JPS6129101A - Chip resistor and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] - The present invention relates to a chip resistor and a method for manufacturing the same, and particularly relates to a thin chip resistor that is used for printed circuit boards, etc., and a method for manufacturing the same. .

[Conventional technology]

The demand for chip resistors is increasing rapidly as circuit boards in electronic devices become smaller, and demand from the consumer side is increasing not only for their miniaturization and thinning, but also for improved accuracy, increased durability, and lower prices. There are various demands for this chip resistor.

FIG. 7 shows a chip resistor that has been commonly used in the past. This conventional chip resistor consists of a pair of first electrodes 2 formed on one surface of a substrate 1 at a predetermined interval,
2, and a resistor 3 whose both ends are electrically connected to each electrode 2, 2.
and a second electrode 4.4 which is electrically connected to the first electrode and is formed in a U-shape on the opposite edge of the substrate 1,
Furthermore, solder 5, 5 is attached to the outer surface of the camphor tree 4.4 of F2 to facilitate connection to other circuits.

This chip resistor uses a ceramic substrate as a substrate, and includes many resistors 3 and first electrodes 2, 2.
are fixed at predetermined intervals, and then divided into resistor elements 3 according to a preset dividing line, and then a side end portion 44.4, which is a second electrode, is attached and formed for each resistor piece. It is produced by this method.

[Problem that the invention seeks to solve]

However, in such a conventional example, not only is the structure complicated, but also a method is adopted in which the ceramic substrate is subdivided into each resistor, and then the second TF and pole are formed for each resistor. Therefore, the disadvantage is that the process is complicated and productivity is low. Further, the first pole of the second wire is plated with nickel or copper to prevent so-called silver cracking due to solder, and furthermore, it is coated with nickel plating or copper plating to prevent oxidation and improve solderability. A method of adhering and forming a tin film has been adopted.

For this reason, the chip resistor of the above Ff conventional type has always had the drawback of requiring high productivity as a whole, and thus resulting in high cost.

SUMMARY OF THE INVENTION An object of the present invention is to improve the disadvantages of the conventional example and to provide a chip resistor with good productivity, durability, and a simple structure, and a method for manufacturing the same.

[Means for solving problems]

Therefore, in the present invention, as a chip resistor, a heat-resistant insulating film is used, and an electrode is formed on one opposing edge of the P powder film so as to wrap around each edge, and the electrode is electrically connected to the above-mentioned electrode. The structure includes a resistor formed on one surface of an insulating film and an insulating protective film formed to cover the entire outer surface of the plate-shaped resistor. ,
Continuous electrodes made of conductive heat-sealed 1# are formed on both ends of a heat-resistant strip-shaped insulating film so as to wrap around each side end, and then electrodeposited on one side of the insulating film. Then, a plurality of resistors having a partial Y layer are formed on the electric cell at predetermined intervals, and then an insulating and retaining film is formed on the resistor, and then the above-mentioned The purpose is to achieve the above object by kneading the dough by dividing it into strips from a connected state.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be explained based on FIGS. 1 to 6.

In FIG. 1, 10 indicates an insulating film. This insulating film 10 is made of a heat-resistant material such as polyimide or polyester. The electrodes 11 are wrapped around one opposing edge of the insulating film 10.
12 is attached and formed. A conductive heat sealing agent is used as the material for the electrodes 11 and 12.

A resistor 13 whose both ends are electrically connected to the electrodes 11 and 12 is formed on one surface (upper surface side in FIG. 1) of the insulating film 10. This resistor 13 is formed of carbon or a member mainly composed of carbon. Reference numeral 14 indicates an insulating protective film formed to cover the outer metal material of the resistor 13. This insulating protective film 14 is formed by coating glass or the like.

Next, a method for manufacturing the chip resistor 20 having such a structure will be explained based on FIGS. 2 to 5.

First, a continuous strip-shaped insulating film 100, which is the material of the above-described insulating film 10, is prepared. In the center of this strip-shaped insulating film 100, there are feed holes 1 at predetermined intervals.
01 is formed. Next, a continuous body of electrodes having a U-shaped cross section is attached to both edges of this strip-shaped insulating film so as to wrap around each edge (see FIG. 2). In this embodiment, the continuum electrodes 110 and 120 are formed by a method in which both ends of the insulating film 100 are immersed in an ink bath of a conductive heat sealant and then dried. Subsequently, resistors 13, 13 . ... is deposited and formed. Each resistor 13 is formed using a thick film printing technique such as screen printing, and both ends thereof are connected to the continuum I# pole 110.
, 120, respectively. Then, on the outer surface of each resistor 13 formed in this way, an insulating protective film 14 made of glass or the like is further coated, and a continuum of chip resistors 200 is formed by kneading as shown in FIG. It is designed to be rolled up into a hoop shape. In use, the chip resistor shown in FIG. 5 can be obtained by cutting along the imaginary line in FIG. 4, . . . .

FIG. 6 shows an example of the usage state of the chip resistor 20 shown in FIG. 5, in which (9) indicates a printed circuit board and 31 indicates a predetermined electric circuit on the printed circuit board 30. FIG.

In this case, the chip resistor is placed on the printed circuit board 30 so that the electrodes 11 and 12 come into contact with the circuit 31 of the printed circuit board 30, and then the electrodes 11 and 12 are bonded by thermocompression. By kneading, the conductive heat seals forming the electric currents 11j11 and 12 are partially melted, and the chip resistor 20 is integrated into the circuit 31. Therefore, when using the chip resistor 20, there is an advantage that the conventional soldering work is not required.

〔Effect of the invention〕

As described above, according to the present invention, the structure of the chip resistor is significantly simplified compared to the conventional example, so it can be miniaturized and
In addition to being thinner, the use of a method of forming the substrate portion with an insulating film makes it possible to achieve an even thinner chip resistance than ever before. In addition, while the conventional example adopts a relatively complicated manufacturing method, the present invention utilizes a strip-shaped insulating film of the chip resistor and separates it from the resistor and the insulating film, as described above, which significantly improves productivity. Therefore, it is possible to provide an unprecedented and excellent method for manufacturing a chip resistor, which can significantly reduce the cost of the chip resistor produced thereby. Furthermore, if a conductive heat seal is used as an electrode, there is no need to newly provide solder as in the conventional method, and further miniaturization and thinner layers can be achieved.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an example of a chip resistor according to the present invention, and FIGS. Figure 5 is the second
Figures 1 and 2 to 4 are plan views showing chip resistors obtained by the manufacturing methods of Figures 1 and 2, Figure 6 is a diagram showing how the chip resistor of Figure 5 is used, and Figure 7 is a conventional example. FIG. DESCRIPTION OF SYMBOLS 10... Insulating film 11, 12... Electrode 13... Plate-shaped resistor 14... Insulating protective film 100... Band-shaped insulating film 110, 120... Continuum electrolysis Figure 1

Claims (3)

[Claims] (1) A heat-resistant insulating film, an electrode formed on one opposing edge of the insulating film so as to wrap around each edge, and an electrode formed on one surface of the insulating film to be electrically connected to each electrode. 1. A chip resistor comprising: a plate-like resistor; and an insulating protective film formed to cover the outer surface of the plate-like resistor. (2) The chip resistor according to claim 1, wherein the electrode is formed of a conductive heat sealing agent. (3) Continuous electrodes made of a conductive heat sealing agent are formed on both ends of a heat-resistant strip-shaped insulating film so as to wrap around each side end, and then the electrodes on one side of the insulating film are connected to each other. In between, a plurality of resistors partially laminated on the electrode are formed at predetermined intervals, and then an insulating protective film is formed on the resistor, and then the strip-shaped resistor is formed for each resistor. A method for manufacturing a chip resistor, characterized in that it is divided from a connected state.