JPS54126469A - Hermetical sealing method of vessel for semiconductor device - Google Patents

Hermetical sealing method of vessel for semiconductor device

Info

Publication number
JPS54126469A
JPS54126469A JP3429678A JP3429678A JPS54126469A JP S54126469 A JPS54126469 A JP S54126469A JP 3429678 A JP3429678 A JP 3429678A JP 3429678 A JP3429678 A JP 3429678A JP S54126469 A JPS54126469 A JP S54126469A
Authority
JP
Japan
Prior art keywords
side face
vessel
seal ring
cover
seal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3429678A
Other languages
Japanese (ja)
Other versions
JPS6140134B2 (en
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3429678A priority Critical patent/JPS54126469A/en
Publication of JPS54126469A publication Critical patent/JPS54126469A/en
Publication of JPS6140134B2 publication Critical patent/JPS6140134B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Sealing Battery Cases Or Jackets (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To flow electricity across a pair of cylindrical roller electrodes to seal a semiconductor vessel hermetically by resistance welding by rotating the semiconductor vessel while bringing the outside diameter part of the electrodes above into contact with the side face of a cap which is put on a seal frame. CONSTITUTION:When semiconductor vessel 22 is put on rotary stand 21 and cover 27 is covered and a switch is turned on, load 28 descends to stop the vover, and roller electrodes 29 move together with welding head 26 from the left and the right toward the side face of cover 24 and the side face of seal ring 23. When a fixed load is obtained, rotary stand 21 starts rotation to weld the cover side face and the seal ring side face by a low-voltage large current. As regards the seal ring of the vessel, a metallic plate of approximately 0.1mm is pressed and is subjected to Ag-Cu soldering. The cover side face and the seal ring side face are brought into contact with roller electrodes orthogonally at any angle of vessel rotation and are welded uniformly. Then, since load 28 absorbs heat, the cover is prevented cmpletely from being burnt; and since the thermal expansion dependent upon generated heat is absorbed by the wall part of the seal ring and is not given to the soldering part, airtightness is improved.
JP3429678A 1978-03-24 1978-03-24 Hermetical sealing method of vessel for semiconductor device Granted JPS54126469A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3429678A JPS54126469A (en) 1978-03-24 1978-03-24 Hermetical sealing method of vessel for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3429678A JPS54126469A (en) 1978-03-24 1978-03-24 Hermetical sealing method of vessel for semiconductor device

Publications (2)

Publication Number Publication Date
JPS54126469A true JPS54126469A (en) 1979-10-01
JPS6140134B2 JPS6140134B2 (en) 1986-09-08

Family

ID=12410186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3429678A Granted JPS54126469A (en) 1978-03-24 1978-03-24 Hermetical sealing method of vessel for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54126469A (en)

Also Published As

Publication number Publication date
JPS6140134B2 (en) 1986-09-08

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