JPS55158641A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS55158641A JPS55158641A JP6553679A JP6553679A JPS55158641A JP S55158641 A JPS55158641 A JP S55158641A JP 6553679 A JP6553679 A JP 6553679A JP 6553679 A JP6553679 A JP 6553679A JP S55158641 A JPS55158641 A JP S55158641A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- enclosing
- instrument
- penetrated
- wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To enable the enlargement of a semiconductor pellet housed by a mechanism wherein a relaying tube is mounted into an enclosing instrument and wires bonded with an electrode disposed to the pellet are collectively extracted when the pellet is housed in the enclosing instrument and the wires are extracted outisde the enclosing instrument. CONSTITUTION:A semiconductor pellet 1 is fastened onto a base portion 4c of an enclosing instrument through a solder material 3, and an upper body 10 of the enclosing instrument, whose ceiling is provided with an electric insulating member 8, is glued to an edge portion of the base portion 4c by using a flange 9 mounted to the lower end. A semiconductor device is constituted in this way, and a plurality of leads bonded with an electrode of the pellet 1 are penetrated through the member 8 and extracted outside the enclosing instrument, but this method is as follows. That is, a wire 2b connected to the base is penetrated through the member 8 and connected to an extracting terminal 4b, and other wires 12e'-12e''' connected to an emitter are collectively bonded with a side surface of the cylindrical relaying tube 16 in iron, etc. erected onto the base portion 4c through a ceramic plate 5, penetrated through the member 8 and connected to a terminal 4e.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6553679A JPS55158641A (en) | 1979-05-29 | 1979-05-29 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6553679A JPS55158641A (en) | 1979-05-29 | 1979-05-29 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55158641A true JPS55158641A (en) | 1980-12-10 |
Family
ID=13289826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6553679A Pending JPS55158641A (en) | 1979-05-29 | 1979-05-29 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55158641A (en) |
-
1979
- 1979-05-29 JP JP6553679A patent/JPS55158641A/en active Pending
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