JPS55158641A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55158641A
JPS55158641A JP6553679A JP6553679A JPS55158641A JP S55158641 A JPS55158641 A JP S55158641A JP 6553679 A JP6553679 A JP 6553679A JP 6553679 A JP6553679 A JP 6553679A JP S55158641 A JPS55158641 A JP S55158641A
Authority
JP
Japan
Prior art keywords
pellet
enclosing
instrument
penetrated
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6553679A
Other languages
Japanese (ja)
Inventor
Toshinobu Sekiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6553679A priority Critical patent/JPS55158641A/en
Publication of JPS55158641A publication Critical patent/JPS55158641A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable the enlargement of a semiconductor pellet housed by a mechanism wherein a relaying tube is mounted into an enclosing instrument and wires bonded with an electrode disposed to the pellet are collectively extracted when the pellet is housed in the enclosing instrument and the wires are extracted outisde the enclosing instrument. CONSTITUTION:A semiconductor pellet 1 is fastened onto a base portion 4c of an enclosing instrument through a solder material 3, and an upper body 10 of the enclosing instrument, whose ceiling is provided with an electric insulating member 8, is glued to an edge portion of the base portion 4c by using a flange 9 mounted to the lower end. A semiconductor device is constituted in this way, and a plurality of leads bonded with an electrode of the pellet 1 are penetrated through the member 8 and extracted outside the enclosing instrument, but this method is as follows. That is, a wire 2b connected to the base is penetrated through the member 8 and connected to an extracting terminal 4b, and other wires 12e'-12e''' connected to an emitter are collectively bonded with a side surface of the cylindrical relaying tube 16 in iron, etc. erected onto the base portion 4c through a ceramic plate 5, penetrated through the member 8 and connected to a terminal 4e.
JP6553679A 1979-05-29 1979-05-29 Semiconductor device Pending JPS55158641A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6553679A JPS55158641A (en) 1979-05-29 1979-05-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6553679A JPS55158641A (en) 1979-05-29 1979-05-29 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS55158641A true JPS55158641A (en) 1980-12-10

Family

ID=13289826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6553679A Pending JPS55158641A (en) 1979-05-29 1979-05-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55158641A (en)

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