JPS57188838A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS57188838A
JPS57188838A JP56074026A JP7402681A JPS57188838A JP S57188838 A JPS57188838 A JP S57188838A JP 56074026 A JP56074026 A JP 56074026A JP 7402681 A JP7402681 A JP 7402681A JP S57188838 A JPS57188838 A JP S57188838A
Authority
JP
Japan
Prior art keywords
electrode
arm
capillary
bonding
sample hold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56074026A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6229895B2 (cs
Inventor
Kazuo Sugiura
Minoru Torihata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56074026A priority Critical patent/JPS57188838A/ja
Publication of JPS57188838A publication Critical patent/JPS57188838A/ja
Publication of JPS6229895B2 publication Critical patent/JPS6229895B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56074026A 1981-05-15 1981-05-15 Wire bonding device Granted JPS57188838A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56074026A JPS57188838A (en) 1981-05-15 1981-05-15 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56074026A JPS57188838A (en) 1981-05-15 1981-05-15 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS57188838A true JPS57188838A (en) 1982-11-19
JPS6229895B2 JPS6229895B2 (cs) 1987-06-29

Family

ID=13535198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56074026A Granted JPS57188838A (en) 1981-05-15 1981-05-15 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS57188838A (cs)

Also Published As

Publication number Publication date
JPS6229895B2 (cs) 1987-06-29

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