JPS6317851B2 - - Google Patents
Info
- Publication number
- JPS6317851B2 JPS6317851B2 JP59245208A JP24520884A JPS6317851B2 JP S6317851 B2 JPS6317851 B2 JP S6317851B2 JP 59245208 A JP59245208 A JP 59245208A JP 24520884 A JP24520884 A JP 24520884A JP S6317851 B2 JPS6317851 B2 JP S6317851B2
- Authority
- JP
- Japan
- Prior art keywords
- curing
- resin
- moisture
- adhesion
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011342 resin composition Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000007822 coupling agent Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 5
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 2
- AKUGPKHOAALNSY-UHFFFAOYSA-N n-(2-aminoethoxy)-3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCNOCCN AKUGPKHOAALNSY-UHFFFAOYSA-N 0.000 claims description 2
- 238000009413 insulation Methods 0.000 description 11
- 239000010408 film Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000004455 differential thermal analysis Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- YPHMISFOHDHNIV-FSZOTQKASA-N cycloheximide Chemical compound C1[C@@H](C)C[C@H](C)C(=O)[C@@H]1[C@H](O)CC1CC(=O)NC(=O)C1 YPHMISFOHDHNIV-FSZOTQKASA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
Description
産業上の利用分野
本発明は、ラジオ受信機やテレビジヨン受像機
に使用する回路基板の保護皮膜用樹脂組成物に関
するものである。
従来の技術
従来、ラジオ受信機やテレビジヨン受像機を構
成する回路基板の保護皮膜用樹脂組成物は、基板
との密着性及び防湿絶縁性の優れたものが要求さ
れ、エポキシ系樹脂組成物、アクリル系樹脂組成
物、ウレタン系樹脂組成物等が使用されている。
これら保護皮膜用樹脂組成物は、銅張り積層板、
薄膜・厚膜混成集積回路基板に所定の回路導板パ
ターンを形成後、保護皮膜用パターンをスクリー
ン印刷し所定の硬化条件にて硬化を行なつてい
た。通常、硬化は120℃〜200℃の硬化温度で15分
〜２時間を必要としていた。
発明が解決しようとする問題点
従来の樹脂組成物を使用する場合は、少なくと
も15分以上の硬化時間を必要とする為、生産時間
が長くなるという問題があつた。又、従来の樹脂
組成物の硬化時間を短くした場合、例えば200
℃・５分では防湿絶縁性が劣化し実用に適さない
ものであつた。
本発明は、このような問題点を解消するもので
あり、硬化時間を短縮でき、防湿絶縁性にも優れ
た樹脂組成物を提供するものである。
問題点を解決するための手段
本発明の樹脂組成物は、熱硬化型エポキシ樹脂
からなるベース樹脂100重量部に対して、アミノ
シランカツプリング剤を0.2〜３重量部、硬化促
進剤である２−エチル−４−メチルイミダゾール
を0.5〜３重量部の割合で配合したものである。
作 用
本発明の樹脂組成物は、熱硬化型エポキシ樹脂
からなるベース樹脂に回路基板との密着性を良化
させるアミノシランカツプリング剤と硬化反応を
促進させる２−エチル−４−メチルイミダゾール
を所定の割合で添加配合することにより、各々単
独で添加した場合よりも優れた防湿絶縁性を示す
ものである。
実施例
以下、本発明の一実施例を図面と表を参照して
説明する。本実施例では、熱硬化型エポキシ樹脂
からなるベース樹脂、例えば四国化成製Ｃ−
467G、アサヒ化研製CR−20等100重量部に対し
て、アミノシランカツプリング剤、例えばγ−ア
ミノプロピルトリエトキシシラン及びＮ−β−ア
ミノエトキシ−γ−アミノプロピルトリメトキシ
シランを0.2〜３重量部、硬化促進剤２−エチル
−４−メチルイミダゾールを0.5〜３重量部の割
合で添加したものをそれぞれ十分撹拌混合した。
次に第１図に示すセラミツク基板１に銀−パラ
ジウムからなる導体２で0.2mm線幅・間隔のくし
形導体パターンを形成後、その上に樹脂組成物を
スクリーン印刷塗布し、くし形導体パターンを被
い、第１表に示す条件で樹脂組成物３を硬化させ
た。硬化の判定は、作製した試料の硬化樹脂組成
物を示差熱分析にて未反応部の発熱ピークの有無
により行なつた。第２図ａに示されるように硬化
が完全であれば発熱ピークは出現せず、第２図ｂ
に示すように硬化が不十分であれば未硬化に伴な
う発熱ピークが観測された。硬化させた樹脂組成
物と回路基板との密着性は、作製した試料を５時
間水の中で煮沸後JIS Ｄ−0202、８−12の密着性
試験に準じて密着性を調べ、剥離した面積比率に
て判定した。防湿絶縁性は作製した試料を60℃・
90％の高温高湿環境下で30V電圧を印加し、1500
時間後の銀・パラジウム導体から発生した銀マイ
グレーシヨン発生率にて判定した。尚、密着性及
び防湿絶縁性は各添加条件下で示差熱分析結果よ
り、最適の硬化条件のものについて行なつた。
INDUSTRIAL APPLICATION FIELD The present invention relates to a resin composition for a protective film on a circuit board used in radio receivers and television receivers. BACKGROUND ART Conventionally, resin compositions for protective coatings on circuit boards constituting radio receivers and television receivers are required to have excellent adhesion to the substrate and moisture-proof insulation properties, and epoxy resin compositions, Acrylic resin compositions, urethane resin compositions, etc. are used.
These resin compositions for protective coatings are used for copper-clad laminates,
After forming a predetermined circuit conductor pattern on a thin-film/thick-film hybrid integrated circuit board, a pattern for a protective film is screen printed and cured under predetermined curing conditions. Typically, curing required 15 minutes to 2 hours at a curing temperature of 120°C to 200°C. Problems to be Solved by the Invention When conventional resin compositions are used, a curing time of at least 15 minutes is required, resulting in a long production time. In addition, when the curing time of conventional resin compositions is shortened, for example, 200
℃ for 5 minutes, the moisture-proof insulation deteriorated and it was not suitable for practical use. The present invention solves these problems and provides a resin composition that can shorten curing time and has excellent moisture-proof insulation properties. Means for Solving the Problems The resin composition of the present invention contains 0.2 to 3 parts by weight of an aminosilane coupling agent and 2-2-2, which is a curing accelerator, based on 100 parts by weight of a base resin made of a thermosetting epoxy resin. It contains 0.5 to 3 parts by weight of ethyl-4-methylimidazole. Function The resin composition of the present invention contains a base resin made of a thermosetting epoxy resin, an aminosilane coupling agent that improves adhesion to a circuit board, and 2-ethyl-4-methylimidazole that accelerates the curing reaction. By adding and blending them in a ratio of , moisture-proof insulation properties are better than when each is added alone. EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings and tables. In this example, a base resin consisting of a thermosetting epoxy resin, for example C-
467G, Asahi Kaken CR-20, etc., 0.2 to 3 parts by weight of an aminosilane coupling agent, such as γ-aminopropyltriethoxysilane and N-β-aminoethoxy-γ-aminopropyltrimethoxysilane. and 0.5 to 3 parts by weight of the curing accelerator 2-ethyl-4-methylimidazole were mixed with sufficient stirring. Next, a comb-shaped conductor pattern with a line width of 0.2 mm and an interval of 0.2 mm is formed on the ceramic substrate 1 shown in FIG. The resin composition 3 was cured under the conditions shown in Table 1. Curing was determined by differential thermal analysis of the prepared sample cured resin composition by the presence or absence of exothermic peaks in unreacted areas. As shown in Figure 2a, if the curing is complete, no exothermic peak will appear, and Figure 2b
As shown in Figure 2, if curing was insufficient, an exothermic peak was observed due to uncured. The adhesion between the cured resin composition and the circuit board was determined by boiling the prepared sample in water for 5 hours and examining the adhesion according to the adhesion test of JIS D-0202, 8-12. Judgment was made based on the ratio. For moisture-proof insulation, the prepared sample was heated to 60°C.
Applying 30V voltage under 90% high temperature and high humidity environment, 1500
Judgment was made based on the incidence of silver migration generated from the silver/palladium conductor after a period of time. The adhesion and moisture-proof insulation properties were determined based on the results of differential thermal analysis under each addition condition under the optimum curing conditions.
【表】【table】
【表】
第１表から明らかなように、ベース樹脂単独の
保護皮膜（試料番号１）では、密着性及び防湿絶
縁性とも満足すべきものでない。ベース樹脂に２
−エチル−４−メチルイミダゾールを添加した場
合（試料番号２、３）及びアミノシランカツプリ
ング剤を添加した場合（試料番号４、５）は、と
もに防湿絶縁性が不十分である。
本発明の添加配合割合の場合、（試料番号７、
８、11、12）、初めて硬化時間が短く且つ密着性
及び防湿絶縁性とも実用に適したものとなつてい
る。尚、本発明の添加配合割合を外れた樹脂組成
物（試料番号６、９、10、13）では、硬化時間が
長かつたり、密着性及び防湿絶縁性が不十分とな
り実用に適さなくなる。
発明の効果
以上のように本発明の樹脂組成物は、密着性及
び防湿絶縁性に優れており、且つ硬化時間を短縮
できるため生産性が向上し実用上きわめて有利な
ものである。[Table] As is clear from Table 1, the protective film made of base resin alone (Sample No. 1) is not satisfactory in terms of adhesion and moisture-proof insulation. 2 for base resin
-Ethyl-4-methylimidazole was added (sample numbers 2 and 3) and an aminosilane coupling agent was added (sample numbers 4 and 5), both of which had insufficient moisture-proof insulation. In the case of the addition blending ratio of the present invention, (sample number 7,
8, 11, 12), for the first time, the curing time is short and the adhesion and moisture-proof insulation properties are suitable for practical use. It should be noted that resin compositions (sample numbers 6, 9, 10, and 13) that do not meet the additive blending ratio of the present invention take a long time to cure and have insufficient adhesion and moisture-proof insulation properties, making them unsuitable for practical use. Effects of the Invention As described above, the resin composition of the present invention has excellent adhesion and moisture-proof insulation properties, and can shorten curing time, thereby improving productivity and being extremely advantageous in practice.
第１図は、本発明の樹脂組成物を塗布した回路
基板の断面図、第２図ａ，ｂは、樹脂の硬化状態
を示す示差熱分析チヤートである。
３……コーテイング樹脂。
FIG. 1 is a sectional view of a circuit board coated with the resin composition of the present invention, and FIGS. 2a and 2b are differential thermal analysis charts showing the cured state of the resin. 3...Coating resin.
Claims (1)
100重量部に対して、アミノシランカツプリング
剤であるγ−アミノプロピルトリエトキシシラン
及びＮ−β−アミノエトキシ−γ−アミノプロピ
ルトリメトキシシランを0.2〜３重量部、２−エ
チル−４−メチルイミダゾールを0.2〜３重量部
の割合で配合したことを特徴とする樹脂組成物。1 Base resin made of thermosetting epoxy resin
For 100 parts by weight, 0.2 to 3 parts by weight of γ-aminopropyltriethoxysilane and N-β-aminoethoxy-γ-aminopropyltrimethoxysilane, which are aminosilane coupling agents, and 2-ethyl-4-methylimidazole. A resin composition comprising 0.2 to 3 parts by weight of the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24520884A JPS61123620A (en) | 1984-11-20 | 1984-11-20 | Resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24520884A JPS61123620A (en) | 1984-11-20 | 1984-11-20 | Resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61123620A JPS61123620A (en) | 1986-06-11 |
| JPS6317851B2 true JPS6317851B2 (en) | 1988-04-15 |
Family
ID=17130230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24520884A Granted JPS61123620A (en) | 1984-11-20 | 1984-11-20 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61123620A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4877440A (en) * | 1985-05-29 | 1989-10-31 | E. I. Du Pont De Nemours And Company | Thiophenesulfonamide herbicides |
| US8450148B2 (en) | 2006-12-14 | 2013-05-28 | Infineon Technologies, Ag | Molding compound adhesion for map-molded flip-chip |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57155753A (en) * | 1981-03-20 | 1982-09-25 | Mitsubishi Electric Corp | Sealing resin compound for semiconductor |
-
1984
- 1984-11-20 JP JP24520884A patent/JPS61123620A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57155753A (en) * | 1981-03-20 | 1982-09-25 | Mitsubishi Electric Corp | Sealing resin compound for semiconductor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61123620A (en) | 1986-06-11 |
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