JPS57155753A - Sealing resin compound for semiconductor - Google Patents

Sealing resin compound for semiconductor

Info

Publication number
JPS57155753A
JPS57155753A JP56041456A JP4145681A JPS57155753A JP S57155753 A JPS57155753 A JP S57155753A JP 56041456 A JP56041456 A JP 56041456A JP 4145681 A JP4145681 A JP 4145681A JP S57155753 A JPS57155753 A JP S57155753A
Authority
JP
Japan
Prior art keywords
semiconductor
compound
sealing resin
agent
resin compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56041456A
Other languages
Japanese (ja)
Inventor
Kunihito Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56041456A priority Critical patent/JPS57155753A/en
Publication of JPS57155753A publication Critical patent/JPS57155753A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To obtain a compound suitable for sealing a member including aluminum by a sealing resin compound for semiconductor obtained by compounding a silane coupling agent and thermosetting resin. CONSTITUTION:A sealing resin compound for semiconductor is obtained by compounding a silane coupling agent expressed in a predetermined general formula, for example, an agent previously reacted vinyl trioxysilane under a reaction accelerator and thermosetting resin, for example, an agent previously reacted epoxy resin under a hardening agent. This compound serves as dampproofing and anticorrosion for a semiconductor device including Al in a member.
JP56041456A 1981-03-20 1981-03-20 Sealing resin compound for semiconductor Pending JPS57155753A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56041456A JPS57155753A (en) 1981-03-20 1981-03-20 Sealing resin compound for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56041456A JPS57155753A (en) 1981-03-20 1981-03-20 Sealing resin compound for semiconductor

Publications (1)

Publication Number Publication Date
JPS57155753A true JPS57155753A (en) 1982-09-25

Family

ID=12608869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56041456A Pending JPS57155753A (en) 1981-03-20 1981-03-20 Sealing resin compound for semiconductor

Country Status (1)

Country Link
JP (1) JPS57155753A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6182438A (en) * 1984-09-29 1986-04-26 Nitto Electric Ind Co Ltd Manufacture of semiconductor device
JPS61123619A (en) * 1984-11-20 1986-06-11 Matsushita Electric Ind Co Ltd Resin composition
JPS61123620A (en) * 1984-11-20 1986-06-11 Matsushita Electric Ind Co Ltd Resin composition
JPH02218734A (en) * 1989-02-20 1990-08-31 Toray Ind Inc Epoxy composition
JPH02218735A (en) * 1989-02-20 1990-08-31 Toray Ind Inc Epoxy resin composition
US5476884A (en) * 1989-02-20 1995-12-19 Toray Industries, Inc. Semiconductor device-encapsulating epoxy resin composition containing secondary amino functional coupling agents
JPH08239453A (en) * 1996-03-11 1996-09-17 Nitto Denko Corp Semiconductor device
JPH08253553A (en) * 1996-04-22 1996-10-01 Nitto Denko Corp Production of epoxy resin composition for semiconductor sealing
JP2005162846A (en) * 2003-12-02 2005-06-23 Nitto Denko Corp Resin composition for sealing semiconductor and semiconductor device using the same

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6182438A (en) * 1984-09-29 1986-04-26 Nitto Electric Ind Co Ltd Manufacture of semiconductor device
JPS61123619A (en) * 1984-11-20 1986-06-11 Matsushita Electric Ind Co Ltd Resin composition
JPS61123620A (en) * 1984-11-20 1986-06-11 Matsushita Electric Ind Co Ltd Resin composition
JPS6317851B2 (en) * 1984-11-20 1988-04-15 Matsushita Electric Ind Co Ltd
JPH02218734A (en) * 1989-02-20 1990-08-31 Toray Ind Inc Epoxy composition
JPH02218735A (en) * 1989-02-20 1990-08-31 Toray Ind Inc Epoxy resin composition
US5476884A (en) * 1989-02-20 1995-12-19 Toray Industries, Inc. Semiconductor device-encapsulating epoxy resin composition containing secondary amino functional coupling agents
JPH08239453A (en) * 1996-03-11 1996-09-17 Nitto Denko Corp Semiconductor device
JPH08253553A (en) * 1996-04-22 1996-10-01 Nitto Denko Corp Production of epoxy resin composition for semiconductor sealing
JP2005162846A (en) * 2003-12-02 2005-06-23 Nitto Denko Corp Resin composition for sealing semiconductor and semiconductor device using the same

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