JPS57164529A - Dry etching method - Google Patents

Dry etching method

Info

Publication number
JPS57164529A
JPS57164529A JP4926681A JP4926681A JPS57164529A JP S57164529 A JPS57164529 A JP S57164529A JP 4926681 A JP4926681 A JP 4926681A JP 4926681 A JP4926681 A JP 4926681A JP S57164529 A JPS57164529 A JP S57164529A
Authority
JP
Japan
Prior art keywords
etching
flow amount
parallel flat
gas
gas flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4926681A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0160939B2 (enrdf_load_stackoverflow
Inventor
Jun Kanamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP4926681A priority Critical patent/JPS57164529A/ja
Publication of JPS57164529A publication Critical patent/JPS57164529A/ja
Publication of JPH0160939B2 publication Critical patent/JPH0160939B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
JP4926681A 1981-04-03 1981-04-03 Dry etching method Granted JPS57164529A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4926681A JPS57164529A (en) 1981-04-03 1981-04-03 Dry etching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4926681A JPS57164529A (en) 1981-04-03 1981-04-03 Dry etching method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP1638289A Division JPH01230238A (ja) 1989-01-27 1989-01-27 ドライエッチング方法

Publications (2)

Publication Number Publication Date
JPS57164529A true JPS57164529A (en) 1982-10-09
JPH0160939B2 JPH0160939B2 (enrdf_load_stackoverflow) 1989-12-26

Family

ID=12826023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4926681A Granted JPS57164529A (en) 1981-04-03 1981-04-03 Dry etching method

Country Status (1)

Country Link
JP (1) JPS57164529A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61256724A (ja) * 1985-05-06 1986-11-14 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション プラズマ・エツチ開孔のプロフイルを制御する方法
US7074724B2 (en) * 2000-04-27 2006-07-11 Micron Technology, Inc. Etchant and method of use

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5137108A (en) * 1989-12-28 1992-08-11 Aar Corporation Vehicle engine mounting system

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5480685A (en) * 1977-12-09 1979-06-27 Chiyou Uru Esu Ai Gijiyutsu Ke Dry etching method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5480685A (en) * 1977-12-09 1979-06-27 Chiyou Uru Esu Ai Gijiyutsu Ke Dry etching method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61256724A (ja) * 1985-05-06 1986-11-14 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション プラズマ・エツチ開孔のプロフイルを制御する方法
US7074724B2 (en) * 2000-04-27 2006-07-11 Micron Technology, Inc. Etchant and method of use

Also Published As

Publication number Publication date
JPH0160939B2 (enrdf_load_stackoverflow) 1989-12-26

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