JPS54126469A - Hermetical sealing method of vessel for semiconductor device - Google Patents
Hermetical sealing method of vessel for semiconductor deviceInfo
- Publication number
- JPS54126469A JPS54126469A JP3429678A JP3429678A JPS54126469A JP S54126469 A JPS54126469 A JP S54126469A JP 3429678 A JP3429678 A JP 3429678A JP 3429678 A JP3429678 A JP 3429678A JP S54126469 A JPS54126469 A JP S54126469A
- Authority
- JP
- Japan
- Prior art keywords
- side face
- vessel
- seal ring
- cover
- seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
- Sealing Battery Cases Or Jackets (AREA)
Abstract
PURPOSE:To flow electricity across a pair of cylindrical roller electrodes to seal a semiconductor vessel hermetically by resistance welding by rotating the semiconductor vessel while bringing the outside diameter part of the electrodes above into contact with the side face of a cap which is put on a seal frame. CONSTITUTION:When semiconductor vessel 22 is put on rotary stand 21 and cover 27 is covered and a switch is turned on, load 28 descends to stop the vover, and roller electrodes 29 move together with welding head 26 from the left and the right toward the side face of cover 24 and the side face of seal ring 23. When a fixed load is obtained, rotary stand 21 starts rotation to weld the cover side face and the seal ring side face by a low-voltage large current. As regards the seal ring of the vessel, a metallic plate of approximately 0.1mm is pressed and is subjected to Ag-Cu soldering. The cover side face and the seal ring side face are brought into contact with roller electrodes orthogonally at any angle of vessel rotation and are welded uniformly. Then, since load 28 absorbs heat, the cover is prevented cmpletely from being burnt; and since the thermal expansion dependent upon generated heat is absorbed by the wall part of the seal ring and is not given to the soldering part, airtightness is improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3429678A JPS54126469A (en) | 1978-03-24 | 1978-03-24 | Hermetical sealing method of vessel for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3429678A JPS54126469A (en) | 1978-03-24 | 1978-03-24 | Hermetical sealing method of vessel for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54126469A true JPS54126469A (en) | 1979-10-01 |
| JPS6140134B2 JPS6140134B2 (en) | 1986-09-08 |
Family
ID=12410186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3429678A Granted JPS54126469A (en) | 1978-03-24 | 1978-03-24 | Hermetical sealing method of vessel for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54126469A (en) |
-
1978
- 1978-03-24 JP JP3429678A patent/JPS54126469A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6140134B2 (en) | 1986-09-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040615 |
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| A601 | Written request for extension of time |
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| A602 | Written permission of extension of time |
Effective date: 20041018 Free format text: JAPANESE INTERMEDIATE CODE: A602 |
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| A521 | Written amendment |
Effective date: 20041202 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
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| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20050125 |
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| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20050214 |
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| R150 | Certificate of patent (=grant) or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
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| LAPS | Cancellation because of no payment of annual fees |