JPS57192056A - Method for forming lead - Google Patents

Method for forming lead

Info

Publication number
JPS57192056A
JPS57192056A JP7654281A JP7654281A JPS57192056A JP S57192056 A JPS57192056 A JP S57192056A JP 7654281 A JP7654281 A JP 7654281A JP 7654281 A JP7654281 A JP 7654281A JP S57192056 A JPS57192056 A JP S57192056A
Authority
JP
Japan
Prior art keywords
lead
leads
die
punch
moved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7654281A
Other languages
Japanese (ja)
Inventor
Katsuhiro Tabata
Masakazu Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7654281A priority Critical patent/JPS57192056A/en
Publication of JPS57192056A publication Critical patent/JPS57192056A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To form the leads so that the size between both leads becomes constant, by once completing a semiconductor, and thereafter reforming the leads to the desired final shape. CONSTITUTION:The semiconductor device 2 is mounted on a reforming die. When a punch 11 is moved to the direction of the die together with a lead pusher 13, a lower edge part 21 of a lead pushing surface 19 contacts with the outer surface of the lead 4 at first. The lead 4 is held between the lower edge part 21 and a lead contact part 23 of the die. Under this state, the punch 11 is moved in the direction of the die. The lead 4 is bent at a bending part 6 so that the tip 7 is slightly directed toward the inside. Then the lead 4 on the other side is reformed. Since the leads 4 on both sides are sequentially reformed one by one, the stress applied to the lead is alleviated.
JP7654281A 1981-05-22 1981-05-22 Method for forming lead Pending JPS57192056A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7654281A JPS57192056A (en) 1981-05-22 1981-05-22 Method for forming lead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7654281A JPS57192056A (en) 1981-05-22 1981-05-22 Method for forming lead

Publications (1)

Publication Number Publication Date
JPS57192056A true JPS57192056A (en) 1982-11-26

Family

ID=13608149

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7654281A Pending JPS57192056A (en) 1981-05-22 1981-05-22 Method for forming lead

Country Status (1)

Country Link
JP (1) JPS57192056A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6089947A (en) * 1983-10-24 1985-05-20 Meisho Kk Lead wire forming apparatus for integrated circuit element
JPH0692102A (en) * 1992-09-14 1994-04-05 Etoo Kk Receiving pan for caster

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6089947A (en) * 1983-10-24 1985-05-20 Meisho Kk Lead wire forming apparatus for integrated circuit element
JPH0692102A (en) * 1992-09-14 1994-04-05 Etoo Kk Receiving pan for caster

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