JPS57192255A - Electroless copper plating solution - Google Patents

Electroless copper plating solution

Info

Publication number
JPS57192255A
JPS57192255A JP56074693A JP7469381A JPS57192255A JP S57192255 A JPS57192255 A JP S57192255A JP 56074693 A JP56074693 A JP 56074693A JP 7469381 A JP7469381 A JP 7469381A JP S57192255 A JPS57192255 A JP S57192255A
Authority
JP
Japan
Prior art keywords
copper
plating solution
salts
copper plating
malleability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56074693A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0137477B2 (enExample
Inventor
Masahiro Oida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56074693A priority Critical patent/JPS57192255A/ja
Publication of JPS57192255A publication Critical patent/JPS57192255A/ja
Publication of JPH0137477B2 publication Critical patent/JPH0137477B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
JP56074693A 1981-05-18 1981-05-18 Electroless copper plating solution Granted JPS57192255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56074693A JPS57192255A (en) 1981-05-18 1981-05-18 Electroless copper plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56074693A JPS57192255A (en) 1981-05-18 1981-05-18 Electroless copper plating solution

Publications (2)

Publication Number Publication Date
JPS57192255A true JPS57192255A (en) 1982-11-26
JPH0137477B2 JPH0137477B2 (enExample) 1989-08-07

Family

ID=13554557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56074693A Granted JPS57192255A (en) 1981-05-18 1981-05-18 Electroless copper plating solution

Country Status (1)

Country Link
JP (1) JPS57192255A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100483111B1 (ko) * 2001-04-24 2005-04-14 가부시키가이샤 무라타 세이사쿠쇼 무전해 구리 도금 용액 및 고주파 전자 부품

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4975426A (enExample) * 1972-11-24 1974-07-22
JPS56271A (en) * 1979-06-15 1981-01-06 Hitachi Ltd Non-electrolytic copper plating solution
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4975426A (enExample) * 1972-11-24 1974-07-22
JPS56271A (en) * 1979-06-15 1981-01-06 Hitachi Ltd Non-electrolytic copper plating solution
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100483111B1 (ko) * 2001-04-24 2005-04-14 가부시키가이샤 무라타 세이사쿠쇼 무전해 구리 도금 용액 및 고주파 전자 부품
DE10218077B4 (de) * 2001-04-24 2007-01-25 Murata Manufacturing Co. Ltd. Verfahren zum Aufbringen einer Kupferplattierungsschicht auf einem dielektrischen keramischen Substrat

Also Published As

Publication number Publication date
JPH0137477B2 (enExample) 1989-08-07

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