JPS55153358A - Manufacturing method of resin sealed semiconductor device - Google Patents
Manufacturing method of resin sealed semiconductor deviceInfo
- Publication number
- JPS55153358A JPS55153358A JP6037979A JP6037979A JPS55153358A JP S55153358 A JPS55153358 A JP S55153358A JP 6037979 A JP6037979 A JP 6037979A JP 6037979 A JP6037979 A JP 6037979A JP S55153358 A JPS55153358 A JP S55153358A
- Authority
- JP
- Japan
- Prior art keywords
- metathetic
- tetra
- epoxy resin
- borate
- silane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title abstract 3
- 239000011347 resin Substances 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000003822 epoxy resin Substances 0.000 abstract 5
- 229920000647 polyepoxide Polymers 0.000 abstract 5
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 abstract 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 3
- 229920003986 novolac Polymers 0.000 abstract 3
- 239000000126 substance Substances 0.000 abstract 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 abstract 2
- 229910000077 silane Inorganic materials 0.000 abstract 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 abstract 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 abstract 1
- 239000006087 Silane Coupling Agent Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000007822 coupling agent Substances 0.000 abstract 1
- 229930003836 cresol Natural products 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 125000000466 oxiranyl group Chemical group 0.000 abstract 1
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To heighten the dampproof property by using a specific epoxy resin, a phenol novolak resin and a tetra metathetic phosphonium/tetra metathetic borate or the like as the epoxy resin component substance for semiconductor sealing, and also by specifying coupling agents to be added. CONSTITUTION:As the epoxy resin component substances to be used for moulding and hardening a semiconductor device, the following component substances are used. They are, as an epoxy resin, a cresol novolak type epoxy resin with more then two oxirane rings in a molecule is used and as a hardener, a phenol novolak type resin with more than two hydroxyl radicals in a molecule, a tetra metathetic phosphonium/tetra metathetic borate, a tetra metathetic ammonium/tetra metathetic borate or the like and chemical compounds of various imidazole kinds are used. Further, as a silane coupling agent, the mixture of epoxy silane of a ratio 1 and mercaptan silane of a ratio 0.01-1 is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6037979A JPS5942984B2 (en) | 1979-05-18 | 1979-05-18 | Manufacturing method for resin-sealed semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6037979A JPS5942984B2 (en) | 1979-05-18 | 1979-05-18 | Manufacturing method for resin-sealed semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55153358A true JPS55153358A (en) | 1980-11-29 |
| JPS5942984B2 JPS5942984B2 (en) | 1984-10-18 |
Family
ID=13140439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6037979A Expired JPS5942984B2 (en) | 1979-05-18 | 1979-05-18 | Manufacturing method for resin-sealed semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5942984B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61204954A (en) * | 1985-03-08 | 1986-09-11 | Hitachi Ltd | Resin sealed type semiconductor device |
| WO2020080115A1 (en) * | 2018-10-15 | 2020-04-23 | パナソニックＩｐマネジメント株式会社 | Sealing resin composition and semiconductor package |
-
1979
- 1979-05-18 JP JP6037979A patent/JPS5942984B2/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61204954A (en) * | 1985-03-08 | 1986-09-11 | Hitachi Ltd | Resin sealed type semiconductor device |
| JPH0576490B2 (en) * | 1985-03-08 | 1993-10-22 | Hitachi Ltd | |
| WO2020080115A1 (en) * | 2018-10-15 | 2020-04-23 | パナソニックＩｐマネジメント株式会社 | Sealing resin composition and semiconductor package |
| JP2020063338A (en) * | 2018-10-15 | 2020-04-23 | パナソニックＩｐマネジメント株式会社 | Resin composition for encapsulation and semiconductor package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5942984B2 (en) | 1984-10-18 |
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