JPS56165348A - Manufacturing apparatus for semiconductor device - Google Patents

Manufacturing apparatus for semiconductor device

Info

Publication number
JPS56165348A
JPS56165348A JP6896180A JP6896180A JPS56165348A JP S56165348 A JPS56165348 A JP S56165348A JP 6896180 A JP6896180 A JP 6896180A JP 6896180 A JP6896180 A JP 6896180A JP S56165348 A JPS56165348 A JP S56165348A
Authority
JP
Japan
Prior art keywords
lead frame
base
semiconductor device
moved downward
upper base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6896180A
Other languages
Japanese (ja)
Inventor
Shunichiro Fujioka
Shunei Uematsu
Katsuhiro Tabata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6896180A priority Critical patent/JPS56165348A/en
Publication of JPS56165348A publication Critical patent/JPS56165348A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To decrease force functioning to a flat lead frame by mounting a roller to a contacting surface of an upper base with the lead frame when a semiconductor device to which the lead frame is welded is placed on a lower base, the upper base is moved downward and contacted with the lead frame and the lead frame is bent and formed. CONSTITUTION:A semiconductor pellet 2 glued onto a ceramic base 3 and a semiconductor device 10 welded onto a lead frame under a flat condition are set onto a lower base 5, and an upper base 6 is moved downward. A pair of rollers 9 mounted to the upper base 6 are contacted with the lead frame 1 from an upper section at that time. When the rollers are further moved downward, they bend the lead frame downward while rolling, and bend form the lead frame in a shape being along the lower base 5. Thus, the bending and forming of the lead frame, which cause no glass clack and exfoliation, can be conducted, and reliability is increased.
JP6896180A 1980-05-26 1980-05-26 Manufacturing apparatus for semiconductor device Pending JPS56165348A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6896180A JPS56165348A (en) 1980-05-26 1980-05-26 Manufacturing apparatus for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6896180A JPS56165348A (en) 1980-05-26 1980-05-26 Manufacturing apparatus for semiconductor device

Publications (1)

Publication Number Publication Date
JPS56165348A true JPS56165348A (en) 1981-12-18

Family

ID=13388776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6896180A Pending JPS56165348A (en) 1980-05-26 1980-05-26 Manufacturing apparatus for semiconductor device

Country Status (1)

Country Link
JP (1) JPS56165348A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59154053A (en) * 1983-02-22 1984-09-03 Takeshi Amakawa Lead bending method in semiconductor form and device therefor
JPH0258857A (en) * 1988-08-25 1990-02-28 Fujitsu Miyagi Electron:Kk Cut-shaping die

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102670A (en) * 1977-02-21 1978-09-07 Hitachi Ltd Lead bending method for glass ceramic package type semiconductor device
JPS5469066A (en) * 1977-11-14 1979-06-02 Hitachi Ltd Method and apparatus for lead formation

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102670A (en) * 1977-02-21 1978-09-07 Hitachi Ltd Lead bending method for glass ceramic package type semiconductor device
JPS5469066A (en) * 1977-11-14 1979-06-02 Hitachi Ltd Method and apparatus for lead formation

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59154053A (en) * 1983-02-22 1984-09-03 Takeshi Amakawa Lead bending method in semiconductor form and device therefor
JPS6348431B2 (en) * 1983-02-22 1988-09-29 Takeshi Amakawa
JPH0258857A (en) * 1988-08-25 1990-02-28 Fujitsu Miyagi Electron:Kk Cut-shaping die

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