JPS57172754A - Hermetically sealing method for container of semiconductor substrate - Google Patents
Hermetically sealing method for container of semiconductor substrateInfo
- Publication number
- JPS57172754A JPS57172754A JP16666581A JP16666581A JPS57172754A JP S57172754 A JPS57172754 A JP S57172754A JP 16666581 A JP16666581 A JP 16666581A JP 16666581 A JP16666581 A JP 16666581A JP S57172754 A JPS57172754 A JP S57172754A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- container
- cap
- air cylinder
- rolling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title 1
- 238000005096 rolling process Methods 0.000 abstract 4
- 238000003466 welding Methods 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16666581A JPS57172754A (en) | 1981-10-19 | 1981-10-19 | Hermetically sealing method for container of semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16666581A JPS57172754A (en) | 1981-10-19 | 1981-10-19 | Hermetically sealing method for container of semiconductor substrate |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13086876A Division JPS5355974A (en) | 1976-10-29 | 1976-10-29 | Airtight sealing method for semiconductor device container |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57172754A true JPS57172754A (en) | 1982-10-23 |
Family
ID=15835455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16666581A Pending JPS57172754A (en) | 1981-10-19 | 1981-10-19 | Hermetically sealing method for container of semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57172754A (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0661738A1 (en) * | 1993-12-30 | 1995-07-05 | Nec Corporation | Cavity down mounting seam welding ceramic package for semiconducteur device |
-
1981
- 1981-10-19 JP JP16666581A patent/JPS57172754A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0661738A1 (en) * | 1993-12-30 | 1995-07-05 | Nec Corporation | Cavity down mounting seam welding ceramic package for semiconducteur device |
| US5527992A (en) * | 1993-12-30 | 1996-06-18 | Nec Corporation | Cavity down mounting seam-welding ceramic package for semiconductor device |
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