873984U JP 6873984 U JP6873984 U JP 6873984U JP S60181075 U JPS60181075 U JP S60181075U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit device
- electrical components
- external connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａは本考案の一実施例を示す構成図、第１図すは
第１図ａの側面図、第２図ａは従来装置を示す構成図、
第２図すは第２図ａの側面図である。
１・・・混成集積回路基板、２・・・チップ形セラミッ
クコンデンサ、３・・・膜抵抗素子、４・・・膜導体、
５・・・外部接続端子、６・・・外部接続端子用電極、
７・・・はんだ槽、１０・・・絶縁性衝立板。FIG. 1a is a block diagram showing an embodiment of the present invention, FIG. 1 is a side view of FIG. 1a, and FIG. 2a is a block diagram showing a conventional device.
Figure 2 is a side view of Figure 2a. DESCRIPTION OF SYMBOLS 1... Hybrid integrated circuit board, 2... Chip type ceramic capacitor, 3... Film resistance element, 4... Film conductor,
5... External connection terminal, 6... External connection terminal electrode,
7... Solder bath, 10... Insulating screen plate.
Claims (1)
用電極をはさんだ槽に浸し、該電極に外部接続端子をは
んだ付けする混成集積回路装置において、はんだ槽の液
面と電気部品との間を隔離する絶縁性衝立板を電気部品
と電極との間に設けたことを特徴とする混成集積回路装
置。In a hybrid integrated circuit device in which electrodes for external connection terminals of electrical components mounted on a hybrid integrated circuit board are immersed in a bath sandwiching them, and external connection terminals are soldered to the electrodes, the temperature between the liquid level of the solder bath and the electrical components is A hybrid integrated circuit device characterized in that an insulating screen plate is provided between an electrical component and an electrode to isolate the electrical components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6873984U JPS60181075U (en) | 1984-05-11 | 1984-05-11 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6873984U JPS60181075U (en) | 1984-05-11 | 1984-05-11 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60181075U true JPS60181075U (en) | 1985-12-02 |
Family
ID=30603761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6873984U Pending JPS60181075U (en) | 1984-05-11 | 1984-05-11 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60181075U (en) |
-
1984
- 1984-05-11 JP JP6873984U patent/JPS60181075U/en active Pending
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