JPS57117245A - Manufacture of semiconductor substrate - Google Patents
Manufacture of semiconductor substrateInfo
- Publication number
- JPS57117245A JPS57117245A JP298981A JP298981A JPS57117245A JP S57117245 A JPS57117245 A JP S57117245A JP 298981 A JP298981 A JP 298981A JP 298981 A JP298981 A JP 298981A JP S57117245 A JPS57117245 A JP S57117245A
- Authority
- JP
- Japan
- Prior art keywords
- defect
- heat treatment
- forming
- layer
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Abstract
PURPOSE:To prevent the creation of pin holes in oxidation process by forming a defect layer inside and a non-defect layer on the surface by a high temperature heat treatment in a nitrogen atmosphere after forming a oxide layer of 850- 1,200Angstrom on the surface of a single crystal silicon substrate. CONSTITUTION:Crystal defect nucleous is created by a low temperature (600- 800 deg.C) heat treatment in the oxygen atmosphere on a single crystal silicon substrate 11. An oxide film 12 is formed by heat oxidation in an oxygen atmosphere at 1,000 deg.C. A heat treatment in the nitrogen atmosphere at 1,050-1,150 deg.C for 6-8hr is performed. The nucleous of crystal defect is grown in the crystal defect forming a defect layer 13 inside a substrate 11 and a non-defect layers 14, 15 are formed on the surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP298981A JPS57117245A (en) | 1981-01-12 | 1981-01-12 | Manufacture of semiconductor substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP298981A JPS57117245A (en) | 1981-01-12 | 1981-01-12 | Manufacture of semiconductor substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57117245A true JPS57117245A (en) | 1982-07-21 |
Family
ID=11544779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP298981A Pending JPS57117245A (en) | 1981-01-12 | 1981-01-12 | Manufacture of semiconductor substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57117245A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60133734A (en) * | 1983-12-21 | 1985-07-16 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
-
1981
- 1981-01-12 JP JP298981A patent/JPS57117245A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60133734A (en) * | 1983-12-21 | 1985-07-16 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
JPH026223B2 (en) * | 1983-12-21 | 1990-02-08 | Mitsubishi Electric Corp |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS56161646A (en) | Manufacture of semiconductor device | |
JPS57117245A (en) | Manufacture of semiconductor substrate | |
JPS5717125A (en) | Manufacture of semiconductor device | |
JPS5688317A (en) | Manufacture of semiconductor device | |
JPS5737830A (en) | Manufacture of semiconductor device | |
JPS5421265A (en) | Forming method of semiconductor oxide film | |
JPS571226A (en) | Manufacture of semiconductor substrate with buried diffusion layer | |
JPS55157241A (en) | Manufacture of semiconductor device | |
JPS56167335A (en) | Manufacture of semiconductor device | |
JPS5633840A (en) | Manufacture of semiconductor device | |
JPS6453414A (en) | Diffusion of impurity | |
JPS5443679A (en) | Thermal oxidation method of semiconductor device | |
JPS647518A (en) | Manufacture of semiconductor device | |
JPS6457521A (en) | Manufacture of superconducting thin film | |
JPS648615A (en) | Manufacture of semiconductor device | |
JPS57194524A (en) | Manufacture of semiconductor device | |
SU1371456A1 (en) | A METHOD FOR CREATING THIN LAYERS OF SILICON OXIDE | |
JPS56146254A (en) | Manufacture of semiconductor device | |
JPS5779641A (en) | Manufacture of semiconductor device | |
JPS62266831A (en) | Formation of pattern for mask alignment | |
JPS6435929A (en) | Manufacture of semiconductor device | |
JPS57147273A (en) | Manufacture of semiconductor device | |
JPS51147250A (en) | Treatment method of semiconductor substrate | |
JPS6469064A (en) | Manufacture of oxide superconducting wiring | |
JPS53143184A (en) | Production of semiconductor integrated circuit |