JPS57167636A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS57167636A JPS57167636A JP56035023A JP3502381A JPS57167636A JP S57167636 A JPS57167636 A JP S57167636A JP 56035023 A JP56035023 A JP 56035023A JP 3502381 A JP3502381 A JP 3502381A JP S57167636 A JPS57167636 A JP S57167636A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- substrate
- heat treatment
- defect
- nuclei
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10P95/90—
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Recrystallisation Techniques (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56035023A JPS57167636A (en) | 1981-03-11 | 1981-03-11 | Manufacture of semiconductor device |
| DE8282301212T DE3280219D1 (de) | 1981-03-11 | 1982-03-10 | Verfahren zur herstellung einer halbleiteranordnung mit ausgluehen eines halbleiterkoerpers. |
| EP82301212A EP0060676B1 (en) | 1981-03-11 | 1982-03-10 | A method for the production of a semiconductor device comprising annealing a silicon wafer |
| IE559/82A IE55966B1 (en) | 1981-03-11 | 1982-03-11 | A method for the production of a semiconductor device comprising annealing a silicon wafer |
| US06/598,544 US4597804A (en) | 1981-03-11 | 1984-04-12 | Methods of forming denuded zone in wafer by intrinsic gettering and forming bipolar transistor therein |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56035023A JPS57167636A (en) | 1981-03-11 | 1981-03-11 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57167636A true JPS57167636A (en) | 1982-10-15 |
| JPS6216538B2 JPS6216538B2 (cg-RX-API-DMAC10.html) | 1987-04-13 |
Family
ID=12430454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56035023A Granted JPS57167636A (en) | 1981-03-11 | 1981-03-11 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57167636A (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58171826A (ja) * | 1982-03-26 | 1983-10-08 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 酸素析出物粒子の密度及び分布の調整方法 |
| JPH01312840A (ja) * | 1988-06-10 | 1989-12-18 | Fujitsu Ltd | 半導体装置の製造方法 |
-
1981
- 1981-03-11 JP JP56035023A patent/JPS57167636A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58171826A (ja) * | 1982-03-26 | 1983-10-08 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 酸素析出物粒子の密度及び分布の調整方法 |
| JPH01312840A (ja) * | 1988-06-10 | 1989-12-18 | Fujitsu Ltd | 半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6216538B2 (cg-RX-API-DMAC10.html) | 1987-04-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE465510T1 (de) | Verfahren zur behandlung eines sauerstoff enthaltenden halbleiterwafers und halbleiterbauelement | |
| IL156179A0 (en) | Method for thermally treating substrates | |
| JPS5669837A (en) | Manufacture of semiconductor device | |
| JPS57167636A (en) | Manufacture of semiconductor device | |
| JPS5717125A (en) | Manufacture of semiconductor device | |
| JPS54136274A (en) | Semiconductor device | |
| JPS57202729A (en) | Manufacture of semiconductor device | |
| JPS567436A (en) | High pressure treating device | |
| JPS57167637A (en) | Manufacture of semiconductor device | |
| JPS5568638A (en) | Treating method of semiconductor surface with heat | |
| JPS54125966A (en) | Defect elimination method for semiconductor wafer | |
| JPS5632304A (en) | Metal oxide film forming method | |
| JPS5788736A (en) | Preparation of semiconductor device | |
| JPS59168642A (ja) | 半導体基板の酸化装置 | |
| JPS57167638A (en) | Manufacture of semiconductor device | |
| JPS5443679A (en) | Thermal oxidation method of semiconductor device | |
| JPS57136333A (en) | Manufacture of semiconductor device | |
| JPH01220431A (ja) | レーザ表面処理方法 | |
| JPS57167635A (en) | Manufacture of semiconductor device | |
| JPS57117245A (en) | Manufacture of semiconductor substrate | |
| JPS61151099A (ja) | GaAs単結晶の調質方法 | |
| JPS6117489A (ja) | シリコン単結晶の製造方法 | |
| JPS57164532A (en) | Gettering method | |
| JPS6412537A (en) | Formation of defective layer in semiconductor substrate | |
| JPH021119B2 (cg-RX-API-DMAC10.html) |